Minimization of Diffuse Scattering Reduces Resistivity of Thin Copper Films

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Type: Research/Researchers
Information: MRS Bulletin , Volume 25 , Issue 9: Soft Processing for Advanced Inorganic Materials , September 2000 , pp. 7

DOI: https://doi.org/10.1557/mrs2000.166 [Opens in a new window]

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Minimization of Diffuse Scattering Reduces Resistivity of Thin Copper Films

Volume 25, Issue 9
Cora Lind
DOI: https://doi.org/10.1557/mrs2000.166

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Minimization of Diffuse Scattering Reduces Resistivity of Thin Copper Films

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