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Electrochemical Behavior of Carbon Steel Plates with a Protective Film Developed from Copper Nanoparticles

Published online by Cambridge University Press:  24 November 2020

José P. Peña Caravaca*
Affiliation:
Faculty of Engineering, National Autonomous University of Mexico, Av University 3000, University City, Coyoacán, Cd. Mx., CP 04510
Carlos Arganis Juárez
Affiliation:
Nuclear Systems Department; National Nuclear Research Institute, Km 36.5, Highway México-Toluca, Ocoyoacac, Edo. de México, CP 52750
Ángeles Díaz Sánchez
Affiliation:
Nuclear Systems Department; National Nuclear Research Institute, Km 36.5, Highway México-Toluca, Ocoyoacac, Edo. de México, CP 52750
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Abstract

Carbon steel has gained wide applications as a structural material due to its combination of strength, ductility, and low cost; in fact, this material has been studied as one of the proposals for the manufacture of radioactive waste containers in countries such as Japan, France, and the United States. One of the biggest problems of carbon steel is its susceptibility to general corrosion, while copper and its alloys, despite not having high mechanical resistance, are materials with good corrosion resistance properties. This work evaluates the reliability of protective films developed from copper nanoparticles to improve the corrosion resistance of carbon steel plates. The nanoparticles were synthesized by a chemical reduction method using copper sulphate (CuSO4) as a precursor, sodium borohydride (NaBH4) as a reducing agent, and citric acid as an antioxidant. These nanoparticles were characterized by Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM), as well as by Dynamic Light Scattering (DLS) before and after being treated with citric acid. Finally, they were deposited on the carbon steel surface by Electrophoretic Deposition using a current of 0.5 mA/cm2. The protective capacity of the films developed from copper nanoparticles was evaluated by means of Electrochemical Impedance Spectroscopy and Linear Polarization Resistance techniques in 0.1 M HCl solution.

Type
Articles
Copyright
Copyright © The Author(s), 2020, published on behalf of Materials Research Society by Cambridge University Press

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References

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