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Aspects of Thin-Film Superlattice Thermoelectric Materials, Devices, and Applications

Published online by Cambridge University Press:  31 January 2011

Harald Böttner ,
Gang Chen  and
Rama Venkatasubramanian
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Abstract

Superlattices consist of alternating thin layers of different materials stacked periodically.The lattice mismatch and electronic potential differences at the interfaces and resulting phononand electron interface scattering and band structure modifications can be exploited to reduce phonon heat conduction while maintaining or enhancing the electron transport.This article focuses on a range of materials used in superlattice form to improve the thermoelectric figure of merit.

Keywords

thermal conductivitythermoelectricity
Type
Research Article
Information
MRS Bulletin , Volume 31 , Issue 3: Harvesting Energy through Thermoelectrics: Power Generation and Cooling , March 2006 , pp. 211 - 217
Copyright
Copyright © Materials Research Society 2006

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References

1.Proc. 1st Natl. Thermogenic Cooler Workshop, edited by Horn, S.B. (Center for Night Vision and Electro-Optics, Fort Belvoir, VA, 1992).Google Scholar
2.Hicks, D. and Dresselhaus, M.S.Phys. Rev. B 47 (1993) p.12727.CrossRefGoogle Scholar
3.Venkatasubramanian, R.Siivola, E.Colpitts, T. and O'Quinn, B., Nature 413 (2001) p.597.CrossRefGoogle Scholar
4.Harman, T.C.Taylor, P.Walsh, M.P. and LaForge, B.E.Science 297 (2002) p.2229.CrossRefGoogle Scholar
5.Chen, G.Semicond. Semimetals 71 (2001) p.203.CrossRefGoogle Scholar
6.Venkatasubramanian, R.Semicond. Semimet-als 71 (2001) p.175.CrossRefGoogle Scholar
7.Moyzhes, B. and Nemchinsky, V.Appl. Phys. Lett. 73 (1998) p.1895.CrossRefGoogle Scholar
8.Shakouri, A. and Bowers, J.E.Appl. Phys. Lett. 71 (1997) p.1234.CrossRefGoogle Scholar
9.Beyer, H.Lambrecht, A.Wagner, E.Bauer, G.Böttner, H., and Nurnus, J.Physica E 13 (2002) p.965.CrossRefGoogle Scholar
10.Lee, S.M.Cahill, D.G. and Venkatasubra-manian, R., Appl. Phys. Lett. 70 (1997) p.2957.CrossRefGoogle Scholar
11.Borca-Tasciuc, T., Liu, W.L.Zeng, T.Song, D.W.Moore, C.D.Chen, G.Wang, K.L.Goorsky, M.S.Radetic, T.Gronsky, R.Koga, T. and Dresselhaus, M.S.Superlattices Microstruct. 28 (2000) p.119.Google Scholar
12.Zeng, G.H.Shakouri, A.Bounty, C. La, Robinson, G.Croke, E.Abraham, P.Fan, X.F.Reese, H. and Bowers, J.E.Electron. Lett. 35 (1999) p.2146.CrossRefGoogle Scholar
13.Cho, S.Kim, Y.Youn, S.J.DiVenere, A.Wong, G.K.L.Freeman, A.J.Ketterson, J.B.Olafsen, L.J.Vurgaftman, I.Meyer, J.R. and Hoffman, C.A.Phys. Rev. B 64 235330 (2001).Google Scholar
14.Dresselhaus, M.S.Lin, Y.M.Cronin, S.B.Rabin, O.Black, M.R.Dresselhaus, G. and Koga, T.Semicond. Semimetals 71 (2001) p.1.CrossRefGoogle Scholar
15.Nurnus, J., Böttner, H., and Lambrecht, A. in Handbook of Thermoelectrics, edited by Rowe, M. Chapter 46 (CRC Press, Boca Raton, FL, 2005) p.1.Google Scholar
16.Mahan, D.Semicond. Semimetals 71 (2001) p.157.Google Scholar
17.Dresselhaus, M.S.Dresselhaus, G.Sun, X.Zhang, Z.Cronin, S.B.Koga, T.Ying, J.Y. and Chen, G.Microscale Thermophys. Eng. 3 (1999) p.89.CrossRefGoogle Scholar
18.Chen, G.Dresselhaus, M.S.Fleurial, J.-P. and Caillat, T.Int. Mater. Rev. 48 (2003) p.45.CrossRefGoogle Scholar
19.Chen, G. and Shakouri, A.J. Heat Transfer 124 (2001) p.242.Google Scholar
