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Electrochemical Behavior of Carbon Steel Plates with a Protective Film Developed from Copper Nanoparticles

Published online by Cambridge University Press:  24 November 2020

José P. Peña Caravaca ,
Carlos Arganis Juárez  and
Ángeles Díaz Sánchez
José P. Peña Caravaca*
Affiliation:
Faculty of Engineering, National Autonomous University of Mexico, Av University 3000, University City, Coyoacán, Cd. Mx., CP 04510
Carlos Arganis Juárez
Affiliation:
Nuclear Systems Department; National Nuclear Research Institute, Km 36.5, Highway México-Toluca, Ocoyoacac, Edo. de México, CP 52750
Ángeles Díaz Sánchez
Affiliation:
Nuclear Systems Department; National Nuclear Research Institute, Km 36.5, Highway México-Toluca, Ocoyoacac, Edo. de México, CP 52750
*
[email protected]
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Abstract

Carbon steel has gained wide applications as a structural material due to its combination of strength, ductility, and low cost; in fact, this material has been studied as one of the proposals for the manufacture of radioactive waste containers in countries such as Japan, France, and the United States. One of the biggest problems of carbon steel is its susceptibility to general corrosion, while copper and its alloys, despite not having high mechanical resistance, are materials with good corrosion resistance properties. This work evaluates the reliability of protective films developed from copper nanoparticles to improve the corrosion resistance of carbon steel plates. The nanoparticles were synthesized by a chemical reduction method using copper sulphate (CuSO4) as a precursor, sodium borohydride (NaBH4) as a reducing agent, and citric acid as an antioxidant. These nanoparticles were characterized by Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM), as well as by Dynamic Light Scattering (DLS) before and after being treated with citric acid. Finally, they were deposited on the carbon steel surface by Electrophoretic Deposition using a current of 0.5 mA/cm2. The protective capacity of the films developed from copper nanoparticles was evaluated by means of Electrochemical Impedance Spectroscopy and Linear Polarization Resistance techniques in 0.1 M HCl solution.

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Articles
Information
MRS Advances , Volume 5 , Issue 61: International Materials Research Congress XXIX , 2020 , pp. 3195 - 3204
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Copyright
Copyright © The Author(s), 2020, published on behalf of Materials Research Society by Cambridge University Press

