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Characterization of Hygroscopic Swelling and Thermo-Hygro-Mechanical Design on Electronic Package

Published online by Cambridge University Press:  05 May 2011

H.-C. Hsu  and
Y.-T. Hsu
H.-C. Hsu*
Affiliation:
Department of Mechanical and Automation Engineering, I-Shou University, Kaohsiung County, Taiwan 84008, R. O. C.
Y.-T. Hsu*
Affiliation:
Department of Mechanical and Automation Engineering, I-Shou University, Kaohsiung County, Taiwan 84008, R. O. C.
*
* Associate Professor
** Graduate student
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Abstract

This paper discusses a successful experimental procedure to determine the hygroscopic swelling property of polymeric materials used in electronic packaging. Saturated moisture concentration and moisture diffusivity were determined by measuring the weight gain during moisture absorption. Hygromechanical properties, such as the coefficientof moisture expansion (CME), were determined through Thermo-Mechanical Analyzer (TMA) and Thermo-Gravimetric Analyzer (TGA) techniques. Fick's law of transient diffusion is solved by using finite element (FE) analysis to evaluate the overall moisture distributions. Both two-dimensional and three-dimensional models based on the FE software ANSYS were developed to predict the thermal-induced strain, hygroscopic swelling deformation, and residual thermohygro-mechanicalstress distributions. Reliability analysis at three JEDEC preconditioning standards 60°C60%RH, 85°C60%RH and 85°C85%RH was carried out. A series of comprehensive parametric studies were conducted in this research.

Keywords

Hygroscopic swellMoisture diffusionCoefficient of moisture expansion
Type
Articles
Information
Journal of Mechanics , Volume 25 , Issue 3 , September 2009 , pp. 225 - 232
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2009

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References

1.Wong, E. H., Koh, S. W., Rajoo, R. and Lim, T. B., “Underfill Swelling and Temperature-Humidity Performance of Flip Chip PBGA Package,” Electronics Packaging Technology Conference, pp. 258–262 (2000).CrossRefGoogle Scholar
2.Wong, E. H., Chan, K. C., Rajoo, R. and Lim, T. B., “The Mechanics and Impact of Hygroscopic Swelling of Polymer Materials in Electronic Packaging,” Electronic Components and Technology Conference, pp. 356–360 (2002).Google Scholar
3.Wong, E. H., Koh, S. W., Lee, K. H. and Rajoo, R., “Comprehensive Treatment of Moisture Induced Failure-Recent Advances,” IEEE Transactions on Components and Packaging Technologies, 25, pp. 223–230 (2002).Google Scholar
4.Teh, L. K., Teo, M., Auto, E., Wong, C. C., Mhaisalkar, S. G., Teo, P. S. and Wang, E. H., “Moisture-Induced Failures of Adhesive Flip Chip Interconnects,” IEEE Transactions on Components and Packaging Technologies, 28, pp. 506–516 (2005).CrossRefGoogle Scholar
5.Zhang, X., Tee, T. Y., Ng, H. S., Teysseyre, J., Loo, S. and Mhaisalkar, S., “Comprehensive Hygro-Thermo- Mechanical Modeling and Testing of Stacked Die BGA Module with Molded Underfill,” Electronic Components and Technology Conference, pp. 196–200 (2005).Google Scholar
6.Lahoti, S. P., Kallolimath, S. C. and Zhou, J., “Finite Element Analysis of Thermo-Hygro-Mechanical Failure of a Flip Chip Package,” International Conference on Electronic Packaging Technology, pp. 180–185 (2005).Google Scholar
7.Zhou, J., Lahoti, S. P., Sitlani, M. P., Kallolimath, S. C. and Putta, R., “Investigation of Non-Uniform Moisture Distribution on Determination of Hygroscopic Swelling Coefficient and Finite Element Modeling for a Flip Chip Package,” IEEE 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronic and Micro-Systems, EuroSimE, pp. 112–119 (2005).Google Scholar
8.Ma, X., Jansen, K. M. B., Zang, G. Q. and Ernst, L. J., “Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy,” International Conference on Electronic Packaging Technology, pp. 262–268, (2006).CrossRefGoogle Scholar
9.Hsu, Y. T., “Thermo-Hygro-Mechanical Analysis and Reliability Design for Finger Printer Package,” M.S. Thesis, Department of Mechanical and Automation Engineering, I-Shou University, Taiwan (2007).Google Scholar
10.Lin, C. M., Lin, T. C., Chu, H. M. and Chen, Y. L., “Injection Molding Simulation of 3D Stacked-Chip Assembly Packaging with Different Entrances,” Journal of Mechanics, 23, pp. 31–39 (2007).CrossRefGoogle Scholar
11.Hsu, H. C., Lee, H. Y. and Hsu, Y. C., “Thermo-Hygro-Mechanical Design for CMOS Image Sensor,” Key Engineering Materials, 366, pp. 1151–1156 (2008).Google Scholar
12.Hwang, S. F. and Liao, W. T., “Thermal Stress in Discretely Layered Structures with Functional Graded Materials,” Journal of Mechanics, 24, pp. 297–300 (2008).CrossRefGoogle Scholar
13.Hsu, H. C., Lee, H. Y., Hsu, Y. C. and Fu, S. L., “Thermo-Hygro-Mechanical Design and Reliability Analysis for CMOS Image Sensor,” Journal of Thermal Stress, 31, pp. 914–931 (2008).CrossRefGoogle Scholar