Hostname: page-component-78c5997874-v9fdk Total loading time: 0 Render date: 2024-11-19T15:23:17.646Z Has data issue: false hasContentIssue false
  • English
  • Français

3D Printing of NiZn ferrite/ABS Magnetic Composites for Electromagnetic Devices

Published online by Cambridge University Press:  01 July 2015

Yunqi Wang ,
Flynn Castles  and
Patrick S. Grant
Yunqi Wang
Affiliation:
Department of Materials, Parks Road, Oxford, OX1 3PH, U.K.
Flynn Castles
Affiliation:
Department of Materials, Parks Road, Oxford, OX1 3PH, U.K.
Patrick S. Grant
Affiliation:
Department of Materials, Parks Road, Oxford, OX1 3PH, U.K.
Get access

Abstract

3D printing is a versatile fabrication method that offers the potential to realize complex 3D devices with metamaterial characteristics in a single process directly from a computer aided design. However, the range of functional devices that might be realized by 3D printing is limited by the current range of materials that are compatible with a given 3D printing process: fused deposition modelling (FDM), which is a widely used 3D printing method, typically employs only common thermoplastics. Here we describe the development of a magnetic feedstock based on polymer-ferrite composite that is compatible with FDM. The feasibility of the technique is demonstrated by the permittivity and permeability measurement of direct printed blocks and the fabrication of a complex 3D diamond-like lattice structure. The development of printable magnetic composites provides increased design freedom for direct realization of devices with graded electromagnetic properties operating at microwave frequencies.

Keywords

magneticcompositedielectric
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1788: Symposium V/W/Z/DD/EE – Light-Matter Phenomena―From Atoms to Complex Structures , 2015 , pp. 29 - 35
Copyright
Copyright © Materials Research Society 2015 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Smith, D. R., Padilla, Willie J., Vier, D. C., Nemat-Nasser, S. C., and Schultz, S., Phys. Rev. Lett. 84, 4184 (2000).CrossRefGoogle Scholar
Baena, J. D., Marques, R., and Medina, F., Phys. Rev. B 69, 014402 (2004).CrossRefGoogle Scholar
Silveirinha, M. G., Belov, P. A., and Simovski, C. R., Phys. Rev. B 75, 035108 (2007).CrossRefGoogle Scholar
Wangberg, R., Elser, J., Narimanov, E. E., and Podolskiy, V. A., J. Opt. Soc. Am. B 23, 498 (2006).CrossRefGoogle Scholar
Pendry, J. B., Schurig, D., and Smith, D. R., Science 312, 1780 (2006).CrossRefGoogle Scholar
Liang, M., Ng, W. R., Chang, K., Gehm, M. E., and Xin, H., Proc. IEEE Int. Microw. Symp., 1 (2011).Google Scholar
Raymond, R. C. Rumpf, C., Gesar, R. G., Tsang, H. H., Padilla, J. E., and Irwin, M. D., Prog. Electronmagn. Res. 142, 243 (2013).Google Scholar
Garcia, C. R., Correa, J., Espalin, D., Barton, J. H., Rumpf, R. C., Wicker, R., and Gonzalez, V., Prog. Electromagn. Res. 34, 75 (2012).CrossRefGoogle Scholar
Ahmadloo, M., IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 29 (2013).Google Scholar
Jiao, X., He, H., Li, G., Qian, W., Shen, G., Pommerenke, D., Ding, C., White, D., Scearce, S., and Yang, Y., IEEE International Symposium on Electromagnetic Compatibility (EMC), 956 (2014).Google Scholar
Gardner, D. S., Crawford, A. M., and Wang, S., IEEE International Interconnect Technology Conference, June, 101 (2001).Google Scholar
Tsutaoka, T., Kasagi, T., Nakamura, T., and Hatakeyama, K., J. Phy. IV France 7, C1 (1997).Google Scholar
Wang, Y. and Grant, P. S., Appl. Phys. A. 117, 477 (2014).CrossRefGoogle Scholar
Barry, W., IEEE Trans. Microwave Th. Tech. 34, 80 (1986).CrossRefGoogle Scholar
Swaminathan, S., Mchenry, M. E., Calvin, S., Sorescu, M., and Diamandescu, L., Proc. of the 9th, International Conference on Ferrites, American Ceramic Society 847 (2005).Google Scholar
Karim, A., Fosse, S., and Persson, K. A., Phys. Rev. B 87, 075322 (2013).CrossRefGoogle Scholar
Nicolson, A. M. and Ross, G. F., IEEE Trans. Instrum. Meas. 19 (4), 377 (1970).CrossRefGoogle Scholar
Weir, W. B., Proc. IEEE 62 (1), 33 (1974).CrossRefGoogle Scholar