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Modeling and Analyses of Boiling and Capillary Limitations for Micro Channel Wick Structures

Published online by Cambridge University Press:  11 December 2015

S.-W. Chen*
Affiliation:
Institute of Nuclear Engineering and ScienceNational Tsing Hua UniversityHsinchu, Taiwan Department of Engineering and System ScienceNational Tsing Hua UniversityHsinchu, Taiwan
F.-C. Liu
Affiliation:
Institute of Nuclear Engineering and ScienceNational Tsing Hua UniversityHsinchu, Taiwan
T.-Y. Wang
Affiliation:
Institute of Nuclear Engineering and ScienceNational Tsing Hua UniversityHsinchu, Taiwan
W.-K. Lin
Affiliation:
Institute of Nuclear Engineering and ScienceNational Tsing Hua UniversityHsinchu, Taiwan Department of Engineering and System ScienceNational Tsing Hua UniversityHsinchu, Taiwan
J.-R. Wang
Affiliation:
Institute of Nuclear Engineering and ScienceNational Tsing Hua UniversityHsinchu, Taiwan
H.-T. Lin
Affiliation:
Institute of Nuclear Energy ResearchTaoyuan, Taiwan
J.-D. Lee
Affiliation:
Nuclear Science and Technology Development CenterNational Tsing Hua UniversityHsinchu, Taiwan
J.-J. Peir
Affiliation:
Nuclear Science and Technology Development CenterNational Tsing Hua UniversityHsinchu, Taiwan
C.-K. Shih
Affiliation:
Institute of Nuclear Engineering and ScienceNational Tsing Hua UniversityHsinchu, Taiwan
*
*Corresponding author ([email protected])
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Abstract

In order to analyze the boiling and capillary limitations of two-phase heat transport devices, the existing models developed by Chi and Peterson and the existing experimental data carried out with various micro channel wick structures from literature were collected for benchmark. It was found that the dominant parameters for boiling and capillary limitations were the nucleation sites and structure geometries of the micro channels, and important parameters were considered to modify the models empirically. It was also found that for micro channel structures the inclined angle is sensitive to the capillary limitations and not to boiling limitations. By properly estimating the nucleation sites and empirical coefficients for micro channels needed by the newly modified models, the boiling and capillary limitations can be accurately predicted, and hence the applicability of the modified models is confirmed. Based on this, a numerical analysis was then carried out to investigate the trends of boiling and capillary limitations of the micro channel wick structures. Effects of the channel geometries and arrangement were taken into account, including the aspect ratio and structure size of the micro channels. Furthermore, the effects of inclined angle and contact angle were also analyzed. The present results can provide a design reference of performance trends of micro channel wick structures.

