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Designing for MEMS Reliability

Published online by Cambridge University Press:  31 January 2011

Susanne Arney
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Extract

Microelectromechanical systems (MEMS) devices are being manufactured in the hundreds of millions and are widely deployed for pressure sensor, accelerometer, display, and printing applications. This suggests customer confidence in the longterm reliability of MEMS (also known as microsystems or micromachines) under diverse stringent conditions.

Type
Research Article
Information
MRS Bulletin , Volume 26 , Issue 4: Microelectromechanical Systems (MEMS): Technology and Applications , April 2001 , pp. 296 - 299
Copyright
Copyright © Materials Research Society 2001

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References

1Payne, R.S. in Proc. 13th Int. Conf. on MEMS, edited by Shimoyama, I. and Kuwano, H. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p.7.Google Scholar
2Nelson, W.Accelerated Testing: Statistical Models, Test Plans, and Data Analyses (Wiley, New York, 1990).CrossRefGoogle Scholar
3Nash, F.R.Estimating Device Reliability: Assessment of Credibility (Kluwer Academic Publishers, Boston, 1993).Google Scholar
4Ohring, M.Reliability and Failure of Electronic Materials and Devices (Academic Press, Boston, 1998).Google Scholar
5Cruzel, S.Esteve, D.Dilhan, M.Fourniols, J.Y.Pressecq, F.Puig, O. and Simonne, J.J. in Proc. SPIE MEMS Reliability for Critical Applications, Vol. 3880, edited by Lawton, R.A.Miller, W.M.Lin, G. and Ramesham, R. (SPIE—The International Society for Optical Engineering, Belling-ham, WA, 1999) p.148.CrossRefGoogle Scholar
6Michel, B. in Proc. Micro System Technologies 98, edited by Reichl, H. and Obermeier, E. (VDE Verlag, Berlin, 1998) p.403.Google Scholar
7Military Handbook (MIL-HDBK-217F) Reliability Prediction of Electronic Equipment (Department of Defense, Washington, DC, 1991).Google Scholar
8Smith, N.F.Eaton, W.P.Tanner, D.M. and Allen, J.J., in Proc. SPIE MEMS Reliability for Critical Applications, Vol. 3880, edited by Lawton, R.A.Miller, W.M.Lin, G. and Ramesham, R. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1999) p.156.CrossRefGoogle Scholar
9Patton, S.T.Cowan, W.D. and Zabinski, J.S. in Proc. 37th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1999) p.179.Google Scholar
10Turner, K.L.Miller, S.A.Hartwell, P.G.MacDonald, N.C.Strogatz, S.H. and Adams, S.G.Nature 396 (1998) p.149.CrossRefGoogle Scholar
11Lawton, R.A.Abraham, M. and Lawrence, E. in Proc. SPIE MEMS Reliability for Critical Applications, Vol. 3880, edited by Lawton, R.A.Miller, W.M.Lin, G. and Ramesham, R. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1999) p.46.CrossRefGoogle Scholar
12Gasparyan, A.Aksyuk, V.Busch, P. and Arney, S. in Proc. SPIE MEMS Reliability for Critical and Space Applications, Vol. 4180, edited by Lawton, R.A. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 2000) p.86.CrossRefGoogle Scholar
13Freeman, D.M.Aranyosi, A.J.Gordon, M.J. and Hong, S.S. in Tech. Dig. 1998 Solid-State Sensor and Actuator Workshop (Transducer Research Foundation, Cleveland, 1998) p.150.Google Scholar
14Rembe, C.Hart, M.Helmbrecht, M.Srinivasan, U.Muller, R.S.Lau, K.Y. and Howe, R.T. in Proc. 2000 IEEE/LEOS Int. Conf. Optical MEMS (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p.73.Google Scholar
15Brown, G.C.Pryputniewicz, R.J.de Boer, M.P., and Smith, N. in Materials Science of Micro-electromechanical Systems (MEMS) Devices II, edited by de Boer, M.P., Heuer, A.H.Jacobs, S.J. and Peeters, E. (Mater. Res. Soc. Symp. Proc. 605, Warrendale, PA, 2000) p.163.Google Scholar
