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Fundamentals of Residual Stresses in Joints Between Dissimilar Materials

Published online by Cambridge University Press:  29 November 2013

B.H. Rabin ,
R.L. Williamson  and
S. Suresh
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Extract

When a discontinuity in material properties exists across a bonded interface, stresses are generated as a result of any thermal or mechanical loading. These stresses significantly affect strength and failure characteristics and may be large enough to prevent successful fabrication of a reliable joint. The use of an interlayer material to successfully reduce mismatch stresses, thereby preventing joint failure or improving joint strength and reliability, requires knowledge of failure mechanisms and of the effects of interlayer properties on the critical stress components.

The origin of residual stresses developed during cooling of a ceramic-metal joint from an elevated fabrication temperature is illustrated qualitatively in Figure 1. Away from edges, the in-plane (parallel to interface) stresses are typically compressive in the ceramic and tensile in the metal. These stresses can cause cracking perpendicular to the interface, leading to spalling or delamination failures. Such failures are frequently observed in thin-film and coating geometries. Where the interface intersects a free edge, large shear and axial (perpendicular to the interface) stresses are generated. The edge stresses are typically tensile within the ceramic and tend to promote crack propagation within the ceramic parallel and adjacent to the interface. This is the most commonly observed failure mode in bonded structural components.

Type
Functionally Gradient Materials
Information
MRS Bulletin , Volume 20 , Issue 1 , January 1995 , pp. 37 - 39
Copyright
Copyright © Materials Research Society 1995

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References

1.Finot, M., Suresh, S., Bull, C., and Sampath, S., “Experimental Measurements of Curvature Measurements During Thermal Cycling of a Ni-Al2O3 Functionally Graded Material,” submitted to Mat. Sci. and Eng.Google Scholar
2.Williamson, R.L., Rabin, B.H., and Drake, J.T., “Finite Element Analysis of Thermal Residual Stresses at Graded Ceramic-Metal Interfaces, Part I: Model Description and Geometrical Effects,” J. Appl. Phys. 74 (2) (1993) p. 1321.CrossRefGoogle Scholar
3.Williamson, R.L., Rabin, B.H., and Drake, J.T., “Part II: Microstructure Optimization for Residual Stress Reduction,” p. 1322.Google Scholar
4.Finot, M. and Suresh, S., MultiTherm, Software for Thermomechanical Analysis of Multilayered and Graded Materials, Version 1.0 (Massachusetts Institute of Technology, Cambridge, MA, 1994).Google Scholar
5.Giannakopoulos, A.E., Suresh, S., Finot, M., and Olsson, M., Acta Metall. (1994) in press.Google Scholar