Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Ramos, Teresa
Wallace, Steve
and
Smith, Douglas M.
1997.
Nanoporous Silica for Low κ Dielectrics.
MRS Proceedings,
Vol. 495,
Issue. ,
Beckers, J.V.L.
and
De Leeuw, S. W.
1997.
Molecular Dynamics Simulations of Porous Silica.
MRS Proceedings,
Vol. 492,
Issue. ,
Ramos, T.
Rhoderick, K.
Roth, R.
Brungardt, L.
Wallace, S.
Drage, J.
Dunne, J.
Endisch, D.
Katsanes, R.
Viemes, N.
and
Smith, D. M.
1998.
Nanoporous Silica For Low K Dielectrics.
MRS Proceedings,
Vol. 511,
Issue. ,
Ray, Gary W.
1998.
Low Dielectric Constant Materials Integration Challenges.
MRS Proceedings,
Vol. 511,
Issue. ,
Trabzon, L
Awadelkarim, O.O
and
Werking, J
1998.
The effects of interlayer dielectric deposition and processing on the reliability of n-channel transistors.
Solid-State Electronics,
Vol. 42,
Issue. 11,
p.
2031.
Brillouët, M.
1998.
Multilevel Interconnection Technologies and Future Requirements for Logic Applications.
MRS Proceedings,
Vol. 514,
Issue. ,
Nitta, S.
Jain, A.
Pisupatti, V.
Gill, W. N.
Wayner, P. C.
and
Plawsky, J. L.
1998.
Fabrication and Characterization of Spin-On Silica Xerogel Films.
MRS Proceedings,
Vol. 511,
Issue. ,
Xu, Chongying
and
Baum, Thomas H.
1998.
Chemical Vapor Deposition (CVD) of Parylene Films using Liquid Source Delivery.
MRS Proceedings,
Vol. 555,
Issue. ,
Wu, Nae-Lih
Wang, Sze-Yen
and
Rusakova, I. A.
1999.
Inhibition of Crystallite Growth in the Sol-Gel Synthesis of Nanocrystalline Metal Oxides.
Science,
Vol. 285,
Issue. 5432,
p.
1375.
Jain, Anurag
Rogojevic, Svetlana
Nitta, Satya V.
Pisupatti, Venumadhav
Gill, William N.
Wayner, Peter C.
Plawsky, Joel L.
Standaert, T. E. F. M.
and
Oehrlein, G. S.
1999.
Processing and Characterization of Silica Xerogel Films for Low-K Dielectric Applications.
MRS Proceedings,
Vol. 565,
Issue. ,
Morgen, Michael
Zhao, Jie-Hua
Hu, Chuan
Cho, Taiheui
Ho, Paul S.
and
Todd, E.
1999.
Low dielectric constant materials for advanced interconnects.
JOM,
Vol. 51,
Issue. 9,
p.
37.
Tsai, Yi-Pin
Liao, C. N.
Xu, Yuhuan
Tu, K. N.
Zhao, Bin
Liu, Q.-Z.
and
Brongo, Maureen
1999.
A New Low Dielectric Constant Polymer Material (k < 2): Microstructure, Electrical Properties, and Mechanical Properties.
MRS Proceedings,
Vol. 565,
Issue. ,
Yeh, Wen-Chang
and
Matsumura, Masakiyo
1999.
Low-Temperature Preparation of Poly-Si Thin-Films Having Giant Grains.
MRS Proceedings,
Vol. 557,
Issue. ,
Wang, Zhong Lin
1999.
Wiley Encyclopedia of Electrical and Electronics Engineering.
Nguyen, Cattien V.
Carter, Kenneth R.
Hawker, Craig J.
Hedrick, James L.
Jaffe, Richard L.
Miller, Robert D.
Remenar, Julius F.
Rhee, Hee-Woo
Rice, Philip M.
Toney, Michael F.
Trollsås, Mikael
and
Yoon, Do Y.
1999.
Low-Dielectric, Nanoporous Organosilicate Films Prepared via Inorganic/Organic Polymer Hybrid Templates.
Chemistry of Materials,
Vol. 11,
Issue. 11,
p.
3080.
Senkevich, Jay J.
and
Desu, Seshu B.
1999.
Near-Room-Temperature Thermal Chemical Vapor Deposition of Poly(chloro-p-xylylene)/SiO2 Nanocomposites.
Chemistry of Materials,
Vol. 11,
Issue. 7,
p.
1814.
Wu, Wen-li
Wallace, William E.
Lin, Eric K.
Lynn, Gary W.
Glinka, Charles J.
Ryan, E. Todd
and
Ho, Huei-Min
2000.
Properties of nanoporous silica thin films determined by high-resolution x-ray reflectivity and small-angle neutron scattering.
Journal of Applied Physics,
Vol. 87,
Issue. 3,
p.
1193.
Lee, Ju-Hyung
Chopra, Nasreen
Ma, Jim
Lu, Yung-Cheng
Huang, Tzu-Fang
Willecke, Ralf
Yau, Wai-Fan
Cheung, David
and
Yieh, Ellie
2000.
Integration and Characterization of Low Carbon Content SiOxCyHzLow κ Materials for < 0.18μm[ Dual Damascene Application.
MRS Proceedings,
Vol. 612,
Issue. ,
Kear, Bernard H.
and
Skandan, Ganesh
2000.
Ullmann's Encyclopedia of Industrial Chemistry.
Jain, Anurag
Rogojevic, Svetlana
Wang, Feng
Gill, William N.
Wayner, Peter C.
Plawsky, Joel L.
Haberl, Arthur
and
Lanford, William
2000.
Processing, Characterization and Reliability of Silica Xerogel Films for Interlayer Dielectric Applications.
MRS Proceedings,
Vol. 612,
Issue. ,