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Influence of Al, In codoping in enhancing the Figure of Merit of ZnOthin films for TCO Applications

Published online by Cambridge University Press:  19 January 2016

Vinoth Kumar Jayaraman*
Affiliation:
Department of Electrical Engineering, Centro de Investigación y de Estudios Avanzados del IPN (CINVESTAV-IPN), Apartado Postal 14740, México City, México.
Arturo Maldonado Alvarez
Affiliation:
Department of Electrical Engineering, Centro de Investigación y de Estudios Avanzados del IPN (CINVESTAV-IPN), Apartado Postal 14740, México City, México.
Maria De la Luz Olvera Amador
Affiliation:
Department of Electrical Engineering, Centro de Investigación y de Estudios Avanzados del IPN (CINVESTAV-IPN), Apartado Postal 14740, México City, México.
*
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Abstract

AIZO (Al and In codoped ZnO) thin films were deposited on soda lime glasssubstrates by the ultrasonic spray pyrolysis (USP) technique. The sprayingsolution was prepared from zinc acetate dihydrate, aluminum acetyl acetonate andindium acetate. Depositions were carried out at three different temperatures,425, 450 and 475 °C. Structural, morphological, optical and electricalproperties were examined with respected to the deposition temperatures. All AIZOfilms grown with (002) preferential orientation confirmed from X-ray diffractionanalysis. Hexagonal nanostructures were observed from Scanning electronmicroscopy (SEM) analysis. Minimum electrical resistivity of 2.52x10-3 Ω-cm was achieved for AIZO films.

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Articles
Copyright
Copyright © Materials Research Society 2016 