20.Springholz, G.Holzinger, A.Krenn, H.Clemens, H.Bauer, G.Böttner, H., Norton, P. and Maier, M.J.Cryst. Growth 113 (1991) p.593.Google Scholar
21.Lambrecht, A.Böttner, H., Agne, M.Kurbel, R.Fach, A.Halford, B.Schiessl, U. and Tacke, M.Semicond. Sci. Technol. 8 (1993) p.334.CrossRefGoogle Scholar
22.Venkatasubramanian, R.Colpitts, T.O'Quinn, B., Lamvik, M. and El-Masry, N., Appl. Phys. Lett. 75 (1999) p.1104.CrossRefGoogle Scholar
23.Nurnus, J.Beyer, H.Lambrecht, A. and Böttner, H., in Thermoelectric Materials 2000—The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications, edited by Tritt, T.M.Nolas, G.S.Mahan, G.D.Man-drus, D., and Kanatzidis, M.G. (Mater. Res. Soc. Proc. 626, Warrendale, PA, 2000) p.Z2.1.1.Google Scholar
24.Cui, H.Bhat, I.O'Quinn, B., and Venkata-subramanian, R., J. Electron. Mater. 30 (2001) p.1376.CrossRefGoogle Scholar
25.Mzerd, A.Sayah, D.Brun, G.Tedenac, J.C. and Boyer, A.J. Mater. Sci. Lett. 14 (1995) p.194.CrossRefGoogle Scholar
26.Mzerd, A.Sayah, D.Tedenac, J.C. and Boyer, A.Int. J.Electron. 77 (1993) p.291.CrossRefGoogle Scholar
27.Boikov, Y.A.Danilov, V.A.Claeson, T. and Erts, D. in Proc. ICT'97 (IEEE, New York, 1997) p.89.Google Scholar
28.Foucaran, A.Giani, A.Pascal-Delannoy, F., Boyer, A. and Sackda, A.Mater. Sci. Eng., B 52 (1998) p.154.CrossRefGoogle Scholar
29.Völklein, F., Baier, V.Dillner, U. and Kessler, E.Thin Solid Films 187 (1990) p.253.CrossRefGoogle Scholar
30.Das, V.D. and Ganesan, P.-G. in Proc. 16th Int. Conf. Thermoelectrics (IEEE, New York, 1997) p.147.Google Scholar
31.Zou, H.Rowe, M. and Min, G. in Proc. ICT'00 (IEEE, Piscataway, NJ, 2002) p.251.Google Scholar
32.Da Silva, L.W., Kaviany, M.DeHennis, A. and Dyck, J.S. in Proc. ICT'03 (IEEE, Piscataway, NJ, 2003) p.665.Google Scholar
33.Nurnus, J.Böttner, H., Beyer, H. and Lambrecht, A. in Proc. ICT'99 (IEEE, Piscataway, NJ, 1999) p.696.Google Scholar
34.Fleurial, J.P.Gailliard, L. and Triboulet, R.J. Phys. Chem. Solids 49 (1988) p.1237.CrossRefGoogle Scholar
35.Böttner, H., Schubert, A.Kölbel, H., Gavrikov, A.Mahlke, A. and Nurnus, J. in Proc. ICT'04, CD-ROM, Paper No. 009 (IEEE, Piscataway, NJ, 2004).Google Scholar
36.Harris, F.R.Standridge, S.Feik, C. and Johnson, D.C.Angew. Chem. Int. Ed. Engl. 42 (2003) p.5295.CrossRefGoogle Scholar
37.Chitroub, M.Scherrer, S. and Scherrer, H.J.Phys. Chem. Solids 62 (2000) p.1693.CrossRefGoogle Scholar
38.Lambrecht, A.Beyer, H.Nurnus, J.Künzel, C., and Böttner, H., in Proc. ICT'01 (IEEE, Piscataway, NJ, 2001) p.335.Google Scholar
39.Lambrecht, A.Herres, N.Spanger, B.Kuhn, S.Böttner, H., Tacke, M. and Evers, J.J.Cryst. Growth 108 (1991) p.301.CrossRefGoogle Scholar
40.Springholz, G.Holy, V.Pinczolits, M. and Bauer, G.Science 282 (1998) p.734.CrossRefGoogle Scholar
41.Zogg, H. and Hüppi, M., Appl. Phys. Lett. 47 (1985) p.47.CrossRefGoogle Scholar
42.Harman, T.C.Spears, D.L. and Manfra, M.J.J.Electron. Mater. 25 (1996) p.1121.CrossRefGoogle Scholar
43.Harman, T.C.Spears, D.L.Calawa, D.R. and Groves, S.H. in Proc. 16th Int. Conf. Thermo-electrics (IEEE, New York, 1997) p.416.Google Scholar
44.Harman, T.C.Spears, D.L. and Walsh, M.P.J.Electron. Mater. Lett. 28 (1999) p.L1.CrossRefGoogle Scholar
45.Harman, T.C.Taylor, P.J.Spears, D.L. and Walsh, M.P.J.Electron. Mater. 29 (2000) p.L1.CrossRefGoogle Scholar
46.Beyer, H.Nurnus, J.Böttner, H., Lambrecht, A.Roch, T. and Bauer, G.Appl. Phys. Lett. 80 (2002) p.1216.CrossRefGoogle Scholar
47.Caylor, J.C.Coonley, K.Stuart, J., Nangoy, S.Colpitts, T. and Venkatasubramanian, R. in Proc. 24th Int. Conf. Thermoelectrics (IEEE, Piscataway, NJ, 2005).Google Scholar
