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Advanced Packaging for High Integration and High Speed Applications

Published online by Cambridge University Press:  25 February 2011

Y. Hamano  and
M. Terasawa
Y. Hamano
Affiliation:
Kyocera Corp., Kagoshima, Japan
M. Terasawa
Affiliation:
Kyocera Corp., Kagoshima, Japan
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Extract

The rapidly advancing technology which has brought us higher integration and higher speed LSIs has also necessitated the continuous improvement of ceramic packages.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 3
Copyright
Copyright © Materials Research Society 1986

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References

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