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Adhesion Measurements of Thin Films by Several Methods

Published online by Cambridge University Press:  22 February 2011

Akira Kinbara ,
Tatsuya Banno ,
Ichiharu Kondo  and
Osamu Takenaka
Akira Kinbara
Affiliation:
Kanazawa Institute of Technology, Department of Mechanical Engineering, Nonoichi, Ishikawa 921, Japan
Tatsuya Banno
Affiliation:
The University of Tokyo, Department of Applied Physics, Tokyo 113, Japan
Ichiharu Kondo
Affiliation:
Nippondenso Co.Ltd., Kariya, Aichi 448, Japan
Osamu Takenaka
Affiliation:
Nippondenso Co.Ltd., Kariya, Aichi 448, Japan
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Abstract

Adhesion of thin films to solid substrates has been measured by various methods. In addition to the traditional and the conventional methods, a novel method has been proposed. The adhesion is expressed by various units depending on the measuring method. Obtained values by typical or well known methods such as scratch, peel and pull method are expressed in terms of N, N/m and N/m2, respectively. Relation among these quantities was discussed. The interface structure between the films and the substrates was investigated by TEM, ED, EDS, etc. and was related to the adhesion. Particular attention was paid to the ion bombardment effect of the substrate on the adhesion.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 91
Copyright
Copyright © Materials Research Society 1994

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References

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