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Fabrication and Characterization of Porous Silica/Carbon Nanotube Composite Insulation

Published online by Cambridge University Press:  12 May 2020

Naoto Shioura
Affiliation:
Department of Chemical Systems Engineering, Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya464-8603 (Japan)
Kazuki Matsushima
Affiliation:
Department of Chemical Systems Engineering, Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya464-8603 (Japan)
Tomoki Osato
Affiliation:
Department of Chemical Systems Engineering, Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya464-8603 (Japan)
Tomonaga Ueno*
Affiliation:
Department of Chemical Systems Engineering, Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya464-8603 (Japan)
Norifumi Isu
Affiliation:
LIXIL Corporation, 2-1-1 Ojima, Koto-ku, Tokyo136-8355 (Japan)
Takeshi Hashimoto
Affiliation:
Meijo Nano Carbon Co., Ltd., 2271-129 Anagahora, Shimoshidami, Moriyama, Nagoya460-0002 (Japan)
Takumi Yana
Affiliation:
Meijo Nano Carbon Co., Ltd., 2271-129 Anagahora, Shimoshidami, Moriyama, Nagoya460-0002 (Japan)
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Abstract

In recent years, the demand for high performance thermal insulations has increased. While foam and aerogels have been researched for high performance thermal insulation, novel material design is required for further improvement. A porous silica has been found to have the potential to form a new thermal insulation material. However, porous silica is a powder and is difficult to form the porous compact. Therefore, we propose a composite insulation of powdered porous silica (p-SiO2), carbon nanotubes (CNTs) and sodium carboxy methyl cellulose (CMC). The fine voids and bulky structure of p-SiO2 greatly suppress gas and solid heat transfer. The composite of CNT can improve the moldability and enhance the mechanical properties. The moldability of thermal insulating materials improved even with the addition of 1 wt% CNT. With the addition of 1 wt% CNT, the increase in thermal conductivity was less than 0.01 W⋅m-1⋅K-1.

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Articles
Copyright
Copyright © Materials Research Society 2020

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