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Cooling of Micro Spots by Oscillatory Flows

Published online by Cambridge University Press:  05 May 2011

F. C. Chou ,
J. G. Weng  and
C. L. Tien
F. C. Chou*
Affiliation:
Department of Mechanical Engineering, National Central University, Chung-Li, Taiwan 320, R.O.C
J. G. Weng*
Affiliation:
Department of Mechanical Engineering, University of California at Berkeley, Berkeley, CA 94720, U.S.A.
C. L. Tien*
Affiliation:
Department of Mechanical Engineering, University of California at Berkeley, Berkeley, CA 94720, U.S.A.
*
*Professor
**Ph.D. student
*Professor
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Abstract

This paper explores a novel design of an encapsulated and integrated device, which employs an oscillatory fluid flow to cool micro spots in micro systems. The oscillatory flow can be induced by two thermal bubbles that form and expand in turn on two micro line heaters at both ends of a sealed fluid channel. Compared with those using outside connecting channels and pumps, this design benefits from its much smaller size. A numerical calculation indicates that the heat transfer enhancement is independent of the Wormersely number, but depends on the Peclet number, Pe, and the cooling capacity of channel walls. The heat transfer rate increases dramatically as Pe increases from 30 to 100.

Keywords

CoolingMicro hot spotsOscillatory flowEncapsulated and Integrated Device
Type
Articles
Information
Journal of Mechanics , Volume 20 , Issue 4 , December 2004 , pp. 267 - 271
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2004

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References

1.Cotter, T. P., “Principles and Prospects of Micro Heat Pipes,” Proc. 5th International Heat Pipe Conference, Tsukuba, Japan, pp. 328–335 (1984).Google Scholar
2.Malik, A. K., Peterson, G. P. and Weichold, M. H., “On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices,” ASME J. Electron. Packaging, 114, pp. 436–442 (1991).Google Scholar
3.Murata, S., Nakada, H., Abe, T., Tanaka, H. and Watabe, A., “Newly Packed 50-μm-Spaced 8-Element Laser Diode Array with a Thermoelectric Cooler,” Jpn. J. Appl. Phys., 32, pp. 5284–5291 (1993).CrossRefGoogle Scholar
4.Peterson, G. P., “Heat Pipes in the Thermal Control of Electronic Components,” Proc. 3rd International Heat Pipe Symposium, Tsukuba, Japan, pp. 2–12 (1988).Google Scholar
5.Tuckerman, D. B. and Pease, R. F. W., “High Performance for Heat Sinking for VLSI,” IEEE Electron Device Lett., EDL–2, pp. 126–129 (1981).Google Scholar
6.Copeland, D., “Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement,” ASME J. Electronic Packaging, 118, pp. 21–26(1996).CrossRefGoogle Scholar
7.Liao, Q. D., Yang, K. T. and Nee, V. W., “An Analysis of Conjugate Heat Transfer from a Heated Wall in a Channel with Zero-Mean Oscillatory Flow for Small Oscillatory Flow Reynolds Number,” Int. J. Heat Mass Transfer, 37, Suppl. 1, pp. 415–423 (1994).Google Scholar
8.Liao, Q. D., Yang, K. T. and Nee, V. W., “Enhanced Microprocessor Chip Cooling by Channeled Zero-Mean Oscillatory Air Flow,” Proc. Int. Intersociety Electronic Packaging Conf., ASME EEP 10–2, pp. 789–794 (1995).Google Scholar
9. RMT Ltd., Products Manual, www.rmtltd.ru.Google Scholar
10.Legan, B., private communication, Bob Legan is a senior engineer of Marlow Industries Inc. (www.marlow.com) (1998).Google Scholar
11.Peterson, G. P., Swanson, L. W. and Gerner, F. M., “Micro Heat Pipes,” in Microscale Energy Transport, Tien, C. L., Majumdar, A. and Gerner, F.M., Ed., Taylor & Francis, Washington, DC, pp. 295–338 (1998).Google Scholar
12.Asai, A., Hara, T. and Endo, I., “One-Dimensional Model of Bubble Growth and Liquid Flow in Bubble Jet Printers,” Jpn. J. Appl. Phys., 26, pp. 1794–1801 (1987).Google Scholar
13.Vick, B. and Ozisik, M. N., Effects of Axial Conduction and Convective Boundary Conditions in Slug Flow inside a Circular Tube, ASME J. Heat Transfer, 103, pp. 436–440 (1981).Google Scholar