Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-26T02:42:15.080Z Has data issue: false hasContentIssue false

The State of the Art and Future Prospects for Laser Direct-Write for Industrial and Commercial Applications

Published online by Cambridge University Press:  31 January 2011

Get access

Abstract

Laser direct-write (LDW) is an established technology for manufacturing electronic and optoelectronic appliances such as cellular telephones, digital cameras, and notebook-type personal computers. One of the most successful applications is laser drilling of via holes on printed circuit boards for the manufacture of cellular telephones. Other practical applications include marking, dicing, trimming, repairing, patterning, bending, and rapid prototyping. In this article, the state of the art of LDW for industrial applications in Japan, the United States, and Europe is reviewed, and its future prospects are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Noguchi, S., NEC Technol. J. 50 (1998) p. 37.Google Scholar
2.Naruse, M., Sugawara, M., and Ijima, K., Mitsubishidenkigiho 79 (in Japanese) (2005) p. 229.Google Scholar
3.Washio, K., Proc. SPIE 3618 (1999) p. 230.CrossRefGoogle Scholar
4.Belforte, D., Laser Focus World Market Place Seminar (January 24, 2005).Google Scholar
5.Murata, K. and Tsuda, S., Oyo Butsuri 67 (in Japanese) (1998) p. 1192.Google Scholar
6.Fukuyo, F., Fukumitsu, K., and Uchiyama, N., in Proc. LPM 2005 (Japan Laser Processing Society, Osaka, 2005) p. 322.Google Scholar
7.Shindo, T. and Uchinono, Y., in Tech. Dig. LAMP 2006 (Japan Laser Processing Society, Osaka, 2006) p. 341.Google Scholar
8.Amako, J., Shimoda, T., and Umetsu, K., Proc. SPIE 5339 (2004) p. 475.CrossRefGoogle Scholar
9.Gu, B., Coughlin, T., Maxwell, B., Griffiths, J., Lee, J., Cordingley, J., Johnson, S., Karagiannis, E., and Ehrmann, J., in Semicon China Proc. (SEMI, Shanghai, 2003) p. 42.Google Scholar
10. WaferRepair™ M450 Fuse Processing System online brochure, GSI Group, http://www. gsig.com/systems/ (accessed November 2006).Google Scholar
11.Haight, R., Hayden, D., Longo, P., Neary, T.E., and Wagner, A., Proc. SPIE 3546 (1998) p. 477.CrossRefGoogle Scholar
12.Haight, R., Hayden, D., Longo, P., Neary, T.E., and Wagner, A., Vac. Sci. Technol. B17 (1999) p. 3137.Google Scholar
13.Feru, P. and Fry, A., Laser Focus World (May 2002) p. 50.Google Scholar
14.Gu, B., Schramn, R., and Gillespie, J., in Proc. 36th Int. Symp. Microelectronics (International Microelectronics and Packaging Society, Boston, 2003) p. 72.Google Scholar
15.Gu, B., Couch, B., Oh, J.J., and Chase, P., in Proc. 36th Int. Symp. Microelectronics (International Microelectronics and Packaging Society, Boston, 2003) p. 104.Google Scholar
16.Gu, B., in Proc. ICALEO 2003 (Laser Institute of America, Jacksonville, FL, 2003) M402.Google Scholar
17.Gu, B., Brodt, M., Mabboux, P., and Wake, J., Printed Circuit Board Design (April 2004) p. 24.Google Scholar
18.Chen, C.H. and Liu, X.B., Proc. ICALEO 2005 (Laser Institute of America, Miami, FL, 2005) M401.Google Scholar
19.Norman, S., Zervas, M.N., Appleyard, A., Durkin, M.K., Horley, R., Varnham, M.P., Nilsson, J., and Jeong, Y., Proc. SPIE 5335 (2004) p. 229.CrossRefGoogle Scholar
20.Hoult, A., Industrial Laser Solutions for Manufacturing 21 (1) (January 2006) p. 19.Google Scholar
21.Henry, M., Harrison, P.M., and Wendland, J., Proc. LAMP 2006 (Japan Laser Processing Society, Osaka, 2005) 0616.Google Scholar
22.Booth, H.J., Thin Solid Films 453–454 (2004) p. 450.CrossRefGoogle Scholar
23.Booth, H.J., Abbott, C.E., Allott, R.M., Boehlen, K.L., Fieret, J., Greuters, J., and Trimble, P., Proc. SPIE 5713 (2005) p. 190.CrossRefGoogle Scholar
24.Toftness, R.F., Boyle, A., and Gillen, D., Proc. SPIE 5713 (2005) p. 54.CrossRefGoogle Scholar
25.Perrottet, D., Housh, R., Richerzhagen, B., and Manley, J., Proc. SPIE 5713 (2005) p. 285.CrossRefGoogle Scholar
26.Davis, K.M., Miura, K., Sugimoto, N., and Hirao, K., Opt. Lett. 21 (1996) p. 1729.CrossRefGoogle Scholar
27.Sugioka, K., Cheng, Y., and Midorikawa, K., Appl. Phys. A81 (2005) p. 1.CrossRefGoogle Scholar