Hostname: page-component-cd9895bd7-fscjk Total loading time: 0 Render date: 2024-12-27T02:23:00.228Z Has data issue: false hasContentIssue false
  • English
  • Français

Adaptive Piezo-Controlled Carrier for CMP Processing

Published online by Cambridge University Press:  15 March 2011

Christian-Toralf Weber ,
Jürgen Weiser ,
Dieter Zeidler  and
Johann W. Bartha
Christian-Toralf Weber
Affiliation:
IGAM - Engineering Company for Applied Mechanics Ltd., Steinfeldstraβe 3-5, D-39179 Barleben, Germany, www.igam-mbh.de
Jürgen Weiser
Affiliation:
IGAM - Engineering Company for Applied Mechanics Ltd., Steinfeldstraβe 3-5, D-39179 Barleben, Germany, www.igam-mbh.de
Dieter Zeidler
Affiliation:
Semiconductor and Microsystems Technology Laboratory, Dresden University of Technology, Nöthnitzer Straβe 64, D-01062 Dresden, Germany, www.tu-dresden.de/etihm
Johann W. Bartha
Affiliation:
Semiconductor and Microsystems Technology Laboratory, Dresden University of Technology, Nöthnitzer Straβe 64, D-01062 Dresden, Germany, www.tu-dresden.de/etihm
Get access

Abstract

The IGAM engineering company for applied mechanics Ltd. developed an active piezocontrolled carrier for CMP. It uses several, by means of piezo-stacks individually controllable rings. The carrier is optimized regarding its stiffness and reliability by means of threedimensional finite element calculations. The high stiffness and positioning accuracy of the system allows the exact control of different surface profiles and thus the purposeful attitude of the pressure and removal profile independently of the polishing pressure. Tests show a very homogeneous pressure and removal distribution in the circumference of the wafer. The concept is transferable on further wafer diameters, whereby the width of the individual zones can be widely adapted to the requirements of the desired removal profile. Results of finite element analysis for a 12” prototype are available. The variable concept allows to upgrade existing CMP machines. The aims of current developments are the integration of in-situ-pressure determination to control the process, wireless transfer of energy and data to the carrier and the control of the local removal profile.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 816: Symposium K – Advances in Chemical-Mechanical Polishing , 2004 , K3.2
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Weber, Ch.-T.; Weiser, J. : Formadaptiver Chuck 11. CMP User Meeting, Itzehoe, October 2003 Google Scholar
[2] Final report ADAMES-Adaptive mechanische des DFG-Innovationkollegs INK 25B1-1, Otto von Guericke University Magdeburg, Magdeburg 2001 Google Scholar
[3] Nishiguchi, T.;CMP Consumable Technologies in PERL Hitachi, Hitachi Ltd. Production Engineering Reearch Lab. 2001 http://www.nsfstc.unc.edu/newsticker/ERCretreat03/Orals_August-21st/2_Planarization&Plating /2-Nishiguchi_Hitachi-perl_.pdf)Google Scholar
[4] Müftü, S.; Busnaina, A.; Adams, G.: The Mechanics of CMP and Post-CMP Cleaning Dept. of Mechanical, Industrial and Manuf. Engineering, Northeastern Univ., Boston http://www.cmc.neu.edu/pdf/Presentations/IUCRC_Mechanics_of_CMPandpost-CMP.pdfGoogle Scholar