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An Image Analysis Technique For Assessing Particle Size And Agglomeration Tendency Of Slurries

Published online by Cambridge University Press:  14 March 2011

Susan R. Machinski ,
Kathleen A. Richardson  and
Aristide Dogariu
Susan R. Machinski
Affiliation:
Department of ChemistryCREOL University of Central Florida, 4000 Central Florida Boulevard Orlando, FL 32816 School of Optics, CREOL University of Central Florida, 4000 Central Florida Boulevard Orlando, FL 32816
Kathleen A. Richardson
Affiliation:
Department of ChemistryCREOL University of Central Florida, 4000 Central Florida Boulevard Orlando, FL 32816 School of Optics, CREOL University of Central Florida, 4000 Central Florida Boulevard Orlando, FL 32816
Aristide Dogariu
Affiliation:
School of Optics, CREOL University of Central Florida, 4000 Central Florida Boulevard Orlando, FL 32816
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Abstract

Understanding the time-dependent behavior and size of particulate systems, specifically, particles in abrasive slurries, is a key part of chemical mechanical polishing (CMP). Microscopy and image analysis enables both qualitative and quantitative analysis of particle interaction behavior in diluted samples of such particulate suspensions. A technique using microscopy and image analysis has been developed specific to the analysis of suspensions of, micron size or larger, abrasive particle slurry systems. This technique has been applied to aluminum oxide (Al2O3) slurries and measurements of particle size and stability have been obtained with good accuracy and precision.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 613: Symposium E – Chemical-Mechanical Polishing 2000 - Fundamentals… , 2000 , E6.1.1
Copyright
Copyright © Materials Research Society 2000

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References

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