48.Peranio, N.Eibl, O. and Nurnus, J. in Proc. 23rd Int. Conf. Thermoelectrics CD-ROM, Paper No.1059 (IEEE, Piscataway, NJ, 2004).Google Scholar
49.Caylor, J.C.Dander, M.S.Stacy, A.M.Harper, J.S.Gronsky, R. and Sands, T.J. Mater. Res. 16 (2001) p.2467.CrossRefGoogle Scholar
50.Liu, W.L.Borca-Tasciuc, T., Chen, G.Liu, J.L. and Wang, K.L.J.Nanosci. Nanotechnol. 1 (2001) p.39.CrossRefGoogle Scholar
51.Song, D.W.Chen, G.Cho, S.Kim, Y. and Ketterson, J. in Thermoelectric Materials 2000—The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications, edited by Tritt, T.M.Nolas, G.S.Mahan, G.D.Mandrus, D. and Kanatzidis, M.G. (Mater. Res. Soc. Proc. 626, Warrendale, PA, 2000) p.Z9.1.1.Google Scholar
52.Song, D.W.Liu, W.L.Zeng, T.Borca-Tasciuc, T., Chen, G.Caylor, C. and Sands, T.D.Appl. Phys. Lett. 77 (2000) p.3854.Google Scholar
53.Chen, G.Yang, B.Liu, W.L.Borca-Tasciuc, T., Song, D.Achimov, D.Dresselhaus, M.S., Liu, J.L. and Wang, K.L.Proc. 20th Int. Conf. Thermoelectrics (IEEE, Piscataway, NJ, 2001) p.30.Google Scholar
54.Lee, S.M. and Cahill, D.G.J. Appl. Phys. 81 (1997) p.2590.CrossRefGoogle Scholar
55.Capinski, W.S.Maris, H.J.Ruf, T.Cardona, M.Ploog, K. and Katzer, D.S.Phys. Rev. B59 (1999) p.8105.CrossRefGoogle Scholar
56.Harman, T.C.J. Appl. Phys. 29 (1958) p.1373.CrossRefGoogle Scholar
57.Tellier, C.R. and Tosser, A.J.Size Effects in Thin Films (Elsevier, Amsterdam, 1982).Google Scholar
58.Chen, G.J.Heat Transfer 119 (1997) p.220.CrossRefGoogle Scholar
59.Chen, G.Phys. Rev. B. 57 (1998) p.14958.CrossRefGoogle Scholar
60.Hyldgaard, P. and Mahan, G.D.Phys. Rev. B56 (1997) p.10754.CrossRefGoogle Scholar
61.Tamura, S.Tanaka, Y. and Maris, H.J.Phys. Rev. B 60 (1999) p.2627.Google Scholar
62.Yang, B. and Chen, G.Microscale Thermo-phys. Eng. 5 (2001) p.107.Google Scholar
63.Simkin, M.V. and Mahan, G.D.Phys. Rev. Lett. 84 (2000) p.927.CrossRefGoogle Scholar
64.Yang, B. and Chen, G.Phys. Rev. B 67 195311 (2003).Google Scholar
65.Daly, B.C.Maris, H.J.Imamura, K. and Tamura, S.Phys. Rev. B 66 024301 (2002).CrossRefGoogle Scholar
66.Venkatasubramanian, R.Phys. Rev. B 61 (2000) p.3091.CrossRefGoogle Scholar
67.Yang, B. and Chen, G. in Chemistry, Physics, and Materials Science for Thermoelectric Materials: Beyond Bismuth Telluride, edited by Kanatzidis, M.G.Hogan, T.P. and Mahanti, S.D. (Kluwer Academic/Plenum, NY, 2003) p. 147.CrossRefGoogle Scholar
68.Venkatasubramanian, R.Siivola, E.O'Quinn, B., Coonley, K.Addepalli, P.Caylor, C.Reddy, A. and Alley, R.Proc. 24th Int. Conf. Ther-moelectrics (IEEE, Piscataway, NJ, 2005).Google Scholar
69.Venkatasubramanian, R.Siivola, E.O'Quinn, B.C., Coonley, K.Addepalli, P.Napier, M.Colpitts, T. and Mantini, M.Proc. 2003 ACS Symp. Nanotechnol. Environ., ACS Symposium Series 890 (American Chemical Society, Washington, DC, 2004) p.347.Google Scholar
70.Völklein, F., Blumers, M. and Schmitt, L.Proc. 18th Int. Conf. Thermoelec. (IEEE, Piscataway, NJ, 1999) p.285.Google Scholar
71.Nurnus, J.Böttner, H., Künzel, C., Vetter, U.Lambrecht, A.Schumann, J. and Völklein, F., Proc. 21st Int. Conf. Thermoelectrics (IEEE, Piscataway, NJ, 2002) p.523).Google Scholar
72.Alley, R.Canchhevaram, J.Coonley, K.O'Quinn, B., Posthill, J.Siivola, E. and Venkatasubramanian, R.Proc. 24th Int. Conf. Ther-moelectrics (IEEE, Piscataway, NJ, 2005).Google Scholar
73.Lin, Y.-M. and Dresselhaus, M.S.Phys. Rev. B 60 075304 (2003).CrossRefGoogle Scholar