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Power-switching applications beyond silicon: Status and future prospects of SiC and GaN devices

Published online by Cambridge University Press:  08 May 2015

Sima Dimitrijev
Affiliation:
Queensland Micro- and Nanotechnology Centre, Griffith University, Australia; [email protected]
Jisheng Han
Affiliation:
Queensland Micro- and Nanotechnology Centre, Griffith University, Australia; [email protected]
Hamid Amini Moghadam
Affiliation:
Griffith School of Engineering and Queensland Micro- and Nanotechnology Centre, Griffith University, Australia; [email protected]
Amirhossein Aminbeidokhti
Affiliation:
Griffith School of Engineering and Queensland Micro- and Nanotechnology Centre, Griffith University, Australia; [email protected]
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Abstract

This article reviews the development of SiC and GaN devices for power-switching applications in the context of four specifically identified application requirements: (1) high-blocking voltage, (2) high-power efficiency, (3) high-switching speed, and (4) normally OFF operation. Specific device and material characteristics, such as ON resistance, parasitic capacitances, and energy-gap values, are compared and discussed in relation to the identified application requirements. Following a review of the fundamental limitations of silicon as a material, this article describes the material advantages that motivated the development of commercially available Schottky diodes and transistors using SiC. The last section analyzes the potential of GaN to enable further technical progress beyond the theoretical limit of Si and to significantly reduce the cost of power-electronic switches.

