Hostname: page-component-78c5997874-mlc7c Total loading time: 0 Render date: 2024-11-19T17:45:56.210Z Has data issue: false hasContentIssue false
  • English
  • Français

In-situ X-ray Microscopy of Crack-Propagation to Study Fracture Mechanics of On-Chip Interconnect Structures

Published online by Cambridge University Press:  29 April 2018

Kristina Kutukova ,
Zhongquan Liao ,
Stephan Werner ,
Peter Guttmann ,
Yvonne Standke ,
Jürgen Gluch ,
Gerd Schneider  and
Ehrenfried Zschech
Kristina Kutukova*
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-Straße 2, 01109Dresden, Germany
Zhongquan Liao
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-Straße 2, 01109Dresden, Germany
Stephan Werner
Affiliation:
Helmholtz-Zentrum Berlin, Albert-Einstein-Straße 5, 12489Berlin, Germany
Peter Guttmann
Affiliation:
Helmholtz-Zentrum Berlin, Albert-Einstein-Straße 5, 12489Berlin, Germany
Yvonne Standke
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-Straße 2, 01109Dresden, Germany
Jürgen Gluch
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-Straße 2, 01109Dresden, Germany
Gerd Schneider
Affiliation:
Helmholtz-Zentrum Berlin, Albert-Einstein-Straße 5, 12489Berlin, Germany
Ehrenfried Zschech
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-Straße 2, 01109Dresden, Germany
*
*(Email: [email protected])
Get access

Abstract

Chip-package interaction (CPI) and the related thermomechanical stress in microchips increase the risk of failure in on-chip interconnect stacks, caused by delamination along Cu/dielectrics interfaces (adhesive failure) and fracture in dielectrics (cohesive failure). High-resolution transmission X-ray microscopy (TXM) is a unique technique to image crack propagation in on-chip interconnect stacks. The visualization of crack evolution in Cu/low-k Backend-of-Line (BEoL) structures is demonstrated using an experimental setup which combines high-resolution X-ray imaging with mechanical loading. The application of an indenter manipulator at the TXM beamline of the synchrotron radiation source BESSY II provides an unprecedented level of details on the fracture behavior of microchips. This in-situ experiment allows to identify the weakest layers and interfaces and to evaluate the robustness of the BEoL stack against CPI.

Keywords

fracturenanoscalemicroelectronicsin situadhesive
Type
Articles
Information
MRS Advances , Volume 3 , Issue 39: Characterization, Modeling and Theory , 2018 , pp. 2305 - 2310
Copyright
Copyright © Materials Research Society 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Grill, A., Gates, S. M., Ryan, T. E., Nguyen, S. V. and Priyadarshini, D., Appl. Phys. Rev. 1, 011306 (2014)CrossRefGoogle Scholar
Wang, G., Ho, P. S. and Groothuis, S., Microel. Rel. 45, 1079 – 1093 (2005)CrossRefGoogle Scholar
Zhang, X., Smith, R. S., Huang, R. and Ho, P. S., AIP Conf. Proc. 1143, 197 – 203 (2009)Google Scholar
Kutukova, K., Gluch, J., Standke, Y. and Zschech, E., International FCMN conference, March 2017, Monterey/CA (2017)Google Scholar
Jaya, B. N., Wheeler, J. M., Wehrs, J., P Best, J., Soler, R., Michler, J., Kirchlechner, C. and Dehm, G., Nano Lett. 16, 7597 – 7603 (2016)CrossRefGoogle Scholar
Best, J. P., Zechner, J., Wheeler, J. M., Schoeppner, R., Morstein, M. and Michler, J., Phil. Mag. 96, 3552 – 3569 (2016)CrossRefGoogle Scholar
Gerberich, W., Tadmor, E. B., Kysar, J., Zimmerman, J. A., Minor, A. M., Szlufarska, I., Amodeo, J., Devincre, B., Hintsala, E. and Ballarini, R., J. Vac. Sci. Technol. A 35, 060801 (2017)CrossRefGoogle Scholar
Natarajan, S., 2014 IEEE International Electron Devices Meeting (IEDM), December 2014, San Francisco/CA (2014)Google Scholar
Schneider, G., Guttmann, P., Rehbein, S., Werner, S. and Follath, R., J. Struct. Biol. 177, 212–223 (2012)CrossRefGoogle Scholar
Rehbein, S., Guttmann, P., Werner, S. and Schneider, G., Optics Express 20, 5830–5839 (2012)CrossRefGoogle Scholar
Kutukova, K., Niese, S., Sander, C., Standke, Y., Gluch, J., Gall, M. and Zschech, E., Appl. Phys. Lett., submitted (2018)Google Scholar