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Preparation of Cu nanoparticle colloid from a Cu ion solution by using protein surfactant

Published online by Cambridge University Press:  01 February 2019

M. SEKIGUCHI ,
K. OIKAWA ,
M. NAKAHARA ,
Y. INABA ,
T. MAEDA ,
A. MATSUI  and
H. ISHIZAKI
M. SEKIGUCHI
Affiliation:
Graduate School of Engineering, Information Systems Saitama Institute of Technology
K. OIKAWA
Affiliation:
Graduate School of Engineering, Information Systems Saitama Institute of Technology
M. NAKAHARA
Affiliation:
Department of Information Systems, Saitama Institute of Technology
Y. INABA
Affiliation:
Department of Information Systems, Saitama Institute of Technology
T. MAEDA
Affiliation:
Graduate School of Engineering, Information Systems Saitama Institute of Technology Department of Information Systems, Saitama Institute of Technology
A. MATSUI
Affiliation:
Graduate School of Engineering, Information Systems Saitama Institute of Technology Department of Information Systems, Saitama Institute of Technology
H. ISHIZAKI*
Affiliation:
Graduate School of Engineering, Information Systems Saitama Institute of Technology Department of Information Systems, Saitama Institute of Technology
*
*(Email: [email protected])
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Abstract

In this paper, a colloidal solution of copper nanoparticles was prepared from a Cu ion aqueous solution with the protein casein surfactant by a liquid phase reduction method at low temperature below 373K. For the casein concentration ranging from 6g/L to 75g/L, the formation of copper nanoparticle colloid were observed. As a result, the peak was observed at the ranging of 450 to 650 nm corresponding to the copper nanoparticle colloid plasmon absorption. As the surfactant concentration increases, the absorption spectrum tends to blue-shift and the particle diameter decreases. Thus, it indicated that the optical property and particle diameter of copper nanoparticle colloidal solution will be controlled by the protein casein surfactant concentration.

Keywords

Cunanostructurecolloid
Type
Articles
Information
MRS Advances , Volume 4 , Issue 24: Processing and Manufacturing , 2019 , pp. 1393 - 1398
Copyright
Copyright © Materials Research Society 2019 

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References

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