Hostname: page-component-cd9895bd7-8ctnn Total loading time: 0 Render date: 2024-12-23T16:25:55.707Z Has data issue: false hasContentIssue false

Heat-assisted magnetic recording media materials

Published online by Cambridge University Press:  09 February 2018

K. Hono
Affiliation:
Research Center for Magnetic and Spintronic Materials, National Institute for Materials Science, Japan; [email protected]
Y.K. Takahashi
Affiliation:
Magnetic Recording Materials Group, National Institute for Materials Science, Japan; [email protected]
Ganping Ju
Affiliation:
Recording Media Research Center, Seagate Technology, USA; [email protected]
Jan-Ulrich Thiele
Affiliation:
Seagate Technology, USA; [email protected]
Antony Ajan
Affiliation:
Magnetic Recording Media Division, Western Digital Corporation, USA; [email protected]
XiaoMin Yang
Affiliation:
Seagate Technology, USA; [email protected]
Ricardo Ruiz
Affiliation:
Western Digital Corporation, USA; [email protected]
Lei Wan
Affiliation:
Western Digital Corporation, USA; [email protected]
Get access

Abstract

Heat-assisted magnetic recording (HAMR) is being developed as the next-generation magnetic recording technology. High anisotropy granular media such as FePt-C have been demonstrated as HAMR media for ∼2 Tbpsi (terabits per in2) recording density. In order for this technology to reach its full potential of 4–5 Tbpsi, more progress and innovations are needed for the key requirements for HAMR media, including microstructure, design, magnetic distribution, and thermal design. Beyond granular media, heated-dot magnetic recording (HDMR) is planned to extend areal density toward 10 Tbpsi. HDMR combines similar advanced recording layer materials with advanced patterning techniques to fabricate <10-nm rectangular dot media.

