Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Revzin, B.
Pelleg, J.
and
Gorodetsky, G.
1999.
Nucleation energy in the solid state.
Physical Review B,
Vol. 59,
Issue. 14,
p.
9144.
Yacamán, M. José
Zorrilla, C.
Ascencio, J. A.
Mondragón, G.
and
Reyes-Gasga, J.
1999.
Study of High Resolution TEM Images of Nanoparticles either Supported on Amorphous Films or Embedded in a Crystalline Matrix.
Materials Transactions, JIM,
Vol. 40,
Issue. 2,
p.
141.
Wang, J
Shi, F.G
Nieh, T.G
Zhao, B
Brongo, M.R
Qu, S
and
Rosenmayer, T
2000.
Thickness dependence of elastic modulus and hardness of on-wafer low-k ultrathin polytetrafluoroethylene films.
Scripta Materialia,
Vol. 42,
Issue. 7,
p.
687.
Senkevich, J.J.
Desu, S.B.
and
Simkovic, V.
2000.
Temperature studies of optical birefringence and X-ray diffraction with poly(p-xylylene), poly(chloro-p-xylylene) and poly(tetrafluoro-p-xylylene) CVD thin films.
Polymer,
Vol. 41,
Issue. 7,
p.
2379.
Dang, T. D.
Mather, P. T.
Alexander, M. D.
Grayson, C. J.
Houtz, M. D.
Spry, R. J.
and
Arnold, F. E.
2000.
Synthesis and characterization of fluorinated benzoxazole polymers with highTg and low dielectric constant.
Journal of Polymer Science Part A: Polymer Chemistry,
Vol. 38,
Issue. 11,
p.
1991.
Qu, Wen‐Li
Ko, Tze‐Man
Vora, Rohit H.
and
Chung, Tai‐Shung
2001.
Anisotropic dielectric properties of polyimides consisting of various molar ratios of meta to para diamine with trifluoromethyl group.
Polymer Engineering & Science,
Vol. 41,
Issue. 10,
p.
1783.
Xu, Yuhuan
Zheng, D. W.
Tsai, Yipin
Tu, K. N.
Zhao, Bin
Liu, Q. Z.
Brongo, Maureen
Ong, Chung Wo
Choy, Chung Loong
Sheng, George T. T.
and
Tung, C. H.
2001.
Synthesis and characterization of porous polymeric low dielectric constant films.
Journal of Electronic Materials,
Vol. 30,
Issue. 4,
p.
309.
Yoo, Sehoon
Eun, Byung Soo
Kim, Young-Ho
and
Chung, Yong-Chae
2001.
The effect of low dielectric polymer thickness on the electromigration characteristics of Al(1% Cu–0.5% Si) thin films.
Thin Solid Films,
Vol. 382,
Issue. 1-2,
p.
222.
Grill, A.
2001.
Amorphous carbon based materials as the interconnect dielectric in ULSI chips.
Diamond and Related Materials,
Vol. 10,
Issue. 2,
p.
234.
Ariel, N.
Eizenberg, M.
Wang, Y.
and
Bakhru, H.
2001.
The interface of fluorinated amorphous carbon with copper metallization.
Materials Science and Engineering: A,
Vol. 302,
Issue. 1,
p.
26.
Johnson, Erik
2002.
The Elusive Liquid-Solid Interface.
Science,
Vol. 296,
Issue. 5567,
p.
477.
Chen, S. T.
Chen, G. S.
and
Yang, T. J.
2003.
Plasma Passivation of Siloxane-Based Low-k Polymeric Films.
Journal of The Electrochemical Society,
Vol. 150,
Issue. 10,
p.
F194.
Chen, S. T.
Chen, G. S.
Yang, T. J.
Chang, T. C.
and
Yang, W. H.
2003.
The Synergistic Effect of N[sub 2]/H[sub 2] Gases in the Plasma Passivation of Siloxane-Based Low-k Polymer Films.
Electrochemical and Solid-State Letters,
Vol. 6,
Issue. 1,
p.
F4.
Chang, T.C.
Tsai, T.M.
Liu, P.T.
Chen, C.W.
and
Tseng, T.Y.
2004.
Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material.
Thin Solid Films,
Vol. 469-470,
Issue. ,
p.
383.
Li, C.Y.
Zhang, D.H.
Su, S.S.
Lu, P.W.
He, X.
Jia, G.J.
Chen, Zhe
Wu, S.Y.
and
Kumar, Rakesh
2004.
Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology.
Thin Solid Films,
Vol. 462-463,
Issue. ,
p.
172.
Su, Kai
Bujalski, Duane R.
Eguchi, Katsuya
Gordon, Glenn V.
Hu, Sanlin
and
Ou, Duan-Li
2005.
Vinyl ether-modified poly(hydrogen silsesquioxanes) as dielectric materials.
Journal of Materials Chemistry,
Vol. 15,
Issue. 38,
p.
4115.
Hoofman, R.J.O.M.
Verheijden, G.J.A.M.
Michelon, J.
Iacopi, F.
Travaly, Y.
Baklanov, M.R.
Tökei, Zs.
and
Beyer, G.P.
2005.
Challenges in the implementation of low-k dielectrics in the back-end of line.
Microelectronic Engineering,
Vol. 80,
Issue. ,
p.
337.
Zhang, Y.
Saraf, L.
Shutthanandan, V.
Hughes, K.D.
Kuan, R.
and
Thevuthasan, S.
2006.
Study of hydrogen stability in low-k dielectric films by ion beam techniques.
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms,
Vol. 249,
Issue. 1-2,
p.
335.
Vinogradova, Ekaterina
Smith, Casey E.
Mueller, Dennis W.
and
Reidy, Richard F.
2008.
Application of Deuterium Exchange to Analyze Moisture Uptake Characteristics of Porous Low-Dielectric-Constant SiOCH Films.
Electrochemical and Solid-State Letters,
Vol. 11,
Issue. 9,
p.
H255.
Balasinski, Artur
2008.
Circuits at the Nanoscale.
p.
11.