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An Approach for Characterizing Residual Mechanical Stress Caused by Packaging Processes

Published online by Cambridge University Press:  26 February 2011

Soeren Hirsch  and
Bertram Schmidt
Soeren Hirsch
Affiliation:
[email protected], IMOS, University of Magdeburg, Universitaetsplatz 2, Magdeburg, 39106, Germany
Bertram Schmidt
Affiliation:
[email protected], IMOS, University of Magdeburg, Universitaetsplatz 2, Magdeburg, 39106, Germany
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Abstract

this paper reports on a method for estimation and minimization of mechanical stress on MEMS sensor and actuator structures due to packaging processes based on flip chip technology. For studying mechanical stress a test chip with silicon membranes was fabricated. Finite element method simulation was calculate the stress profile and to determine the optimum positions for placing the resistor network.

Keywords

thermal stressesmicroelectro-mechanical (MEMS)packaging
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 969: Symposium W – Heterogeneous Integration of Materials for Passive Components and Smart Systems , 2006 , 0969-W02-06-V01-06
Copyright
Copyright © Materials Research Society 2007

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