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Thermal Stress Analysis of Thermally-Enhanced Plastic Ball Grid Array Electronic Packaging

Published online by Cambridge University Press:  05 May 2011

Meng-Kao Yeh ,
Kuo-Ning Chiang  and
Jiann-An Su
Meng-Kao Yeh*
Affiliation:
Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, R.O.C.
Kuo-Ning Chiang*
Affiliation:
Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, R.O.C.
Jiann-An Su*
Affiliation:
Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, R.O.C.
*
*Professor
**Associate Professor
***Graduate student
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Abstract

The thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cycling and thermal loading was investigated numerically. Two-dimensional finite element analysis by ANSYS was used for calculating the temperature distribution and thermal stress on the symmetric and diagonal cross sections of TEBGA. The thermal failure based on the peel and shear stresses at interfaces of TEBGA took place at the interface between the heat sink and epoxy moulding compound. The Tasi-Hill failure criterion was modified to predict the failure at various interfaces in TEBGA package. The TEBGA geometric parameters, including the thickness of the heat sink, the thickness of the adhesive layer between the heat sink and the die, and the thickness of the reinforcing copper ring, were varied to assess their effects on the failure mode of TEBGA. The results showed that for a TEBGA under thermal cycling, the stress values were reduced for thicker adhesive layers and thinner heat sinks; for a TEBGA under thermal loading, the die-to-ambient thermal resistance of TEBGA decreased for thinner adhesive layers and thicker heat sinks. The slimmer heat sink of extruded plate type can dissipate more heat and can reduce the stress values. Proper choice of geometric parameters of TEBGA package can prevent its failure at interfaces and furthermore, improve the reliability of electronic packaging.

Keywords

Electronic packagingPlastic ball grid arrayThermal stress analysisThermal cyclingThermal load
Type
Articles
Information
Journal of Mechanics , Volume 18 , Issue 1 , March 2002 , pp. 9 - 16
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2002