Type
Research Article
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2016 

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References

1.Connors, M., “Cooling High-Power Electronic Components in Small Packages,” Thermacore, Inc., http://www.thermacore.com/news/high-power-electronic-components.aspx (2009).Google Scholar
2.Columbia-Staver Ltd., “Heat Pipes,” Columbia-Staver Ltd., http://www.columbia-staver.co.uk/technologies/heat-pipes/ (2015).Google Scholar
3.Chi, S. W., Heat Pipe Theory and Practice – A Sourcebook, Hemisphere Publishing Corp., Washington, D. C., pp. 3386 (1976).Google Scholar
4.Peterson, G. P., Heat Pipes – Modeling, Testing, and Applications, John Wiley & Sons, Inc, New York, N.Y., pp. 4499 (1994).Google Scholar
5.Peterson, G. P. and Ha, J. M., “Capillary Performance of Evaporating Flow in Micro Grooves: An Approximate Analytical Approach and Experimental Investigation,” Journal of Heat Transfer, 120, pp. 743751 (1998).Google Scholar
6.Ha, J. M. and Peterson, G. P., “Capillary Performance of Evaporating Flow in Micro Grooves: An Analytical Approach for Very Small Tilt Angles,” Journal of Heat Transfer, 120, pp. 452457 (1998)Google Scholar
7.Ha, J. M. and Peterson, G. P., “The Heat Transport Capacity of Micro Heat Pipes,” Journal of Heat Transfer, 120, pp. 10641071 (1998)CrossRefGoogle Scholar
8.Cao, Y., Gao, M., Beam, J. E. and Donovan, B., “Experiments and Analyses of Flat Miniature Heat Pipes,” Energy Conversion Engineering Conference (IECEC 96), Washington, DC, USA (1996).Google Scholar
9.Hsieh, J. C., Chen, S. W., Yeh, S. C., Shen, S. C. and Chen, C. R., “Experimental Study on Thermal Performance of Aluminum Flat Plate Heat Pipe,” 23rd Chinese Society of Mechanical Engineering Conference, Tainan, Taiwan (2006).Google Scholar
10.Chen, S. W., et al., “Visualization Study on Boiling and Capillary Limits of Silicon-Based Micro Structures,” 10th China Heat Pipe Conference, Gui-Yang, Gui Zhou, P. R. C., pp. 113 (2006).Google Scholar
11.Chen, S. W., et al., “Experimental Investigation and Visualization on Capillary and Boiling Limits of Micro Groove by Different Processes,” Sensors and Actuators A: Physical, 139, pp. 7887 (2007).Google Scholar
12.Sobhan, C. B., Rag, R. L. and Peterson, G. P., “A Review and Comparative Study of the Investigations on Micro Heat Pipes,” International Journal of Energy Research, 31, pp. 664688 (2007).Google Scholar
13. “Sessile Drop Technique,” Wikipedia, https://en.wikipedia.org/wiki/Sessile_drop_technique (2015).Google Scholar
14.Chi, S. W., “Mathematical Modeling of High and Low Temperature Heat Pipes,” GW University Report to NASA, Grant No. NGR 09-010-070 (1971).Google Scholar
15.Kays, W. M., Convective Heat and Mass Transfer, McGraw-Hill, New York (1966).Google Scholar
16.Griffith, P. and Wallis, G. D., “The Role of Surface Conditions in Nucleate Boiling,” Chemical Engineering Progress Symposium Series, 56, pp. 4963 (1960).Google Scholar
17.Yang, S. R. and Kim, R. H., “A Mathematical Model of the Pool Boiling Nucleation Site Density in Terms of the Surface Characteristics,” International Journal of Heat and Mass Transfer, 31, pp. 11271135 (1988).Google Scholar
18.Hibiki, T. and Ishii, M., “Active Nucleation Site Density in Boiling Systems,” International Journal of Heat and Mass Transfer, 46, pp. 25872601 (2003).CrossRefGoogle Scholar
19.Wang, C. H. and Dhir, V. K., “Effect of Surface Wettability on Active Nucleation Site Density During Pool Boiling of Water on a Vertical Surface,” Journal of Heat Transfer, 115, pp. 659669 (1993).CrossRefGoogle Scholar
20.Wang, C. H. and Dhir, V. K., “On the Gas Entrapment and Nucleation Site Density During Pool Boiling of Saturated Water,” Journal of Heat Transfer, 115, pp. 670679 (1993).Google Scholar
21.Zou, L. and Jones, B. G., “Heating Surface Material's Effect on Subcooled Flow Boiling Heat Transfer of R134a,” International Journal of Heat and Mass Transfer, 58, pp. 168174 (2013).CrossRefGoogle Scholar
22.Benjamin, R. J. and Balakrishnan, A. R., “Nucleation Site Density in Pool Boiling of Saturated Pure Liquids: Effect of Surface Micro Roughness and Surface and Liquid Physical Properties,” Experimental Thermal and Fluid Science, 15, pp. 3242 (1997).CrossRefGoogle Scholar
23.Benjamin, R. J. and Balakrishnan, A. R., “Nucleation Site Density in Pool Boiling of Binary Mixtures: Effect of Surface Micro Roughness and Surface and Liquid Physical Properties,” The Canadian Journal of Chemical Engineering, 75, pp. 10801089 (1997).Google Scholar
24.Li, Y. Y., Chen, Y. J. and Liu, Z. H., “A Uniform Correlation for Predicting Pool Boiling Heat Transfer on Plane Surface with Surface Characteristics Effect,” International Journal of Heat and Mass Transfer, 77, pp. 809817 (2014).CrossRefGoogle Scholar
25. “Engineer's Handbook, Reference Tables — Surface Roughness Table,” http://EngineersHandbook.com, http://www.engineershandbook.com/Tables/surfaceroughness.htm (2004).Google Scholar
26.Feng, K., Kapadia, N., Jobson, B. and Castaldi, S., “Cupric Chloride-HCl Acid Microetch Roughening Process,” OnBoard Technology September 2008, pp. 1215 (2008).Google Scholar