16de Boer, M.P., Knapp, J.A.Michalske, T.A.Srinivasan, U. and Maboudian, R.Acta Mater. 48 (2000) p.4531.CrossRefGoogle Scholar
17Rembe, C.Aschemann, H.Wiesche, S. aus der, Hofer, E.P.Debede, H.Mohr, J., and Wallrabe, U. in Proc. 38th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p.123.Google Scholar
18Kazinczi, R.Mollinger, J.R. and Bossche, A.Sens. Actuators A 85 (1–3) (2000) p.84.CrossRefGoogle Scholar
19Meunier, D.Desplats, R.Benbrik, J.Perez, G.Pellet, C.Etseve, D. and Bente, B.Micro-electron. Reliability 38 (6–8) (1998) p.1265.CrossRefGoogle Scholar
20MEMS Reliability Assurance Guideline for Space Applications, edited by Stark, B. JPLPubli-cation 99-1 (Jet Propulsion Laboratory, Pasadena, CA, 1999).Google Scholar
21Tanner, D.M.Smith, N.F.Irwin, L.W.Eaton, W.P.Helgesen, K.S.Clement, J.J.Miller, W.M.Walraven, J.A.Peterson, K.A.Tangyunyong, P.Dugger, M.T. and Miller, S.L.MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes (Sandia National Laboratories, Albuquerque, NM, 2000).CrossRefGoogle Scholar
22Brown, S.B.Arsdell, W. Van, and Muhlstein, C.L. in Digest of Technical Papers, Int. Conf. Solid-State Sensors and Actuators (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1997) p.591.Google Scholar
23Brown, S.B. and Jansen, E. in 1996 Digest IEEE/LEOS Summer Topical Meetings on Optical MEMS and Their Applications (Institute of Electrical and Electronics Engineers, Piscataway, NJ) p.9.Google Scholar
24Douglass, M.R. in Proc. 36th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1998) p.9.Google Scholar
25Miller, S.L.Rodgers, M.S.LaVigne, G.Sniegowski, J.J.Clews, P.Tanner, D.M. and Peterson, K.A. in Proc. 36th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1998) p. 17.Google Scholar
26Tanner, D.M.Miller, W.M.Eaton, W.P.Irwin, L.W.Peterson, K.A.Dugger, M.T.Senft, D.C.Smith, N.F.Tangyunyong, P. and Miller, S.L. in Proc. 36th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1998) p.26.Google Scholar
27Delak, K.M.Bova, P.Hartzell, A.L. and Woodilla, D.J. in Proc. SPIE MEMS Reliability for Critical Applications, Vol. 3880, edited by Lawton, R.A.Miller, W.M.Lin, G. and Ramesham, R. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1999) p.165.Google Scholar
28Ramesham, R.Ghaffarian, R. and Kim, N.P. in Proc. SPIE MEMS Reliability for Critical Applications, Vol. 3880, edited by Lawton, R.A.Miller, W.M.Lin, G. and Ramesham, R. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1999) p.83.CrossRefGoogle Scholar
29Man, K.F. in Proc. SPIE MEMS Reliability for Critical Applications, Vol. 3880, edited by Lawton, R.A.Miller, W.M.Lin, G. and Ramesham, R. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1999) p.120.CrossRefGoogle Scholar
30Ghaffarian, R. in Proc. 2000 ASME Int. Mechanical Engineering Congress and Exposition MEMS-2, edited by Lee, A.Forster, F.Keynton, R.Malshe, A.P. and Tan, Q. (American Society of Mechanical Engineers, New York, 2000) p. 623.Google Scholar
31Gilleo, K. in Proc. 2000 ASME Int. Mechanical Engineering Congress and Exposition MEMS-2, edited by Lee, A.Forster, F.Keynton, R.Malshe, A.P. and Tan, Q. (American Society of Mechanical Engineers, New York, 2000) p.615.Google Scholar
32Petersen, K.E.Proc. IEEE 70 (5)(1982) p.420.CrossRefGoogle Scholar
33Tanner, D.M.Walraven, J.A.Helgesen, K.S.Irwin, L.W.Gregory, D.L.Stake, J.R. and Smith, N.F. in Proc. 38th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p.139.Google Scholar
34Tanner, D.M.Walraven, J.A.Helgesen, K.S.Irwin, L.W.Brown, F.A.Smith, N.F. and Masters, N. in Proc. 38th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p.129.Google Scholar