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References

REFERENCES

Gahtar, A., Rahal, A., Benhaoua, B., and Benramache, S., Opt. - Int. J. Light Electron Opt. 125, 3674 (2014).CrossRefGoogle Scholar
Morvillo, P., Diana, R., Mucci, a., Bobeico, E., Ricciardi, R., and Minarini, C., Sol. Energy Mater. Sol. Cells 141, 210 (2015).Google Scholar
Choi, Y., Kang, J., Hwang, D., and Park, S., IEEE Transactions on electron devices 57, 26 (2010).CrossRefGoogle Scholar
Yamamoto, N., Makino, H., Osone, S., Ujihara, a., Ito, T., Hokari, H., Maruyama, T., and Yamamoto, T., Thin Solid Films 520, 4131 (2012).CrossRefGoogle Scholar
Shin, J.H., Shin, D.K., Lee, H.Y., and Lee, J.Y., Trans. Nonferrous Met. Soc. China (English Ed. 21, s96 (2011).Google Scholar
Zhang, Y., Wu, C., Zheng, Y., and Guo, T., J. Semicond. 33, 023001 (2012).CrossRefGoogle Scholar
Benramache, S., Chabane, F., Benhaoua, B., and Lemmadi, F.Z., J. Semicond. 34, 023001 (2013).Google Scholar
Gabás, M., Torelli, P., Barrett, N.T., Sacchi, M., and Ramos Barrado, J.R., APL Mater. 2, (2014).Google Scholar
Kim, D.-S., Park, J.-H., Lee, S.-J., Ahn, K.-J., Lee, M.-S., Ham, M.-H., Lee, W., and Myoung, J.-M., Mater. Sci. Semicond. Process. 16, 997 (2013).Google Scholar
Kim, J.-H. and Yer, I.-H., Ceram. Int. 41, 10227 (2015).Google Scholar
Hjiri, M., Dhahri, R., Omri, K., El Mir, L., Leonardi, S.G., Donato, N., and Neri, G., Mater. Sci. Semicond. Process. 27, 319 (2014).Google Scholar
Su, J., Li, H., Huang, Y., Xing, X., Zhao, J., and Zhang, Y., Nanoscale 3, 2182 (2011).CrossRefGoogle Scholar
Zhang, X., Zhu, L., Xu, H., Chen, L., Guo, Y., and Ye, Z., J. Alloys Compd. 614, 71 (2014).Google Scholar
Pan, Z., Xiao, Y., Tian, X., Wu, S., Chen, C., Deng, J., Xiao, C., Hu, G., and Wei, Z., Mater. Sci. Semicond. Process. 17, 162 (2014).Google Scholar
Yousefi, R., Zak, a. K., and Mahmoudian, M.R., J. Solid State Chem. 184, 2678 (2011).Google Scholar
Mahdhi, H., Ben Ayadi, Z., Gauffier, J.L., Djessas, K., and Alaya, S., Opt. Mater. (Amst). 45, 97 (2015).Google Scholar
Karakaya, S. and Ozbas, O., Appl. Surf. Sci. 328, 177 (2015).Google Scholar
Chen, S., Carraro, G., Barreca, D., and Binions, R., Thin Solid Films 584, 316 (2014).CrossRefGoogle Scholar
Tsoutsouva, M.G., Panagopoulos, C.N., Papadimitriou, D., Fasaki, I., and Kompitsas, M., Mater. Sci. Eng. B 176, 480 (2011).Google Scholar
Chhikara, D., Senthil Kumar, M., and Srivatsa, K.M.K., Superlattices Microstruct. 82, 368 (2015).Google Scholar
Vettumperumal, R., Kalyanaraman, S., and Thangavel, R., Superlattices Microstruct. 83, 237 (2015).Google Scholar
Smirnov, M., Baban, C., and Rusu, G.I., Appl. Surf. Sci. 256, 2405 (2010).Google Scholar
Gabás, M., Barrett, N.T., Ramos-Barrado, J.R., Gota, S., Rojas, T.C., and López-Escalante, M.C., Sol. Energy Mater. Sol. Cells 93, 1356 (2009).Google Scholar
Kumar, J.V., Maldonado, A., and Olvera, M., Mater. Lett. 157, 169 (2015).CrossRefGoogle Scholar
Taskin, M. and Podder, J., Appl. Sci. Reports 3, 3 (2014).Google Scholar
Bedia, A., Bedia, F.Z., Aillerie, M., Maloufi, N., and Benyoucef, B., Energy Procedia 74, 529 (2015).CrossRefGoogle Scholar
Ajili, M., Castagné, M., and Kamoun, N., Opt. - Int. J. Light Electron Opt. 126, 708 (2015).CrossRefGoogle Scholar
Kenanakis, G., Katsarakis, N., and Koudoumas, E., Thin Solid Films 555, 62 (2014).Google Scholar
Jiao, B.C., Zhang, X.D., Wei, C.C., Sun, J., Huang, Q., and Zhao, Y., Thin Solid Films 520, 1323 (2011).Google Scholar
KyungHwan, K., Yu, S.J., Hyung-Wook, C., Yong-Seo, P., and Woo-Jae, K., J. Korean Phys. Soc. 57, 1909 (2010).Google Scholar
Reddy, R.S., Sreedhar, A., Reddy, A.S., and Uthanna, S., Adv. Mater. Lett. 3, 239 (2012).Google Scholar
Prasada Rao, T. and Santhoshkumar, M.C., Appl. Surf. Sci. 255, 7212 (2009).Google Scholar
Kwak, D., Park, K., Kim, B., Lee, S., and Lee, S., J. Korean Phys. Soc. 45, 206 (2004).Google Scholar
Wang, S., Li, X., and Zhang, J., J. Phys. Conf. Ser. 188, 012017 (2009).CrossRefGoogle Scholar
Roth, A.P., Webb, J.B., and Williams, D.F., Phys. Rev. B 25, 7836 (1982).Google Scholar
Haacke, G., J. Appl. Phys. 47, 4086 (1976).Google Scholar
Tohsophon, T., Wattanasupinyo, N., Silskulsuk, B., and Sirikulrat, N., Thin Solid Films 520, 726 (2011).CrossRefGoogle Scholar
Zaleta-Alejandre, E., Camargo-Martinez, J., Ramirez-Garibo, A., Pérez-Arrieta, M.L., Balderas-Xicohténcatl, R., Rivera-Alvarez, Z., Aguilar-Frutis, M., and Falcony, C., Thin Solid Films 524, 44 (2012).Google Scholar
Zhu, K., Yang, Y., and Song, W., Mater. Lett. 145, 279 (2015).Google Scholar