Hostname: page-component-cd9895bd7-8ctnn Total loading time: 0 Render date: 2024-12-23T17:25:21.106Z Has data issue: false hasContentIssue false
  • English
  • Français

A study on the effect of reducing agent content on thethickness of electroless Ni3P deposits on B4C nanoparticles

Published online by Cambridge University Press:  20 February 2013

M. Hajizamani ,
A. Alizadeh ,
N. Ehsani  and
M. Mirjani
Get access

Abstract

Deposition of Ni3P nano-scale layer on B4C nanoparticles in fourcontents of sodium hypophosphite as reducing agent including 5, 10, 15 and 30 g/l viaelectroless coating were done to investigate the effect of reducing agent content on thecoating thickness of deposited Ni3P. The bath pH and temperature was 5.5 and 85°C, respectively and the coating time was 25 min. The powders were characterized bytransmission electron microscopy (TEM) and the phases present were revealed by X-raydiffraction (XRD). Nickel and phosphorous contents of the coatings were measured byinductively coupled plasma analysis (ICP). The results revealed that by increasing thereducing agent content from 5 g/l to 30 g/l the average coating thickness increased from19 nm to 28 nm. Although the increasing effect of adding sodium hypophosphite content waspreserved, there is a critical amount for sodium hypophosphite content to increase thecoating thickness.

Keywords

Electroless coatingB4C nanoparticleNi3P nano-scale layerreducing agentTEM
Type
Research Article
Information
Metallurgical Research & Technology , Volume 110 , Issue 2 , 2013 , pp. 147 - 152
Copyright
© EDP Sciences 2013

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Ferguson, J.D., Buechler, K.J., Weimer, A.W., George, S.M., Powder Technol. 156 (2005) 154-163
Hakim, L.F., George, S.M., Weimer, A.W., Nanotechnology 16 (2005) 375-385
Ferguson, J.D., Weimer, A.W., George, S.M., Thin Solid Films 371 (2000) 95-104
Liu, S.Q., Tao, W.H., Li, J., Yang, Z.X., Liu, F.T., Powder Technol. 155 (2005) 187-192
Yang, C.C., Chen, S.Y., Cheng, S.Y., Powder Technol. 148 (2004) 3-6
Jiang, Z.J., Liu, C.Y., J. Phys. Chem. B107 (2003) 12411-12415
Afzali, A., Mottaghitalab, V., Motlagh, M. Saberi, Khodaparast Haghi, A., Korean J. Chem. Eng. 27 (2010) 1145-1149
Ang, L.M., Hor, T.S.A., Xu, G.O., Tung, C.H., Zhao, S.P., Wang, J.L.S, Decoration of activated carbon nanotubes with copper and nickel Carbon 38 (2000) 363-372 Google Scholar
Chen, Y.J., Cao, M.S., Tian, Q., Wang, T.H., Zhu, J., Mater. Lett. 58 (2004) 1481-1484
Kobayashi, T., Ishibashi, J., Mononobe, S., Ohtsu, M., Honma, H., J. Electrochem. Soc. 147 (2000) 1046-1049
Chung, W.S., Chang, S.Y., Lin, S.J., Plat. Surf. Finish. 83 (1996) 68-81
Chen, Y.J., Cao, M.S., Xu, Q., Zhu, J., Surf. Coating Technol. 172 (2003) 90-94
Motizuki, I., Izawa, K., Watanabe, J., Honma, H., T. I. Met. Finish. 77 (1999) 41-43
Hagiwara, K., Watanabe, J., Honma, H., Plat. Surf. Finish. 84 (1997) 74-76
Lee, K.B., Sim, H.S., Cho, S.Y., Kwon, H., Metall. Mater. Trans. A 32A (2001) 2142-2147
Kerti, I., Toptan, F., Mater. Lett. 62 (2008) 1215-1218
G.O. Mallory, J.B. Hajdu, Electroless Plating: Fundamentals and Applications. American Electroplaters and Surface Finishing Society, Florida, 1990
Zhang, Z., Chen, X.G., Charette, A., Compos. J. Mater. Sci. 44 (2009) 492-501
Alizadeh, A., Taheri-nassaj, E., Hajizamani, M., Nanoparticles J. Mater. Sci. Technol. 27 (2011) 1113-1119
Hashim, J., Looney, L., Hashmi, MSJ, J. Mater. Proc. Technol. 119 (2001) 324-328
Tekmen, C., Cocen, U., Journal of Turkish Ceramic Federation 17 (2006) 118-125
Tekmen, C., Ervardar, O., Cocen, U., J. Compos. Mater. 41 (2007) 3027-3033
Krishnan, K.H., John, S., Srinivasan, K.N., Praveen, J., Ganesan, M., Kavimani, P.M., Metall. Mater. Trans. A37 (2006) 1917-1926
Ebrahimian-Hosseinabadi, M., Azari-Dorcheh, K., Moonir Vaghefi, S.M., Wear 260 (2006) 123-127
Vafaei-Makhsoos, E., Thomas, E.L., Toth, L.E., Metall. Trans. 9 (1978) 1449-1460