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References

REFERENCES

Lee, Y., Choi, J.-R., Lee, K. J., Stott, N. E., and Kim, D., “Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics”, Nanotechnology, 2008, vol. 19, n.o 41, pp. 415604+07.CrossRefGoogle ScholarPubMed
Jeong, S. et al. , “Controlling the thickness of the surface oxide layer on Cu nanoparticles for the fabrication of conductive structures by ink-jet printing”, Adv. Funct. Mater., 2008, vol. 18, n.o 5, pp. 679–686.CrossRefGoogle Scholar
Khodashenas, B. and Ghorbani, H. R., “Synthesis of copper nanoparticles: An overview of the various methods”, Korean J. Chem. Eng., 2014, vol. 31, n.o 7, pp. 1105–1109.CrossRefGoogle Scholar
Jian-guang, Y., Yuang-lin, Z., Okamoto, T., Ichino, R., and Okido, M., “A new method for preparing hydrophobic nano-copper powders”, J. Mater Sci., 2007, vol. 42, pp. 7638–7642.CrossRefGoogle Scholar
Yu, W., Xie, H., Chen, L., Li, Y., and Zhang, C., “Synthesis and Characterization of Monodispersed Copper Colloids in Polar Solvents”, Nanoscale Res. Lett., 2009, vol. 4, n.o 5, pp. 465–470.CrossRefGoogle ScholarPubMed
Tamilvanan, A., Balamurugan, K., Ponappa, K., and Kumar, B. M., “Copper Nanoparticles: Synthetic Strategies, Properties and Multifunctional Application”, Int. J. Nanosci., 2014, vol. 13, n.o 02, pp. 1430001–22.CrossRefGoogle Scholar
Yokoyama, S., Suzuki, I., Motomiya, K., Takahashi, H., and Tohji, K., “Aqueous electrophoretic deposition of citric-acid-stabilized copper nanoparticles”, Colloids Surf. Physicochem. Eng. Asp., 2018, vol. 545, pp. 93–100.CrossRefGoogle Scholar
José Baró Casanovas, , et al. , “Origen y gestión de residuos radiactivos.” 2000.Google Scholar
Zhang, Q. et al. , “Long term corrosion estimation of carbon steel, titanium and its alloy in backfill material of compacted bentonite for nuclear waste repository”, Scientific Reports, 2019, vol. 9, n.o 3195, pp. 1–18.Google ScholarPubMed
Fateh, A., Aliofkhazraei, M., and Rezvanian, A. R., “Review of corrosive environments for copper and its corrosion inhibitors”, Arab. J. Chem., 2020, vol. 13, n.o 1, pp. 481–544.Google Scholar
Shi, X., Nguyen, T. A., Suo, Z., Liu, Y., and Avci, R., “Effect of nanoparticles on the anticorrosion and mechanical properties of epoxy coating”, Surf. Coat. Technol. - SURF COAT TECH, 2009, vol. 204, n.o 3, pp. 237–245.CrossRefGoogle Scholar
Anjum, M., Ali, H., Khan, W., Zhao, J., and Yasin, G., “Metal/metal oxide nanoparticles as corrosion inhibitors”, in Corrosion Protection at the Nanoscale, 1.a ed., 2020, pp. 181–201.CrossRefGoogle Scholar
Barrow, D., Ajax, T., Scarborough, E., and Sayer, M., “Method for producing thick ceramic films by a Sol-Gel coating process”, US005585136, 1996.Google Scholar
Pierson, H. O., Hanbook of Chemical Vapor Deposition (CVD) Principles, Technology, and Applications, 2.a ed. ASM Handbook. Corrosion, 1987, pp. 25–32.Google Scholar
Fotovvati, B., Namdari, N., and Dehghan, A., “On Coating Techniques for Surface Protection: A Review”, J Manuf Mater Process, 2019, vol. 3, n.o 1, pp. 28–50.Google Scholar
Tabesh, E., Salimijazi, H., Kharaziha, M., Mahmoudi, M., and Hejazi, M., “Development of an in-situ chitosan-copper nanoparticle coating by electrophoretic deposition”, Surf. Coat. Technol., 2019, vol. 364, pp. 239–247.CrossRefGoogle Scholar
Zafar, N., Shamaila, S., and Khalid, H., “Synthesis of copper nanoparticles by chemical reduction method”, Sci.Int.(Lahore), 2015, vol. 27, n.o 4, pp. 3085–3088.Google Scholar
“American Mineralogist Crystal Structure Database”. http://rruff.geo.arizona.edu/AMS/amcsd.php (Accessed 03 September 2020).Google Scholar
Er, D., Azar, G. T. P., Kazmanlı, K., and Urgen, M., “The corrosion protection ability of TiAlN coatings produced with CA-PVD under superimposed pulse bias”, Surf. Coat. Technol., 2018, vol. 346, pp. 1–8.CrossRefGoogle Scholar
Torres, J. E., Peña, D. Y., and Laverde, D., “Evaluación De La Influencia De Las Condiciones De Fondo De Pozo En El Deterioro De Un Acero API P110, En Ambientes Simulados Del Proceso De Combustión In Situ, Por Gravimetría Y EIS”, Matér. Rio Jan., 2016, vol. 21, n.o 3, pp. 780–795.Google Scholar
Samide, A., acobescu, G. E., Tutunaru, B., and Tigae, C., “Electrochemical and AFM Study of Inhibitory Properties of Thin Film Formed by Tartrazine Food Additive on 304L Stainless Steel in Saline Solution”, Int. J. Electrochem. Sci., 2017, vol. 12, pp. 2088–2101.CrossRefGoogle Scholar