35Arsdell, W.W. Van and Brown, S.B.IEEE/ASME J.MEMS 8 (3)(1999) p.319.CrossRefGoogle Scholar
36Saif, M.T. and MacDonald, N.C. in Tech. Dig. Transducers '95/EuroSensors IX, Vol. 2 (Foundation for Sensor and Actuator Technology, Stockholm, 1995) p.60.Google Scholar
37Prasad, R.MacDonald, N. and Taylor, D. in Tech. Dig. Transducers '95/EuroSensors IX, Vol. 2 (Foundation for Sensor and Actuator Technology, Stockholm, 1995) p.53.Google Scholar
38Nieva, P., Tada, H.Zavracky, P.Adams, G.Miaoulis, I. and Wong, P. in Materials Science of Microelectromechanical Systems (MEMS) Devices, edited by Heuer, A.H. and Jacobs, S.J. (Mater. Res. Soc. Symp. Proc. 546, Warrendale, PA, 1999) p.97.Google Scholar
39Guckel, H. in Materials Science of Micro-electromechanical Systems (MEMS) Devices II, edited by de Boer, M.P., Heuer, A.H.Jacobs, S.J. and Peeters, E. (Mater. Res. Soc. Symp. Proc. 605, Warrendale, PA, 2000) p.3.Google Scholar
40Sekimoto, M.Yoshihara, H. and Ohkubo, T.J.Vac. Sci. Technol. 21 (4)(1982) p.1017.CrossRefGoogle Scholar
41Yang, J.Kahn, H.He, A.Q.Phillips, S.M. and Heuer, A.H.IEEE/ASME J. MEMS 9 (December 2000) p.485.CrossRefGoogle Scholar
42Aksyuk, V.A.Pardo, F. and Bishop, D.J. in SPIE Symp. on Design, Test, and Microfabrication of MEMS and MOEMS, Vol. 3680, edited by Courtois, B.Crary, S.B.Ehrfeld, W.Fujita, H.Karam, J.-M. and Markus, K. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1999) p.984.CrossRefGoogle Scholar
43Maboudian, R. and Howe, R.T.J. Vac. Sci. Technol., B 15 (1)(1997) p.1.Google Scholar
44Jafri, I.Busta, H. and Walsh, S. in Proc. SPIE MEMS Reliability for Critical Applications, Vol. 3880, edited by Lawton, R.A.Miller, W.M.Lin, G. and Ramesham, R. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1999) p.51.CrossRefGoogle Scholar
45Kullberg, R.C. in Proc. SPIE MEMS Reliability for Critical Applications, Vol. 3880, edited by Lawton, R.A.Miller, W.M.Lin, G. and Ramesham, R. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1999) p.75.Google Scholar
46Tanner, D.M.Walraven, J.A.Irwin, L.W.Dugger, M.T.Smith, N.F.Eaton, W.P.Miller, W.M. and Miller, S.L. in Proc. 37th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1999) p.189.Google Scholar
47Mani, S.S.Fleming, J.G.Walraven, J.A.Sniegowski, J.J.M.P., de Boer, Irwin, L.W.Tanner, D.M.LaVan, D.A.Dugger, M.T.Jakubczak, J., and Miller, W.M. in Proc. 38th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p.146.Google Scholar
48Shea, H.R.Gasparyan, A.White, C.D.Comizzoli, R.B.Abusch-Magder, D., and Arney, S. in Proc. SPIE MEMS Reliability for Critical and Space Applications, Vol. 4180, edited by Lawton, R.A. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 2000) p.117.CrossRefGoogle Scholar
49Frederick, K.M. and Fedder, G.K. in Proc. SPIE MEMS Reliability for Critical and Space Applications, Vol. 4180, edited by Lawton, R.A. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 2000) p.108.CrossRefGoogle Scholar
50Walraven, J.A.Soden, J.M.Cole, E.I. Jr.,Irwin, L.W. and Tanner, D.M. in Proc. SPIE MEMS Reliability for Critical and Space Applications, Vol. 4180, edited by Lawton, R.A. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 2000) p.30.CrossRefGoogle Scholar
51Burns, D.M. and Bright, V.M. in Digest of Technical Papers, Int. Conf. Solid-State Sensors and Actuators, Vol.2 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1997) p. 335.Google Scholar
52Agarwal, A.Arney, S.Barber, B.Kosinski, S.LeGrange, J.Raju, R. and Ruel, R. in Proc. 37th IEEE Int. Reliability Physics Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1999) p.198.Google Scholar