Type
Materials for Heat-Assisted Magnetic Recording
Copyright
Copyright © Materials Research Society 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Kryder, M.H., Gage, E.C., McDaniel, T.W., Challener, W.A., Rottmayer, R.E., Ju, G., Hsia, Y.T., Erden, M.F., Proc. IEEE 96, 1810 (2008).CrossRefGoogle Scholar
Peng, Y., Klemmer, T.J., Ju, G., Gage, E., Seigler, M.A., Challener, W.A., Karns, D.C., Zhu, X., Gokemeijer, N., Peng, C., Pelhos, K., Lu, B., Rausch, T., Wu, X.W., Li, L., Hsia, Y.T., Buechel, D., Hempstead, R.D., Rottmayer, R., Proc. IEEE Conf. Nanotechnol. (NANO) (August 2008), p. 603.Google Scholar
Weller, D., Moser, A., IEEE Trans. Magn. 35, 4423 (1999).CrossRefGoogle Scholar
Weller, D., Parker, G., Mosendz, O., Champion, E., Stipe, B., Wang, X., Klemmer, T., Ju, G., Ajan, A., IEEE Trans. Magn. 50, 3100108 (2014).CrossRefGoogle Scholar
Ju, G., Peng, Y., Chang, E.K.C., Ding, Y., Wu, A.Q., Zhu, X., Kubota, Y., Klemmer, T.J., Amini, H., Gao, L., Fan, Z., Rausch, T., Subedi, P., Ma, M., Kalarickal, S., Rea, C.J., Dimitrov, D.V., Huang, P.W., Wang, K., Chen, X., Peng, C., Chen, W., Dykes, J.W., Seigler, M.A., Gage, E.C., Chantrell, R., Thiele, J.-U., IEEE Trans. Magn. 51, 3201709 (2015).Google Scholar
Varaprasad, B.S.D.Ch.S., Takahashi, Y.K., Hono, K., JOM 65, 853 (2013).CrossRefGoogle Scholar
Granz, S., Zhu, W.Z., Rea, C., Ju, G., Thiele, J.U., Rausch, T., Gage, E., Dig. TMRC 2017 (Tsukuba, Japan, August 2–4, 2017), p. 60.Google Scholar
Rea, C., Subedi, P., Zhou, H., Saunders, D., Cordle, M., Lu, P.-L., Granz, S., Czoschke, P.J., Hernandez, S., Jury, J., Peng, Y., Thiele, J.-U., Wu, A.Q., Ju, G., Rausch, T., Seigler, M., Gage, E., IEEE Trans. Magn. 53 (2), 3000607 (2017).Google Scholar
Watanabe, M., Masumoto, T., Ping, D.H., Hono, K., J. Appl. Phys. 76, 3971 (2000).Google Scholar
Ko, H.S., Perumal, A., Shin, S.-C., Appl. Phys. Lett. 82, 2311 (2003).CrossRefGoogle Scholar
Perumal, A., Takahashi, Y.K., Hono, K., Appl. Phys. Express 1, 101301 (2008).CrossRefGoogle Scholar
Zhang, L., Takahashi, Y.K., Perumal, A., Hono, K., J. Magn. Magn. Mater. 322, 2658 (2010).CrossRefGoogle Scholar
Varaprasad, B.S.D.C.S., Takahashi, Y.K., Wang, J., Ina, T., Nakamura, T., Ueno, W., Nitta, K., Uruga, T., Hono, K., Appl. Phys. Lett. 104, 222403 (2014).CrossRefGoogle Scholar
Mosendz, O., Pisana, S., Reiner, J.W., Stipe, B.C., Weller, D., J. Appl. Phys. 111, 07B729 (2012).CrossRefGoogle Scholar
Pisana, S., Mosendz, O., Parker, G.J., Reiner, J.W., Santos, T.S., McCallum, A.T., Richter, H.J., Weller, D., J. Appl. Phys. 113, 043910 (2013).CrossRefGoogle Scholar
Weller, D., Parker, G., Mosendz, O., Lyberatos, A., Mitin, D., Safonova, N.Y., Albrecht, M., J. Vac. Sci. Technol. B 34, 060801 (2016).CrossRefGoogle Scholar
Varaprasad, B.S.D.C.S., Chen, M., Takahashi, Y.K., Hono, K., IEEE Trans. Magn. 49, 718 (2013).CrossRefGoogle Scholar
Hellwig, O., “Challenges in Developing FePt L10 Granular Thin Film Media for Heat Assisted Magnetic Recording (HAMR),” Intermag 2015 (Beijing, China, May 11–15, 2015), p. AA-05.CrossRefGoogle Scholar
Varaprasad, B.S.D.Ch.S., Wang, J., Shiroyama, T., Takahashi, Y.K., Hono, K., IEEE Trans. Magn. 51, 3200904 (2015).CrossRefGoogle Scholar
Pandey, H., Perumal, A., Wang, J., Takahashi, Y.K., Hono, K., IEEE Trans. Magn. 52, 3201004 (2017).Google Scholar
