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Advanced Anodic Bonding Processes For MEMS Applications

Published online by Cambridge University Press:  01 February 2011

V. Dragoi ,
P. Lindner ,
T. Glinsner ,
M. Wimplinger  and
S. Farrens
V. Dragoi
Affiliation:
EV Group, 1 DI Erich Thallner, 4780 - Schaerding, Austria
P. Lindner
Affiliation:
EV Group, 1 DI Erich Thallner, 4780 - Schaerding, Austria
T. Glinsner
Affiliation:
EV Group, 1 DI Erich Thallner, 4780 - Schaerding, Austria
M. Wimplinger
Affiliation:
EV Group Inc, 3701 E. University Drive, Phoenix, AZ 85034, USA
S. Farrens
Affiliation:
EV Group Inc, 3701 E. University Drive, Phoenix, AZ 85034, USA
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Abstract

Anodic bonding is a powerful technique used in MEMS manufacturing. This process is applied mainly for building three-dimensional structures for microfluidic applications or for wafer level packaging. Process conditions will be evaluated in present paper. An experimental solution for bonding three wafers in one single process step (“triple-stack bonding”) will be introduced.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 782: Symposium A – Micro- and Nanosystems , 2003 , A5.80
Copyright
Copyright © Materials Research Society 2004

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References

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