Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-27T01:14:17.086Z Has data issue: false hasContentIssue false
  • English
  • Français

Toward Manufacturing Low-Cost, Large-Area Electronics

Published online by Cambridge University Press:  31 January 2011

Marc Chason ,
Daniel R. Gamota ,
Paul W. Brazis Jr ,
Krishna Kalyanasundaram ,
Jie Zhang ,
Keryn K. Lian  and
Robert Croswell
Get access

Abstract

Developments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.

The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

Keywords

electronic materialfluidicsmicroelectromechanical (MEMS)microelectronicsmicrostructureorganic
Type
Research Article
Information
MRS Bulletin , Volume 31 , Issue 6: Macroelectronics , June 2006 , pp. 471 - 475
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Borland, W.J. and Ferguson, S. in CircuiTree (March 2001) p.94.Google Scholar
2Savic, J.Croswell, R.T.Tungare, A.Dunn, G.Tang, T.Lempkowski, R.Zhang, M. and Lee, T.presented at IPC Printed Circuit Expo (Long Beach, CA, March 25–28, 2002).Google Scholar
3Dunn, G.Savic, J.Bachman, T. and Mo-rooka, I., presented at IPC Printed Circuit Expo (Anaheim, CA, February 21–25, 2004).Google Scholar
4Coombs, C.Printed Circuits Handbook, 5th ed. (McGraw-Hill, New York, 2001).Google Scholar
5Ulrich, R. and Schaper, L.W. eds., Integrated Passive Component Technology (Wiley-IEEE Press, New York, 2003).Google Scholar
6Croswell, R.T.Savic, J.Zhang, M.Tun-gare, A., Herbert, J.Noda, K.Tan, P. and Bauer, W.presented at IPC Printed Circuit Expo (Long Beach, CA, March 25–28, 2002).Google Scholar
7Croswell, R.T.presented at Electronic Circuits World Convention 9 (ECWC9) (Cologne, Germany, October 7–10, 2002).Google Scholar
8Dalmia, S.Ayazi, F.Swaminathan, M.Min, S.H.Lee, S.H.Kim, W.Kim, D.Bhattacharya, S.Sundaram, V.White, G. and Tummala, R. in Proc. 2002 IEEE MTT-S International (IEEE, Pis-cataway, NJ, 2002) p.1405.Google Scholar
9Park, J.Y. and Allen, M.G. “Electroplated and Screen-Printed Magnetic Materials Applicable to Micromachined Magnetic Devices,” presented at SPIE Micromachining & Microfabrica-tion Conf. (1998).CrossRefGoogle Scholar
10Wang, C.Ramadoss, R.Lee, S.Gupta, K.C.Bright, V.M. and Lee, Y.C. in Proc. ASME Int. Mech. Eng. Congress & Expo (ASME, New York, 2001) p.1.Google Scholar
11Chason, M.Skipor, A.Tungare, A. and Gamota, D. “Micro-electro mechanical system,” U.S. Patent No. 6,649,852 (November 19, 2003).Google Scholar
12Eliacin, M.Lian, K.Liu, J. , and Lemp-kowski, R., “Micro electro-mechanical system method,” U.S. Patent 6,714,105 (March 30, 2004).Google Scholar
13Wego, A.Richter, S. and Pagel, L.J. Mi-cromech. Microeng. 11 (2001) p.528.CrossRefGoogle Scholar
14Lian, K.boa, S.Terbrueggen, R.Sadler, D. and Chason, M.presented at APEX (Anaheim, CA, March 31–April 2, 2003).Google Scholar
15Lawrence, D.Kohler, J.Brollier, B.Clay-pole, T., and Burgin, T. in Printed Organic and Molecular Electronics, Ch. 3, edited by Gamota, D.Brazis, P.Kalyanasundaram, K. and Zhang, J. (Kluwer Academic Publishers, New York, 2004) p.169.Google Scholar
16Xu, J. and Wong, C.P.presented at 9th Int. Symp. Adv. Packaging Materials (Atlanta, GA, March 24–26, 2004) p.158.Google Scholar
17McCulloch, I.Heeney, M.Bailey, C.Genevicius, K.MacDonald, I.Shkunov, M.Sparrowe, D.Tierney, S.Wagner, R.Zhang, W.Chabinyc, M.L.Kline, R.J.McGehee, M.D. and Toney, M.F.Nat. Mater. 5 (2006) p.328.Google Scholar