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An Approach for Characterizing Residual Mechanical Stress Caused by Packaging Processes
Published online by Cambridge University Press: 26 February 2011
Abstract
this paper reports on a method for estimation and minimization of mechanical stress on MEMS sensor and actuator structures due to packaging processes based on flip chip technology. For studying mechanical stress a test chip with silicon membranes was fabricated. Finite element method simulation was calculate the stress profile and to determine the optimum positions for placing the resistor network.
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- Copyright © Materials Research Society 2007
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