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Published online by Cambridge University Press: 22 December 2015
This paper presents a comparative study on the effects of plasma type and duration on the contact angle of silicon (Si) and fused silica (FS) for the deposition of Poly (3,4 ethyldioxythiophene) Polystyrene Sulfonate (PEDOT:PSS) via drop casting. The two methods used to measure contact angles were goniometry and profilometry. Both methods agreed that the lowest contact angles were given by: 1) 30 seconds in nitrogen/oxygen mix for Si substrates, and 2) 10 minutes in pure oxygen plasma for FS substrates.