Keywords

Type
Research Article
Copyright
Copyright © Materials Research Society 2015 

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References

Dimitrijev, S., Principles of Semiconductor Devices, (Oxford University Press, New York, 2nd ed. 2012).Google Scholar
Rabkowski, J., Peftitsis, D., Nee, H.P., IEEE Applied Power Electronics Conference and Exposition (Orlando, FL, 2012), p. 1536.Google Scholar
Rodriguez, A., Fernandez, M., Vazquez, A., Lamar, D.G., Arias, M., Sebastian, J., IEEE Applied Power Electronics Conference and Exposition (Long Beach, CA, 2013), p. 641.Google Scholar
Biela, J., Schweizer, M., Waffler, S., Kolar, J.W., IEEE Trans. Ind. Electron. 58, 2872 (2011).CrossRefGoogle Scholar
Lidow, A., Strydom, J., de Rooij, M., Reusch, D., GaN Transistors for Efficient Power Conversion (Wiley, New York, 2015).Google Scholar
Dimitrijev, S., Han, J., Haasmann, D., Moghadam, H.A., Aminbeidokhti, A., International Conference on Microelectronics (2014) p. 43.Google Scholar
Deboy, G., März, M., Stengl, J.-P., Strack, H., Tihanyi, J., Weber, H., Proc. IEEE IEDEM (1998), p. 683.Google Scholar
Lai, J.-S., Song, B.-M., Zhou, R., Hefner, A. Jr., Berning, D.W., Shen, C.-C., IEEE Trans. Ind. Appl. 37, 1282 (2001).Google Scholar
Lorenz, L., Deboy, G., Knapp, A., Miirz, M., International Symposium on Semiconductor Devices and ICs (1999), p. 3.Google Scholar
Baliga, B.J., IEEE Electron Device Lett. 10, 455 (1989).CrossRefGoogle Scholar
Shenai, K., Scott, R.S., Baliga, B.J., IEEE Trans. Electron Devices 36, 1811 (1989).CrossRefGoogle Scholar
Elasser, A., Chow, T.P., Proc. IEEE 90, 969 (2002).CrossRefGoogle Scholar
Ferry, D.K., Phys. Rev. B: Condens. Matter 12, 2361 (1975).CrossRefGoogle Scholar
Cheng, L., Palmour, J.W., Agarwal, A.K., Allen, S.T., Brunt, E.V., Wang, G., Pala, V., Sung, W., Huang, A.Q., O’Loughlin, M., Burk, A., Grider, D., Scozzie, C., Mater. Sci. Forum 778–780, 1089 (2014).CrossRefGoogle Scholar
Li, H.-F., Dimitrijev, S., Harrison, H.B., Sweatman, D., Appl. Phys. Lett. 70, 2028 (1997).CrossRefGoogle Scholar
Dimitrijev, S., Harrison, B., Tanner, P., Cheong, K., Han, J., in Silicon Carbide: Recent Major Advances, Choyke, W.J., Matsunami, H., Pensl, G., Eds. (Springer, Berlin, 2003), pp. 373386.Google Scholar
Chung, G.Y., Tin, C.C., Williams, J.R., McDonald, K., Chanana, R.K., Weller, R.A., Pantelides, S.T., Feldman, L.C., Holland, O.W., Das, M.K., Palmour, J.W., IEEE Electron Device Lett. 22, 176 (2001).CrossRefGoogle Scholar
Schorner, R., Friedrichs, P., Peters, D., Stephani, D., Dimitrijev, S., Jamet, P., Appl. Phys. Lett. 80, 4253 (2002).CrossRefGoogle Scholar
Chung, G.Y., Tin, C.C., Williams, J.R., McDonald, K., Di Ventra, M., Pantelides, S.T., Feldman, L.C., Weller, R.A., Appl. Phys. Lett. 76, 1713 (2000).CrossRefGoogle Scholar
Chung, G.Y., Williams, J.R., Isaacs-Smith, T., Ren, F., McDonald, K., Feldman, L.C., Appl. Phys. Lett. 81, 4266 (2002).CrossRefGoogle Scholar
Baliga, B.J., Semicond. Sci. Technol. 28, 074011 (2013).CrossRefGoogle Scholar
Su, M., Chen, C., Rajan, S., Semicond. Sci. Technol. 28, 074012 (2013).CrossRefGoogle Scholar
Scott, M.J., Fu, L., Zhang, X., Li, J., Yao, C., Sievers, M., Wang, J., Semicond. Sci. Technol. 28, 074013 (2013).CrossRefGoogle Scholar
Karmalkar, S., Deng, J., Shur, M.S., Gaska, R., IEEE Electron Device Lett. 22, 373 (2001).CrossRefGoogle Scholar
Saito, W., Takada, Y., Kuraguchi, M., Tsuda, K., Omura, I., Ogura, T., Ohashi, H., IEEE Trans. Electron Devices 50, 2528 (2003).CrossRefGoogle Scholar
Cao, W., Biser, J.M., Ee, Y.-K., Li, X.-H., Tansu, N., Chan, H.M., Vinci, R.P., J. Appl. Phys. 110, 053505 (2011).CrossRefGoogle Scholar
Chang, H.-M., Lai, W.-C., Chang, S.-J., J. Disp. Technol. 9, 292 (2013).CrossRefGoogle Scholar
Wang, M.-T., Liao, K.-Y., Li, Y.-L., IEEE Photonics Technol. Lett. 23, 962 (2011).CrossRefGoogle Scholar
Pelá, R.R., Caetano, C., Marques, M., Ferreira, L.G., Furthmüller, J., Teles, L.K., Appl. Phys. Lett. 98, 151907 (2011).CrossRefGoogle Scholar
Ren, F., Zolper, J.C., Wide Energy Bandgap Electronic Devices (World Scientific, Singapore, 2003).CrossRefGoogle Scholar
Ambacher, O., Smart, J., Shealy, J.R., Weimann, N.G., Chu, K., Murphy, M., Schaff, W.J., Eastman, L.F., Dimitrov, R., Wittmer, L., Stutzmann, M., Rieger, W., Hilsenbeck, J., J. Appl. Phys. 85, 3222 (1999).CrossRefGoogle Scholar
Wang, D.-P., Wu, C.-C., Wu, C.-C., Appl. Phys. Lett. 89, 161903 (2006).CrossRefGoogle Scholar
Wang, L., Dimitrijev, S., Han, J., Iacopi, A., Hold, L., Tanner, P., Harrison, H.B., Thin Solid Films 519, 6443 (2011).CrossRefGoogle Scholar
Huang, X., Liu, Z., Li, Q., Lee, F.C., IEEE Trans. Power Electron. 29, 2453 (2014).CrossRefGoogle Scholar
Huang, X., Li, Q., Liu, Z., Lee, F.C., IEEE Trans. Power Electron. 29, 2208 (2014).CrossRefGoogle Scholar
Cai, Y., Zhou, Y., Lau, K.M., Chen, K.J., IEEE Trans. Electron Devices 53, 2207 (2006).CrossRefGoogle Scholar
Chen, K.J., Zhou, C., Phys. Status Solidi A 208, 434 (2011).CrossRefGoogle Scholar
Hahn, H., Reuters, B., Kalisch, H., Vescan, A., Semicond. Sci. Technol. 28, 074017 (2013).CrossRefGoogle Scholar
Palacios, T., Suh, C.-S., Chakraborty, A., Keller, S., DenBaars, S.P., Mishra, U.K., IEEE Electron Device Lett. 27, 428 (2006).CrossRefGoogle Scholar
Hilt, O., Kotara, P., Brunner, F., Knauer, A., Zhytnytska, R., Würfl, J., IEEE Trans. Electron Devices 60, 3084 (2013).CrossRefGoogle Scholar
Jurkovič, M., Gregušová, D., Palankovski, V., Haščík, Š., Blaho, M., Čičo, K., Fröhlich, K., Carlin, J.-F., Grandjean, N., Kuzmík, J., IEEE Trans. Electron Devices 34, 432 (2013).CrossRefGoogle Scholar
Zhou, C., Chen, W., Piner, E.L., Chen, K.J., IEEE Trans. Electron Devices 31, 668 (2010).CrossRefGoogle Scholar
Dong, Z., Tan, S., Cai, Y., Chen, H., Liu, S., Xu, J., Xue, L., Yu, G., Wang, Y., Zhao, D., Hou, K., Chen, K.J., Zhang, B., Electron. Lett. 49 (2013).Google Scholar
Liu, S., Yu, G., Fu, K., Tan, S., Zhang, Z., Zeng, C., Hou, K., Huang, W., Cai, Y., Zhang, B., Yuan, J., Electron. Lett. 50, 1322 (2014).CrossRefGoogle Scholar
Brown, R., Macfarlane, D., Al-Khalidi, A., Li, X., Ternent, G., Zhou, H., Thayne, I., Wasige, E., IEEE Trans. Electron Devices 35, 906 (2014).CrossRefGoogle Scholar
Taking, S., MacFarlane, D., Wasige, E., IEEE Trans. Electron Devices 58, 1418 (2011).CrossRefGoogle Scholar
Liu, H.-Y., Chou, B.-Y., Hsu, W.-C., Lee, C.-S., Sheu, J.-K., Ho, C.-S., IEEE Trans. Electron Devices 60, 213 (2013).CrossRefGoogle Scholar