Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Kalkman, A. J.
Verbruggen, A. H.
Janssen, G. C. A. M.
and
Radelaar, S.
2002.
Transient creep in free-standing thin polycrystalline aluminum films.
Journal of Applied Physics,
Vol. 92,
Issue. 9,
p.
4968.
Schwaiger, R
and
Kraft, O
2003.
Size effects in the fatigue behavior of thin Ag films.
Acta Materialia,
Vol. 51,
Issue. 1,
p.
195.
Kaouache, B.
Gergaud, P.
Thomas, O.
Bostrom, O.
and
Legros, M.
2003.
Impact of thermal cycling on the evolution of grain, precipitate and dislocation structure in Al, 0.5% Cu, 1% Si thin films.
Microelectronic Engineering,
Vol. 70,
Issue. 2-4,
p.
447.
Ege, E. S.
and
Shen, Y.-L.
2003.
Atomistic Simulation of Flow Stress and Dislocation-Interface Interaction in Thin Metal Films.
MRS Proceedings,
Vol. 778,
Issue. ,
Phillips, M.A.
Clemens, B.M.
and
Nix, W.D.
2003.
A model for dislocation behavior during deformation of Al/Al3Sc (fcc/L12) metallic multilayers.
Acta Materialia,
Vol. 51,
Issue. 11,
p.
3157.
Son, Dongil
Jeong, Jeung-hyun
and
Kwon, Dongil
2003.
Film-thickness considerations in microcantilever-beam test in measuring mechanical properties of metal thin film.
Thin Solid Films,
Vol. 437,
Issue. 1-2,
p.
182.
Rehder, E. M.
Inoki, C. K.
Kuan, T. S.
and
Kuech, T. F.
2003.
SiGe relaxation on silicon-on-insulator substrates: An experimental and modeling study.
Journal of Applied Physics,
Vol. 94,
Issue. 12,
p.
7892.
Van Vliet, Krystyn J.
Li, Ju
Zhu, Ting
Yip, Sidney
and
Suresh, Subra
2003.
Quantifying the early stages of plasticity through nanoscale experiments and simulations.
Physical Review B,
Vol. 67,
Issue. 10,
Legros, M.
Dehm, G.
Balk, T.J.
Arzt, E.
Bostrom, O.
Gergaud, P.
Thomas, O.
and
Kaouache, B.
2003.
Plasticity-Related Phenomena in Metallic Films on Substrates.
MRS Proceedings,
Vol. 779,
Issue. ,
Schwarz, K. W.
2003.
Discrete Dislocation Dynamics Study of Strained-Layer Relaxation.
Physical Review Letters,
Vol. 91,
Issue. 14,
Shen, Y-L.
2003.
Strength and interface-constrained plasticity in thin metal films.
Journal of Materials Research,
Vol. 18,
Issue. 10,
p.
2281.
Shen, Y.-L.
and
Ramamurty, U.
2003.
Constitutive response of passivated copper films to thermal cycling.
Journal of Applied Physics,
Vol. 93,
Issue. 3,
p.
1806.
Wellner, P.
Dehm, G.
Kraft, O.
and
Arzt, E.
2004.
Size effects in the plastic deformation of NiAl thin films.
Zeitschrift für Metallkunde,
Vol. 95,
Issue. 9,
p.
769.
Haque, M. A.
and
Saif, M. T. A.
2004.
Deformation mechanisms in free-standing nanoscale thin films: A quantitative
in situ
transmission electron microscope study
.
Proceedings of the National Academy of Sciences,
Vol. 101,
Issue. 17,
p.
6335.
Pranevicius, L.
Milcius, D.
Pranevicius, L.L.
Templier, C.
Sirvinskaite, V.
and
Knizikevicius, R.
2004.
Role of surface instabilities in mixing and oxidation mechanisms of bilayered Y/Zr films at elevated temperature.
Applied Surface Science,
Vol. 225,
Issue. 1-4,
p.
272.
Kim, Jong-Jin
and
Kwon, Dongil
2005.
Degradation of Fracture and Fatigue Properties of MEMS Structures Under Cyclic Loading.
MRS Proceedings,
Vol. 863,
Issue. ,
Kraft, Oliver
and
Gao, Huajian
2005.
Diffusion Processes in Advanced Technological Materials.
p.
365.
Bažant, Zdeněk P.
Guo, Zaoyang
Espinosa, Horacio D.
Zhu, Yong
and
Peng, Bei
2005.
Epitaxially influenced boundary layer model for size effect in thin metallic films.
Journal of Applied Physics,
Vol. 97,
Issue. 7,
Huang, Rui
Gan, Dongwen
and
Ho, Paul S.
2005.
Isothermal stress relaxation in electroplated Cu films. II. Kinetic modeling.
Journal of Applied Physics,
Vol. 97,
Issue. 10,
Pletea, M.
Brückner, W.
Wendrock, H.
and
Kaltofen, R.
2005.
Stress evolution during and after sputter deposition of Cu thin films onto Si (100) substrates under various sputtering pressures.
Journal of Applied Physics,
Vol. 97,
Issue. 5,