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Thermoelectric properties of the incommensurate layered semiconductor GexNbTe2

Published online by Cambridge University Press:  31 January 2011

G. Jeffrey Snyder*
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive, MS 277–207, Pasadena, California 91109
T. Caillat
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive, MS 277–207, Pasadena, California 91109
J-P. Fleurial
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive, MS 277–207, Pasadena, California 91109
*
a)Address all correspondence to this author.[email protected]
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Abstract

The compounds GexNbTe2 (0.39 ≤ x ≤ 0.53) have been studied for their thermoelectric properties. By changing x, the carrier concentration can be adjusted so that the material changes from a p-type metal to a p-type semiconductor. The maximum germanium concentration at about Ge0.5NbTe2 is also the most semiconducting composition. High- and low-temperature electrical resistivity, Hall effect, Seebeck coefficient, and thermal conductivity were measured. Evidence of electronic ordering was found in some samples. The thermal conductivity is reasonably low and glasslike with room temperature values around 20–25 mW/cm K. However, the power factor is too low to compete with state-of-the-art materials. The maximum thermoelectric figure of merit, ZT found in these compounds is about 0.12. The low ZT can be traced to the low carrier mobility of about 10 cm2 /Vs. The related compounds Si0.5NbTe2 and Ge0.5TaTe2 were also studied.

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Articles
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1.Slack, G., in Thermoelectric Handbook, edited by Rowe, D.M. (CRC, Boca Raton, 1995), p. 407.Google Scholar
2.Gareh, J., Boucher, F., and Evain, M., Eur. J. Solid State Inorg. Chem. 33, 355 (1996).Google Scholar
3.van der Pauw, L.J., Philips Res. Rep. 13, 1 (1958).Google Scholar
4.Wood, C., Zoltan, L.D., and Stapfer, G., Rev. Sci. Instrum. 56, 719 (1985).CrossRefGoogle Scholar
5.Rowe, D.M., Thermoelectric Handbook (CRC, Boca Raton, 1995).Google Scholar
6.Vandersande, J.W., Wood, C., Zoltan, A., et al., in Thermal Conductivity (Plenum, New York, 1988). p. 445.Google Scholar
7.Barnard, R.D., Thermoelectricity in Metals and Alloys (Wiley, New York, 1972).Google Scholar
8.Goldsmid, H.J. and Sharp, J.W., J. Electr. Mater. 28, 869 (1999).Google Scholar