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Continuum Damage Approach for Fatigue Life Prediction of Viscoplastic Solder Joints

Published online by Cambridge University Press:  10 April 2015

L. Benabou ,
Z. Sun ,
P. Pougnet  and
P. R. Dahoo
L. Benabou*
Affiliation:
LISV Université de Versailles Saint Quentin-en-Yvelines Versailles, France
Z. Sun
Affiliation:
LASMIS Université de Technologie de Troyes Troyes, France
P. Pougnet
Affiliation:
VALEO Powertrain Systems Cergy Pontoise, France
P. R. Dahoo
Affiliation:
LATMOS Université de Versailles Saint Quentin-en-Yvelines Versailles, France
*
* Corresponding author ([email protected])
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Abstract

The accurate and effective prediction of the failure for an inelastic structure, such as a solder joint in an electronic chip packaging, remains a current issue. Subjected to sub-critical cyclic loading, the solder can undergo fatigue cracks, leading to the failure of the whole system after a certain number of power cycles. In this paper, a model for describing the viscoplastic behavior of the solder material under power cycling is implemented in the finite element code Abaqus and a continuum damage procedure is used for lifetime prediction. Damage initiation criterion and damage evolution law, based both on the inelastic strain energy per stabilized cycle as proposed by Darveaux, are used in conjunction with the direct cyclic procedure available in Abaqus. This latter technique allows reducing the considerable computation time needed to obtain the stabilized states during the repetitive loading cycles.

Keywords

Continuum damage approachLow-cycle fatigueCreep behaviorFinite element analysis
Type
Research Article
Information
Journal of Mechanics , Volume 31 , Issue 5 , October 2015 , pp. 525 - 531
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2015 

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References

1.Anand, L., “Constitutive Equations for Hot Working of Metals,” International Journal of Plasticity, 1, pp. 213–231 (1985).Google Scholar
2.Brown, S. B., Kim, K. H. and Anand, L., “An Internal Variable Constitutive Model for Hot Working of Metals,” International Journal of Plasticity, 5, pp. 95–130 (1989).CrossRefGoogle Scholar
3.Garofalo, F., “An Empirical Relation Defining the Stress Dependence of Minimum Creep Rate in Metals,” Transactions of the Metallurgical Society of AIME, 227, pp. 351–356 (1963).Google Scholar
4.Wang, G. Z., Cheng, Z. N., Becker, K. and Wilde, J., “Applying Anand Model to Represent the Visco-plastic Deformation Behavior of Solder Alloys,” Journal of Electronic Packaging, 123, pp. 247–253 (2001).Google Scholar
5.Manson, S. S., “Behavior of Materials Under Conditions of Thermal Stress,” Technical Report TN 2933, NACA (1953).Google Scholar
6.Coffin, L. F., “A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal,” Transactions of ASME, 76, pp. 931–950 (1954).Google Scholar
7.Du, Z. Z., Wang, J. and Fan, X., “Direct Cyclic Method for Solder Joint Reliability Analysis,” Proceedings of the International Mechanical Engineering Congress and Exposition, USA (2006).Google Scholar
8.Darveaux, R., “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction,” Journal of Electronic Packaging, 124, pp. 147–154 (2002).Google Scholar
9.Lau, J., Pan, S. and Chang, C., “A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package Solder Joints,” Journal of Electronic Packaging, 124, pp. 212–220 (2002).CrossRefGoogle Scholar
10.Hillerborg, A., Modeer, M. and Peterson, P. E., “Analysis of Crack Formation and Crack Growth in Concrete by Means of Fracture Mechanics and Finite Elements,” Cement and Concrete Research, 6, pp. 773–782 (1976).Google Scholar
11.Motalab, M., “A Constitutive Model for Lead Free Solder Including Aging Effects and its Application to Microelectronic Packaging,” Doctoral Dissertation, Auburn University, Alabama, USA (2013).Google Scholar