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High resistive state retention in room temperature solution processed biocompatible memory devices for health monitoring applications

Published online by Cambridge University Press:  15 March 2019

Akshita Mishra
Affiliation:
Functional Materials & Devices Laboratory, Department of Electrical Engineering, IIT Delhi, Hauz Khas, New Delhi, India, 110016
Soumen Saha
Affiliation:
Functional Materials & Devices Laboratory, Department of Electrical Engineering, IIT Delhi, Hauz Khas, New Delhi, India, 110016
Henam Sylvia Devi
Affiliation:
Functional Materials & Devices Laboratory, Department of Electrical Engineering, IIT Delhi, Hauz Khas, New Delhi, India, 110016
Abhisek Dixit
Affiliation:
Wafer Level Characterization Laboratory, Department of Electrical Engineering, IIT Delhi, Hauz Khas, New Delhi, India,110016
Madhusudan Singh*
Affiliation:
Functional Materials & Devices Laboratory, Department of Electrical Engineering, IIT Delhi, Hauz Khas, New Delhi, India, 110016
*
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Abstract

Wearable and bio-implantable health monitoring applications require flexible memory devices that can be used to locally store body vitals prior to transmission or to support local data processing in distributed smart systems. In recent years, non-volatile resistive random access memories composed of oxide-based insulators such as hafnium oxide and niobium pentoxide have attracted a great deal of interest. Unfortunately, hafnium and niobium are not low-cost materials and may also present health challenges. In this work, we have explored the alternative of using titanium dioxide as the insulating oxide using a low-cost solution-phase deposition process. Aqueous sol deposited thin films were deposited on standard RCA-cleaned commercial thermal silicon dioxide (500 nm) wafer (500 µm). Patterned bottom contacts Cr/Au (∼200/300 Å) using shadow masks were deposited on the substrate using successive DC sputtering, and thermal evaporation, respectively at 5 X 10-6 Torr. A sol was prepared using titanium (IV) butoxide as precursor hydrolysed under water and ethanol to form a colloidal solution (sol) at 50°C under constant stirring. Powder X-Ray Diffraction (PXRD) scans of calcined (from sol at 750°C) nanoparticles show a mixture of anatase and rutile phases, confirming the composition of the material. The sol was slowly cooled to room temperature before being spin coated at low rotational speeds on to the substrate in multiple steps involving several spin coating and drying steps to form a uniform film. Top contacts (Ag) of thickness (∼500 Å) were deposited on the sol-deposited thin films using thermal evaporation. The resulting devices were coated with a thick layer of polydimethylsiloxane (PDMS) using a 10:1 ratio of base elastomer and curing agent respectively. After drying the PDMS, resistance measurements were carried out. A high resistance state was detected prior to electroforming in the air at ∼5 MΩ which remains nearly unchanged (∼4.3 MΩ) when dipped in a ∼7.4 pH phosphate buffer solution (equivalent to human blood’s pH (reference average value ∼7.4 pH)). Unencapsulated devices (UM1) were further characterized in air using a Keithley 4200-SCS semiconductor parameter analyzer in dual sweep mode to observe repeatable hysteresis behavior with a large difference between trace and retrace R-V characteristics (∼50±3% over a pristine device), which compares favorably with recent data in the literature on high-performance sputtered TiO2 memristors. Unchanged retention ratio using biocompatible device materials and encapsulation suggests that these devices can be used for biomedical implantable sensor electronics.

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Articles
Copyright
Copyright © Materials Research Society 2019 

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References

References:

Wang, Y., Zhu, C., Pfattner, R., Yan, H., Jin, L., Chen, S., Molina-Lopez, F., Lissel, F., Liu, J., Rabiah, N.I., Chen, Z., Chung, J.W., Linder, C., Toney, M.F., Murmann, B., and Bao, Z., Sci. Adv. 3, e1602076 (2017).CrossRefGoogle Scholar
Park, J., Lee, Y., Hong, J., Lee, Y., Ha, M., Jung, Y., Lim, H., Kim, S.Y., and Ko, H., ACS Nano 8, 12020 (2014).CrossRefGoogle Scholar
Hwang, G.-T., Park, H., Lee, J.-H., Oh, S., Park, K.-I., Byun, M., Park, H., Ahn, G., Jeong, C.K., No, K., Kwon, H., Lee, S.-G., Joung, B., and Lee, K.J., Adv. Mater. 26, 4880 (2014).CrossRefGoogle Scholar
Kim, H., Yoon, J., Lee, G., Paik, S., Choi, G., Kim, D., Kim, B.-M., Zi, G., and Ha, J.S., ACS Appl. Mater. Interfaces 8, 16016 (2016).CrossRefGoogle Scholar
Penella, M.T. and Gasulla, M., in 2007 IEEE Instrum. Meas. Technol. Conf. IMTC 2007 (2007), pp. 15.Google Scholar
Gergel-Hackett, N., Hamadani, B., Dunlap, B., Suehle, J., Richter, C., Hacker, C., and Gundlach, D., IEEE Electron Device Lett. 30, 706 (2009).CrossRefGoogle Scholar
Tedesco, J.L., Stephey, L., Hernández-Mora, M., Richter, C.A., and Gergel-Hackett, N., Nanotechnology 23, 305206 (2012).CrossRefGoogle Scholar
Nagareddy, V.K., Barnes, M.D., Zipoli, F., Lai, K.T., Alexeev, A.M., Craciun, M.F., and Wright, C.D., ACS Nano 11, 3010 (2017).CrossRefGoogle Scholar
Liu, H., Zhao, T., Jiang, W., Jia, R., Niu, D., Qiu, G., Fan, L., Li, X., Liu, W., Chen, B., Shi, Y., Yin, L., and Lu, B., Adv. Funct. Mater. 25, 7071 (2015).CrossRefGoogle Scholar
Zeng, W., Shu, L., Li, Q., Chen, S., Wang, F., and Tao, X.-M., Adv. Mater. 26, 5310 (2014).CrossRefGoogle Scholar
Kim, B.-Y., Lee, W.-H., Hwang, H.-G., Kim, D.-H., Kim, J.-H., Lee, S.-H., and Nahm, S., Adv. Funct. Mater. 26, 5211 (2016).CrossRefGoogle Scholar
Verbakel, F., Meskers, S.C.J., Janssen, R.A.J., Gomes, H.L., Cölle, M., Büchel, M., and de Leeuw, D.M., Appl. Phys. Lett. 91, 192103 (2007).CrossRefGoogle Scholar
Li, Y., Long, S., Liu, Q., , H., Liu, S., and Liu, M., Chin. Sci. Bull. 56, 3072 (2011).CrossRefGoogle Scholar
Pan, F., Chen, C., Wang, Z., Yang, Y., Yang, J., and Zeng, F., Prog. Nat. Sci. Mater. Int. 20, 1 (2010).CrossRefGoogle Scholar
Stathopoulos, S., Khiat, A., Trapatseli, M., Cortese, S., Serb, A., Valov, I., and Prodromakis, T., Sci. Rep. 7, 17532 (2017).CrossRefGoogle Scholar
Baek, H., Lee, C., Choi, J., and Cho, J., Langmuir 29, 380 (2013).CrossRefGoogle Scholar
Hsu, C.H. and Yan, S.F., IET Micro Nano Lett. 6, 799 (2011).CrossRefGoogle Scholar
Lee, C., Kim, I., Shin, H., Kim, S., and Cho, J., Nanotechnology 21, 185704 (2010).CrossRefGoogle Scholar
Covi, E., Brivio, S., Serb, A., Prodromakis, T., Fanciulli, M., and Spiga, S., in 2016 IEEE Int. Symp. Circuits Syst. ISCAS (2016), pp. 393396.Google Scholar
Ansari, A.A. and Qadeer, A., J. Phys. Appl. Phys. 18, 911 (1985).CrossRefGoogle Scholar
Gale, E., Mayne, R., Adamatzky, A., and de Lacy Costello, B., Mater. Chem. Phys. 143, 524 (2014).CrossRefGoogle Scholar
Ishihara, A., Tamura, Y., Chisaka, M., Ohgi, Y., Kohno, Y., Matsuzawa, K., Mitsushima, S., and Ota, K., Catalysts 5, 1289 (2015).CrossRefGoogle Scholar
Dearnaley, G., Morgan, D.V., and Stoneham, A.M., J. Non-Cryst. Solids 4, 593 (1970).CrossRefGoogle Scholar
Jeong, D.S., Thomas, R., Katiyar, R.S., Scott, J.F., Kohlstedt, H., Petraru, A., and Hwang, C.S., Rep. Prog. Phys. 75, 076502 (2012).CrossRefGoogle Scholar
Conard, T., Arstila, K., Hantschel, T., Franquet, A., Vandervorst, W., Vecchio, E., Burgess, S., and Bauer, F., MRS Online Proc. Libr. Arch. 1184, (2009).Google Scholar
Mishra, A., Saha, S., Jha, C.K., Agrawal, V., Mitra, B., Dixit, A., and Singh, M., J. Electron. Mater. (2019). doi.org/10.1007/s11664-019-06975-4Google Scholar