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3C-SiC Buffer Layers Converted from Si at a Low Temperature
Published online by Cambridge University Press: 10 February 2011
Abstract
We have obtained single-crystal 3C-SiC films via conversion of the surface region of Si (111) and (100) wafers at 970 °C by reaction with C2H4 in an MBE reactor. The major defects in the films were clusters, voids, and misfit dislocations. Investigation by high resolution TEM images showed low lattice strains in the epitaxial layer due to the formation of 1 misfit dislocation for every 4 to 5 regular SiC planes that are bonded to Si at the interface. The clusters and voids often occurred in pairs. A model for forming the void-cluster pairs is suggested.
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- Copyright © Materials Research Society 1999
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