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Tungsten alloying of the Ni(P) films and the reliability of Sn–3.5Ag/NiWP solder joints

Published online by Cambridge University Press:  21 March 2011

Dong Min Jang  and
Jin Yu
Dong Min Jang
Affiliation:
Electronic Packaging Laboratory, Department of Materials Science and Engineering, Korea Advanced Institute of Science & Technology (KAIST), Yuseong-gu, Daejeon 305-701, Republic of Korea
Jin Yu*
Affiliation:
Electronic Packaging Laboratory, Department of Materials Science and Engineering, Korea Advanced Institute of Science & Technology (KAIST), Yuseong-gu, Daejeon 305-701, Republic of Korea
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Effects of tungsten (W) addition to the electroless Ni(P) under bump metallization (UBM) on the solder joint reliability were investigated by preparing Ni–xW–5P and Ni–xW–9P films. Characteristics of the NiWP films, interfacial reaction with Sn–3.5Ag solder, and the impact resistance of solder joints was investigated by conducting differential scanning calorimetry, x-ray diffraction, scanning electron microscopy, transmission electron microscopy (TEM), and drop tests. Tungsten increased the thermal stability of the film and raised the crystallization temperature, but the crystallinity decreased with the W content in the film. The drop impact resistance of the Sn–3.5Ag/Ni–xW–9P joints was improved remarkably with the W content in the UBM, which was a direct consequence of the elimination of Ni3Sn4 spalling from the UBM. Additions of W up to 16 wt.% did not suppress intermetallic compound (IMC) spalling completely, but 22 wt.% W did up to 4 reflows, which increased the number of drops to failure (Nf) from 50 to over 300. TEM study showed the presence of an amorphous (Ni,W)3P layer between Ni3Sn4 and the original Ni–22W–9P UBM.

Keywords

PackagingSolderingBarrier Layer
Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 7 , 14 April 2011 , pp. 889 - 895
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

1.Mei, Z., Kauffmann, M., Eslambolchi, A., and Johnson, P.: Brittle interfacial fracture of PBGA packages on electroless Ni/immersion Au, in Proc. 48th Electronic Component and Technology Conference, 952 (1998).Google Scholar
2.Goyal, D., Lane, T., Kinzie, P., Panichas, C., Chong, K.M., and Villalobos, O.: Failure mechanism of brittle solder joint fracture in the presence of electroless Ni immersion gold (EMIG) interface, in Proc. 52nd Electronic Component and Technology Conference, 732 (2002).Google Scholar
3.Song, J.Y. and Yu, J.: Residual stress measurements in electroless plated Ni–P films. Thin Solid Films 415, 167 (2002).CrossRefGoogle Scholar
4.Sohn, Y.C., Yu, J., Kang, S.K., Shih, D.Y., and Lee, T.Y.: Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni–P metallization. J. Mater. Res. 19, 2428 (2004).CrossRefGoogle Scholar
5.Sohn, Y.C. and Yu, J.: Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection. J. Mater. Res. 20, 1931 (2005).CrossRefGoogle Scholar
6.He, M., Chen, Z., and Qi, G.: Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization. Acta Mater. 52, 2047 (2004).CrossRefGoogle Scholar
7.Jee, Y.K., Yu, J., and Ko, Y.H.: Effects of Zn addition on the drop reliability of Sn–3.5Ag–xZn/Ni(P) solder joints. J. Mater. Res. 22, 2776 (2007).CrossRefGoogle Scholar
8.Li, J.F., Mannan, S.H., Clode, M.P., Whalley, D.C., and Hutt, D.A.: Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects. Acta Mater. 54, 2907 (2006).CrossRefGoogle Scholar
9.Pearlstein, F. and Weightman, R.F.: Electroless deposition of nickel alloys. Electrochem. Technol. 6, 427 (1968).Google Scholar
10.Mallory, G.O. and Horhn, T.R.: Electroless deposition of ternary alloys. Plat. Surf. Finish. 66, 40 (1979).Google Scholar
11.Hsu, J. and Lin, K.: Enhancement in the deposition behavior and deposit properties of electroless Ni–Cu–P. J. Electrochem. Soc. 150, C653 (2003).CrossRefGoogle Scholar
12.Schmeckenbecher, A.F.: Chemical nickel-iron films. J. Electrochem. Soc. 113, 778 (1966).CrossRefGoogle Scholar
13.Sankara, T.S.N., Selvakumar, S., and Stephen, A.: Electroless NiCoP ternary alloy deposits: Preparation and characteristics. Surf. Coat. Technol. 172, 299 (2003).Google Scholar
14.Bouanani, M., Cherkaoui, F., Fratesi, R., Roventi, G., and Barucca, G.: Microstructural characterization and corrosion resistance of Ni–Zn–P alloys electrolessly deposited from a sulphate bath. J. Appl. Electrochem. 29, 637 (1999).CrossRefGoogle Scholar
15.Osaka, T., Kasai, N., Koiwa, I., and Goto, F.: A study on electroless plating of cobalt alloy films for perpendicular recording. J. Electrochem. Soc. 130, 790 (1983).CrossRefGoogle Scholar
16.Chen, K., Liu, C., Whalley, D.C., and Hutt, D.A.: Electroless Ni–W–P alloys as barrier coatings for liquid solder interconnects, in Proc. 1st Electronics System Integration Technology Conference, 421 (2006).Google Scholar
17.Cullity, B.D. and Stock, S.R.: Elements of X-ray Diffraction, 3rd ed. (Prentice Hall, NJ, 2001).Google Scholar
18.Hentschel, T.H., Isheim, D., Kirchheim, R., Muller, F., and Kreye, H.: Nanocrystalline Ni–3.6 at.% P and its transformation sequence studied by atom-probe field-ion microscopy. Acta Mater. 48, 933 (2000).CrossRefGoogle Scholar
19.Antonelli, S.B., Allen, T.L., Johnson, D.C., and Dubin, V.M.: Determining the role of W in suppressing crystallization of electroless Ni–W–P films. J. Electrochem. Soc. 153, J46 (2006).CrossRefGoogle Scholar
20.Yang, Y., Lim, Y.J., Kumar, A., Lee, T.K., and Chen, Z.: Interface reactions and shear strength of lead-free Sn–3.5Ag solder with Ni–W–P metallization, in Proc. 9th Electronic Packaging Technology Conference, 527 (2007).Google Scholar
21.Song, J.Y. and Yu, J.: A study on residual stresses in electroless Ni(p) and Ni(p)/Sn films. Ph.D. Thesis, Korea Advanced Institute of Science and Technology, Daejeon, South Korea, 2003.Google Scholar