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Sensors, Actuators, and Smart Materials

Published online by Cambridge University Press:  29 November 2013

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The field of electronic ceramics includes components as diverse as Mn-Zn ferrites, lead zirconate titanate transducers, ZnO varistors, and Al2O3 or cordierite-based packages for integrated circuits. An overview of electroceramics is given in Figure 1, which depicts schematically the types of electronic and ionic phenomena of interest. Many of the materials pictured utilize some bulk property of the ceramic, such as the presence of ferroelectric of ferrimagnetic dipoles, electronic or ionic conductivity, or a phase transition to provide a useful function. In other materials, extraordinary responses can be engineered by suitably tailoring the thickness and properties of a grain boundary phase. Varistors, barrier layer capacitors, and PTC thermistors, for example, all rely on the preparation of semiconducting grains and insulating grain boundaries to create properties that cannot be found in single crystals. In a similar way, some of the porous ceramics utilized in humidity sensors rely on surface properties rather than on a bulk response to detect changes in the ambient humidity (Kulwicki, 1992). Finally, in materials for insulators or substrates, all of the otherwise interesting phenomena must be eliminated. With the exception of the last category, all of the phenomena depicted in Figure 1 can be utilized in ceramic sensors. While sensing and actuating materials are currently a fraction of the overall multibillion-dollar electroceramics market, the percentage is expected to grow as more and more devices are made “smart.”

As discussed in the introduction to this issue, smart materials are capable of sensing a change in the environment and responding in a useful way.

Type
Smart Materials
Copyright
Copyright © Materials Research Society 1993

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References

1.Dummer, G.W.A. and Nordenburg, H.M., Fixed and Variable Capacitors, (McGraw Hill, New York, 1960) p. 153.Google Scholar
2.Kumar, S., PhD thesis, Pennsylvania State University, 1991.Google Scholar
3.Garba, J.A., Wada, B.K., and Fanson, J.L., J. Intell. Mater. Sys. Struct. 3 (1992) p. 348.CrossRefGoogle Scholar
4.Naito, M., Ceram. Eng. Sci. Proc. 8 (9–10) (1987) p. 1106.Google Scholar
5.Taguchi, M., Adv. Ceram. Mater. 2 (4) (1987) p. 754.CrossRefGoogle Scholar
6.Amin, A., J. Am. Ceram. Soc. 72 (3) (1989) p. 369.CrossRefGoogle Scholar
7.Newnham, R.E., Rep. Prog. Phys. 52 (1) (1989) p. 123.CrossRefGoogle Scholar
8.Hill, D.C. and Tuller, H.L., in Ceramic Materials for Electronics: Processing, Properties, and Applications, edited by Buchanan, R.C. (Marcel Dekker, New York, 1986).Google Scholar
9.Maskell, W.C., J. Phys. E 20 (1987) p. 1156.Google Scholar
10.Logothetis, E.M., Ceram. Eng. Sci. Proc. 1 (1980) p. 281.CrossRefGoogle Scholar
11.Kulwicki, B.M., J. Am. Ceram. Soc. 74 (4) (1991) p. 697.CrossRefGoogle Scholar
12.Tsuka, H., Nakomo, J., and Yokoya, Y., IEEE Workshop on Electronic Applications in Transportation (1990).Google Scholar
13.Kusakabe, H., Okauchi, T., and Takigawa, M., SAE paper 920701 (1992).Google Scholar
14.Noll, M., Knoll, P.M., and Rapps, P., Sens. Act. A 31 (1992) p. 51.CrossRefGoogle Scholar
15.Furuta, A., Oh, K., and Uchino, K., Proc. 1990 Int. Symp. Appl. Ferro. Meeting (1990) p. 528.Google Scholar
16.Newnham, R.E. and Trolier-McKinstry, S., J. Appl. Crystallogr. 23 (1990) p. 447.CrossRefGoogle Scholar
17.Newnham, R.E. and Ruschau, G.R., J. Am. Ceram. Soc. 74 (3) (1989) p. 463.CrossRefGoogle Scholar
18.Goto, H., Imanaka, K., and Uchino, K., Ultrason. Tcchnol. 5 (1992) p. 48.Google Scholar
19.Takaya, M., Fujisawa, A., and Mochizuki, Y., ISHM '90 Proc. (1990) p. 747.Google Scholar
20.Huijsing, J. H., Sens. Act. A 30 (1992) p. 167.CrossRefGoogle Scholar
21.Kleinschmidt, P. and Schmidt, F., Sens. Act. A 31 (1992) p. 35.CrossRefGoogle Scholar
22.Udayakumar, K.R., Bart, S.F., Flynn, A.M., Chen, J., Tavrow, L.S., Cross, L.E., Brooks, R.A., and Ehrlich, D.J., Proc. 4th IEEE Workshop on Micro-mechanical Systems (MEMS) (1991) p. 109.Google Scholar
23.Brooks, K.G., Udayakumar, K.R., Chen, J., and Cross, L.E., presented at the MRS 1992 Spring Meeting, San Francisco, CA, 1992 (unpublished).Google Scholar
24.Johnson, A.D., Busch, J.D., Roy, C.A., and Sloan, C.L., presented at the MRS 1992 Spring Meeting, San Francisco, CA, 1992 (unpublished).Google Scholar
25.Johnson, A.D., Busch, J.D., Petty, B.R., Roy, C.A., and Sloan, C.L., presented at the MRS 1992 Spring Meeting, San Francisco, CA, 1992 (unpublished).Google Scholar