Hostname: page-component-78c5997874-fbnjt Total loading time: 0 Render date: 2024-11-19T13:38:09.348Z Has data issue: false hasContentIssue false
  • English
  • Français

Copper-Graphene Composite Foils via Electro-Deposition: A Mini Review

Published online by Cambridge University Press:  10 January 2018

Gongsheng Song ,
Qiang Fu  and
Chunxu Pan
Gongsheng Song
Affiliation:
Suzhou Institute of Wuhan University, Suzhou, 215123, China School of Physics and Technology, Wuhan University, Wuhan, 430072, China
Qiang Fu
Affiliation:
School of Physics and Technology, Wuhan University, Wuhan, 430072, China
Chunxu Pan*
Affiliation:
Suzhou Institute of Wuhan University, Suzhou, 215123, China School of Physics and Technology, Wuhan University, Wuhan, 430072, China
*
*(Email: [email protected])
Get access

Abstract

As an emerging carbon material with advantages of thinnest, ultrahigh strength, superior thermal conductivity and electrical conductivity, graphene (Gr) is called the “black gold” and will have a profound applying potential in the field of materials science and engineering. Many researches concerning preparation of the Cu-Gr composite via various approaches have been reported. However, only few works are related to the electrochemical deposition method. As a simple, low cost, large scale production method, electrodeposition method has been widely used in industry for manufacturing foils involving copper-clad laminate (CCL), printed circuit board (PCB) and the negative current collector of lithium ion battery, where the copper foil not only serve as the carrier of the cathode active material but also play a role in collecting and conducting electrons. In the present article, we review the research progress on preparations and mechanical properties of the Cu-Gr composite foils by electrochemical method, and introduce our recent work in this area. The advancement of the process and the perspective industrial productions are also discussed.

Keywords

electrodepositioncompositeCu
Type
Articles
Information
MRS Advances , Volume 3 , Issue 1-2: Nanomaterials , 2018 , pp. 37 - 44
Check for updates
Copyright
Copyright © Materials Research Society 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Novoselov, K. S., Geim, A. K., Morozov, S. V., Jiang, D., Zhang, Y., Dubonos, S. V., Grigorieva, I. V. and Firsov, A.A.. Science 306, 666 (2004).Google Scholar
Chen, F., Ying, J., Wang, Y., Du, S., Liu, Z. and Huang, Q.. Carbon 96, 836 (2016).CrossRefGoogle Scholar
Hwang, J., Yoon, T., Jin, S.H., Lee, J., Kim, T.S., Hong, S.H. and Jeon, S.. Adv. Mater. 25, 6724 (2013).Google Scholar
Pavithra, C.L., Sarada, B.V., Rajulapati, K.V., Rao, T.N. and Sundararajan, G.. Sci. Rep. 4, 4049 (2014).CrossRefGoogle Scholar
Huang, G., Wang, H., Cheng, P., Wang, H., Sun, B., Sun, S., Zhang, C., Chen, M. and Ding, G.. Microelectron. Eng. 157, 7 (2016).Google Scholar
Maharana, H. S., Rai, P. K. and Basul, A.. J. Mater. Sci. 52, 1089 (2017).CrossRefGoogle Scholar
Protich, Z., Santhanam, K. S. V., Jaikumar, A., Kandlikar, S. G. and Wong, P.. J. Electrochem. Soc. 163, E166(2016).Google Scholar
Mai, Y.J., Zhou, M.P., Ling, H.J., Chen, F.X., Lian, W.Q., Jie, X.H.. Appl. Surf. Sci. 433, 232(2018).Google Scholar
Jagannadham, K.. Metall. Mater. Trans. A 44, 552 (2013).Google Scholar
Jagannadham, K.. Metall. Mater. Trans. B 43B, 316(2012).Google Scholar
Jagannadham, K.. J. Vac. Sci. Technol. B, 30, 03D109(2012).Google Scholar
Xie, G., Forslund, M. and Pan, J.. ACS Appl. Mater. Interfaces 6, 7444 (2014).9.CrossRefGoogle Scholar
Song, G., Wang, Z., Gong, Y., Yang, Y., Fu, Q. and Pan, C.. RSC Adv. 7, 1735 (2017).Google Scholar
Song, G., Yang, Y., Fu, Q., Pan, C.. J. Electrochem. Soc. 164, D652 (2017).Google Scholar