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Tin Whiskers of Bulk Solders Generated Under Resonance
Published online by Cambridge University Press: 01 June 2005
Abstract
In this study, we investigated the vibration properties of Sn–Zn and Sn–Zn–Al alloys. It is notable that, with a small amount of Al addition, Sn whiskers were generated during resonant vibration. This may be the first time that Sn whiskers were found on bulk materials. Microstructural refining and hardening caused by alloying of Al stunted the fiberous type Sn deformation within Sn–Zn eutectics. Vibration-induced extrusion of Zn-free regions in the vicinity of cell boundaries may account for the appearance of the whiskers.
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