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References

REFERENCES

1Liang, D., “Warpage Study of Glob Top Cavity-up EPBGA Packages,” IEEE 46th Electronic Components & Technology Conference, May 28 ∼ 31, Florida, pp. 694–701 (1996).Google Scholar
2Chen, R. T., “PBGA Manufacturing Variables Study,” Surface Mounting Technology, 21, pp. 1–7 (1998) (in Chinese).Google Scholar
3Yeh, M. K. and Chang, K. C., “Failure Prediction of Plastic Ball Grid Array Electronic Packaging,” Advances in Electronic Packaging 1999, Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK'99), June 13 ∼ 18, Maui, Hawaii, USA, EEP–26–1, pp. 469–476 (1999).Google Scholar
4Yip, L., Massingill, T. and Naini, H., “Moisture Sensitivity Evaluation of Ball Grid Array Packages,” IEEE 46th Electronic Components & Technology Conference, May 28 ∼ 31, Florida, pp. 829–835 (1996).Google Scholar
5Tan, G. L., Hoo, C. Y., Chew, G., Low, J. H., Tay, N. B., Chakravorty, K. K. and Lim, T. B., “Reliability Assessment of BGA Packages,” IEEE 46th Electronic Components & Technology Conference, May 28 ∼ 31, Florida, pp. 687–693 (1996).Google Scholar
6Poborets, B., Ilyas, Q. S. M., Potter, M. and Argyle, J., “Relibility and Moisture Sensitivity Evaluation of 225-pin, 2 Layered Overmolded (OMPAC) Ball Grid Array Package,” IEEE 45th Electronic Components & Technology Conference, May 21 ∼ 24, Nevada, pp. 434–439 (1995).Google Scholar
7Hong, B. Z. and Burrell, L. G., “Modeling Thermally Induced Viscoplastic Deformation and Low Cycle Fatigue of CBGA Solder Joint in a Surface Mount Package,” IEEE Transactions on Components, Packaging, and Manufacturing Technology — Part A, 20, pp. 280–285 (1997).CrossRefGoogle Scholar
8Edwards, D. R., Hwang, M. and Stearns, B., “Thermal Enhancement of Plastic IC Packages,” IEEE Transactions on Components, Packaging, and Manufacturing Technology — Part A, 18, pp. 57–67 (1995).CrossRefGoogle Scholar
9Kromann, G. B. and Argento, C. W., “Thermal Enhancements for a Plastic-Ball-Grid Array Interconnect Technology: Computational-Fluids Dynamics Modeling and Characterization for Low-Velocity Air-cooling,” IEEE International Society Conference on Thermal Phenomena Proceedings, May 29 ∼ June 1, Orlando, pp. 166–173 (1996).Google Scholar
10Mertol, A., “Thermal Performance Comparison of High Pin Count Cavity-up Enhanced Plastic Ball Grid Array (EPBGA) Packages,” IEEE Transactions on Components, Packaging, and Manufacturing Technology — Part B, 19, pp. 427–443 (1996).CrossRefGoogle Scholar
11Schueller, R. D., “Design Considerations for a Reliable Low Cost Tape Ball Grid Array Package,” The International Journal of Microcircuits and Electronic Packaging, 19, pp. 146–154 (1996).Google Scholar
12Shaukatullah, H. and Gaynes, M. A., “Comparative Evaluation of Various Types of Heat Sinks for Thermal Enhancement of Surface Mount Plastic Packages,” The International Journal of Microcircuits and Electronic Packaging, 18, pp. 252–259 (1995).Google Scholar
13Wu, F., Lau, J. and Chen, K. L., “Thermal Evaluation of a Cost-Effective Plastic Ball Grid Array Package — NuBGA,” IEEE 47th Electronic Components & Technology Conference, May 18 ∼ 21, California, pp. 309–318 (1997).Google Scholar
14Edward, E. H., ANSYS Heat Transfer User's Guide for Revision 5.1, Swanson Analysis Systems Incorporation, Houston, U.S.A. (1994).Google Scholar
15Road, J., Introduction to ANSYS for Revision 5.1, Swanson Analysis Systems Incorporation, Houston, U.S.A. (1994).Google Scholar
16Collins, J. A., Failure of Materials in Mechanical Design, Ch. 6, Wiley-Interscience, Ohio, U.S.A. (1981).Google Scholar
17Lau, J. H. and Chen, K. L., ”Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package,” ASME Journal of Electronic Packaging, 119, pp. 208–212 (1997).CrossRefGoogle Scholar
18Jog, M. A., Ayyaswamy, P. S. and Cohen, I. M., “Effect of Elasto-Plastic Behavior of Epoxy on Thermal Stresses in TAB Packaging,” The International Journal of Microcircuits and Electronic Packaging, 19, pp. 308–315 (1996).Google Scholar
19Hong, B. Z. and Burrell, L. G., “Modeling Thermally Induced Viscoplastic Deformation and Low Cycle Fatigue of CBGA Solder Joint in a Surface Mount Package,” IEEE Transactions on Components, Packaging, and Manufacturing Technology — Part A, 20, pp. 280–285 (1997).CrossRefGoogle Scholar
20McCluskey, P., Das, D., Jordan, J., Grzybowski, R. R., Fink, J., Condra, L. and Torri, T. C., “Packaging of Electronics for High Temperature Applications,” The International Journal of Microcircuits and Electronic Packaging, 20, pp. 409–423 (1997).Google Scholar
21Tay, A. A. O. and Lin, T. Y., “Effects of Moisture and Delamination on Cracking of Plastic IC Packages During Solder Reflow,” IEEE 46th Electronic Components & Technology Conference, May 28 ∼ 31, Florida, pp. 777–782 (1996).Google Scholar
22Mertol, A., “Thermal Performance Comparison of High Pin Count Cavity-up Enhanced Plastic Ball Array (EPBGA) Packages,” IEEE International Society Conference on Thermal Phenomena Proceedings, May 29 ∼ June 1, Orlando, pp. 140–150 (1996).Google Scholar
23Liu, S., Zhu, J. S., Hu, J. M. and Pao, Y. H., “Ceramic/Conductive Epoxy/Glass Systems,” IEEE Transactions on Components, Packaging, and Manufacturing Technology — Part A, 18, pp. 627–633 (1995).Google Scholar
24Voth, T. E. and Bergman, T. L., “Ball Grid Array Thermomechanical Response During Reflow Assembly,” ASME Journal of Electronic Packaging, 118, pp. 214–222 (1996).CrossRefGoogle Scholar
25Dunne, R. C. and Sitaraman, S. K., “Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM),” ASME Journal of Electronic Packaging, 119, pp. 197–203 (1997).CrossRefGoogle Scholar
26Liu, S. and Mei, Y., “An Investigation to Popcorning Mechanisms for IC Plastic Packages: EMC Cracking,” The International Journal of Microcircuits and Electronic Packaging, 20, pp. 431–446 (1997).Google Scholar
27Chiou, Y. T. and Hu, Y. C., “PBGA Popcorning Simulation and Experiments,” Industrial Materials, 141, pp. 145–152 (1998) (in Chinese).Google Scholar
28EIA/JEDEC STANDARD, Test Method A105-B, Power and Temperature Cycling, U.S.A. (1996).Google Scholar
29Riemer, D. E., “Prediction of Temperature Cycling Life for SMT Solder Joints on TCM-Mismatched Substrates,” IEEE 40th Electronic Components & Technology Conference, May 20 ∼ 23, Las Vegas, pp. 418–422 (1990).CrossRefGoogle Scholar