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An Approach for Characterizing Residual Mechanical Stress Caused by Packaging Processes

Published online by Cambridge University Press:  26 February 2011

Soeren Hirsch
Affiliation:
[email protected], IMOS, University of Magdeburg, Universitaetsplatz 2, Magdeburg, 39106, Germany
Bertram Schmidt
Affiliation:
[email protected], IMOS, University of Magdeburg, Universitaetsplatz 2, Magdeburg, 39106, Germany
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Abstract

this paper reports on a method for estimation and minimization of mechanical stress on MEMS sensor and actuator structures due to packaging processes based on flip chip technology. For studying mechanical stress a test chip with silicon membranes was fabricated. Finite element method simulation was calculate the stress profile and to determine the optimum positions for placing the resistor network.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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