Wicht, S., Neu, V., Schultz, L., Weller, D., Mosendz, O., Parker, G., Pisana, S., Rellinghaus, B., J. Appl. Phys. 114, 063906 (2013).CrossRefGoogle Scholar
Ho, H., Zhu, J., Kulovits, A., Laughlin, D.E., Zhu, J.G., J. Appl. Phys. 116, 193510 (2014).CrossRefGoogle Scholar
Wang, J., Hata, S., Takahashi, Y.K., Sepehri-Amin, H., Varaprasad, B.S.D.Ch.S., Shiroyama, T., Schrefl, T., Hono, K., Acta Mater. 91, 41 (2015).CrossRefGoogle Scholar
Pandey, H., Wang, J., Shiiroyama, T., Varaprasad, B.S.D.Ch.S., Sepehri-Amin, H., Takahashi, Y.K., Perumal, A., Hono, K., IEEE Trans. Magn. 52, 3200108 (2016).Google Scholar
Chapline, M., Papusoi, C., Ajan, A., Dorsey, P., Desai, M., Acharya, R., IEEE Trans. Magn. 52, 3200204 (2016).CrossRefGoogle Scholar
Chernyshov, A., Treves, D., Le, T., Papusoi, C., Yuan, H., Ajan, A., Acharya, R., IEEE Trans. Magn. 49, 3572 (2013).CrossRefGoogle Scholar
Zhu, J.G., Li, H., IEEE Trans. Magn. 51, 43200407 (2015).Google Scholar
Liu, Z., Jiao, Y., Victora, R.H., Appl. Phys. Lett. 108, 232402 (2016).CrossRefGoogle Scholar
Stipe, B.C., Strand, T.C., Poon, C.C., Balamane, H., Boone, T.D., Katine, J.A., Li, J.-L., Rawat, V., Nemoto, H., Hirotsune, A., Hellwig, O., Ruiz, R., Dobisz, E., Kercher, D.S., Robertson, N., Albrecht, T.R., Terris, B.D., Nat. Photonics 4 (7), 484 (2010).CrossRefGoogle Scholar
Kuo, D., Lee, K., Yang, X., Xiao, S., Hsu, Y., Yu, Z., Feldbaum, M., Klemmer, T., Kubota, Y., Thiele, J., Steiner, P., Wago, K., Dallorto, S., Olynick, D., TMRC 2016 (August 17–16, 2016, Stanford, CA), B5, p. 37.Google Scholar
Yang, X., Xiao, S., Hu, W., Hwu, J., Veerdonk, R., Wago, K., Lee, K., Kuo, D., Nanotechnology 25, 395301 (2014).CrossRefGoogle Scholar
Albrecht, T.R., Arora, H., Ayanoor-Vitikkate, V., Beaujour, J., Bedau, D., Berman, D., Bogdanov, A.L., Chapuis, Y., Cushen, J., Dobisz, E.E., Doerk, G., Gao, H., Grobis, M., Gurney, B., Hanson, W., Hellwig, O., Hirano, T., Jubert, P., Kercher, D., Lille, J., Liu, Z., Mate, C.M., Obukhov, Y., Patel, K.C., Rubin, K., Ruiz, R., Schabes, M., Wan, L., Weller, D., Wu, T., Yang, E., IEEE Trans. Magn. 51, 1 (2015).CrossRefGoogle Scholar
Ruiz, R., Dobisz, E., Albrecht, T.R., ACS Nano 5, 79 (2011).CrossRefGoogle Scholar
Wan, L., Ruiz, R., Gao, H., Patel, K.C., Lille, J., Zeltzer, G., Dobisz, E., Bogdanov, A., Nealey, P.F., Albrecht, T.R., J. Micro/Nanolithogr. MEMS MOEMS 11, 031405 (2012).CrossRefGoogle Scholar
Lille, J., Ruiz, R., Wan, L., Gao, H., Dhanda, A., Zeltzer, G., Arnoldussen, T., Patel, K., Tang, Y., Kercher, D., Albrecht, T.R., IEEE Trans. Magn. 48, 2757 (2012).CrossRefGoogle Scholar
Wan, L., Ruiz, R., Gao, H., Patel, K.C., Albrecht, T.R., Yin, J., Kim, J., Cao, Y., Lin, G., ACS Nano 9, 7506 (2015).CrossRefGoogle Scholar
Doerk, G.S., Gao, H., Wan, L., Lille, J., Patel, K.C., Chapuis, Y.A., Ruiz, R., Albrecht, T.R., Nanotechnology 26, 9 (2015).CrossRefGoogle Scholar
Albrecht, T.R., Bedau, D., Dobisz, E., He, G., Grobis, M., Hellwig, O., Kercher, D., Lille, J., Marinero, E., Patel, K., Ruiz, R., Schabes, M.E., Lei, W., Weller, D., Tsai-Wei, W., IEEE Trans. Magn. 49, 773 (2013).CrossRefGoogle Scholar
Xiong, S., Wan, L., Ishida, Y., Chapuis, Y.-A., Craig, G.S.W., Ruiz, R., Nealey, P.F., ACS Nano 10, 7855 (2016).CrossRefGoogle Scholar
Lane, A.P., Yang, X., Maher, M.J., Blachut, G., Asano, Y., Someya, Y., Mallavarapu, A., Sirard, S.M., Ellison, C.J., Willson, C.G., ACS Nano 11, 7656 (2017).CrossRefGoogle Scholar