Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-25T22:05:32.055Z Has data issue: false hasContentIssue false
  • English
  • Français

Dimensional Effect of Micro Capillary Pumped Loop

Published online by Cambridge University Press:  05 May 2011

T.-S. Leu ,
N.-J. Huang  and
C.-T. Wang
T.-S. Leu*
Affiliation:
Department of Aeronautics and Astronautics, National Cheng Kung University, Tainan, Taiwan 701, R.O.C.
N.-J. Huang*
Affiliation:
Department of Aeronautics and Astronautics, National Cheng Kung University, Tainan, Taiwan 701, R.O.C.
C.-T. Wang*
Affiliation:
Department of Mechanical and Electro-Mechanical Engineering, National I Lan University, I-Lan, Taiwan 26047, R.O.C.
*
* Associate Professor
** Master
*** Associate Professor, corresponding author
Get access

Abstract

This study discusses the components' geometry and its effect on the capability of heat transmission and pressure drop because of its evident influence on the performance of micro capillary pumped loop (MCPL). On analyzing the dimensional effect on heat transmission and pressure gradient of MCPL device, some results were yielded and addressed as follows: The vapor line was the most important factor among the components of MCPL in heat transmission and pressure drop. Furthermore, the depth of vapor line was the main parameter because of its drastic effect. In addition, at depth of vapor line, hv, ranging from 20 μm to 150 μm, the amount of heat transferred for system will increase, but decrease the pressure drop. However, for hv larger than 150 μm, the heat transfer and pressure drop both will reach a limit. A new family of geometrical dimensions of MCPL possessing an excellent heat flux of 178 W/cm2 would be obtained. These findings will be useful in designing a better MCPL.

Keywords

Micro capillary pumped loopDimensional effectHeat transfer
Type
Articles
Information
Journal of Mechanics , Volume 26 , Issue 2 , June 2010 , pp. 157 - 163
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Hoelke, A. et al. , “Analysis of the Heat Transfer Capacity of a Micromachined Loop Heat Pipe,” ASME, 3, pp. 53–60 (1999).Google Scholar
2.Lauru, J. M. and Phinney, L. M., “Optimization Study of a Silicon-Carbide Micro-Capillary Pumped Loop,” International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, USA (2003).Google Scholar
3.Dickey, J. T. and Peterson, G. P., “Experimental and Analytical Investigation of a Capillary Pumped Loop,” Journal of Thermophysics and Heat Transfer, 8, pp. 602–607 (1994).CrossRefGoogle Scholar
4.Meyer, L., “A Silicon-Carbide Micro-Capillary Pumped Loop for Cooling High Power Devices,” 19th IEEE Semi-Therm Symposium, pp. 364–368 (2003).Google Scholar
5.Cotter, T. P., “Principles and Prospects for Micro Heat Pipe,” 5th International Heat Pipe ConferenceTsukuba, Japan1984.Google Scholar
6.Kirshberg, J., Yerkes, K., Trebotich, D. and Lipmann, D., “Cooling Effect of a MEMS Based Micro Capillary Pumped Loop for Chip-Level Temperature Control,” ASME MEMS-2 (2000).CrossRefGoogle Scholar
7.Pettigrew, K., Kirshberg, J., Yerkes, K., Trebotich, D. and Liepmann, D., “Performance of MEMS Based Micro Capillary Pumped Loop for Chip-Level Temperature Control,” MEMS: The 14th IEEE International Conference on Micro Electro Mechanical SystemsSwitzerland2001.CrossRefGoogle Scholar
8.Wang, C. T., Leu, T. S. and Lai, T. M., “Micro Capillary Pumped Loop System for a Cooling High Power Device,” Experimental Thermal and Fluid Science, 32, pp. 1090–1095 (2008).CrossRefGoogle Scholar
9.Faghri, A., Heat Pipe Science and Technology, Taylor and Francis, New York (1995).Google Scholar
10.Bejan, A., Convective Heat Transfer, Chap. 10, John, Wiely, New York (1984).Google Scholar
11.Blevins, R. D, Applied Fluid Dynamics Handbook, Van Nostrand Reinhold Company, New York (1984).Google Scholar