Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-22T20:59:26.940Z Has data issue: false hasContentIssue false
  • English
  • Français

Electrical Characterization of Traditional and Aerosol Jet PrintedConductors Under Tensile Strain

Published online by Cambridge University Press:  11 January 2016

Jake Rabinowitz ,
Gregory Fritz ,
Parshant Kumar ,
Peter Lewis ,
Mikel Miller ,
Andrew Dineen  and
Caprice Gray
Jake Rabinowitz
Affiliation:
– C. S. Draper Laboratory, Cambridge MA – Northeastern University Dpt. Chemical Engineering, Boston MA
Gregory Fritz
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Parshant Kumar
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Peter Lewis
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Mikel Miller
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Andrew Dineen
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
Caprice Gray*
Affiliation:
– C. S. Draper Laboratory, Cambridge MA
*
*(Email: [email protected])
Get access

Abstract

In this work, we propose a model to quantify strain induced conductordiscontinuities based on measuring electrical resistance while applying tensilestrain to metal-polymer systems. Under strain, changing conductor geometry andinduced conductor discontinuity increase electrical resistance. On Kaptonsubstrates strained to ε = .07, evaporated gold films did notdeform and resistance increase was only caused by geometry change. Conversely,discontinuity caused 31% and 72% of the resistance increase in evaporated andprinted silver films at the same strain. On PDMS substrates, the same magnitudeof discontinuity, causing 31% of the resistance increase, occurred at onlyε = .024 in evaporated silver films. At the same strain,discontinuity caused 86% of the resistance increase in evaporated gold films.Printed silver films were inelastic. The results suggest that traditionalfabrication techniques may be more suitable to flexible hybrid electronicsapplications than additively manufactured conductors.

Keywords

elastic propertieselectrical propertiesmicrostructure
Type
Articles
Information
MRS Advances , Volume 1 , Issue 1: Biomaterials and Soft Materials , 2016 , pp. 15 - 20
Copyright
Copyright © Materials Research Society 2016 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Vaezi, M., Seitz, H., Yang, S., Int. J. Adv. Manuf. Tech. 67, 1721 (2013).Google Scholar
Adams, J. J., Slimmer, S. C., Lewis, J. A., Bernhard, J. T., Electron. Lett. 51, 661 (2015).Google Scholar
Chung, S., Lee, J., Song, H., Kim, S., Jeong, J., Hong, Y., Appl. Phys. Lett. 98, 153110 (2011).Google Scholar
Lu, N., Wang, X., Suo, Z., Vlassak, J., Appl. Phys. Lett. 91, 221909 (2007).CrossRefGoogle Scholar
Graz, I. M., Cotton, D. P. J., Lacour, S. P., App. Phys. Lett. 94, 071902 (2009).Google Scholar
Li, T., Huang, Z., Suo, Z., Lacour, S. P., Wagner, S., Appl. Phys. Lett. 85, 3435 (2004).Google Scholar
Xu, F., Zhu, Y., Adv. Mater. 24, 5117 (2012).CrossRefGoogle Scholar
Walker, S. B., Lewis, J. A., Am, J.. Chem. Soc. 134, 1419 (2012).CrossRefGoogle Scholar
Cairns, D. R., Witte, R. P., Sparacin, D. K., Sachsman, S. M., Paine, D. C., Crawford, G. P., Appl. Phys. Lett. 76, 1425 (2000).CrossRefGoogle Scholar
Kim, Y., Ren, X., Kim, J. W., Noh, H., J. Micromech. Microeng. 24, 115010 (2014).CrossRefGoogle Scholar
Khang, DY, Rogers, J. A., Lee, H. H., Adv. Funct. Mater. 19, 1526 (2009).Google Scholar