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Thermal wave analysis of contact damage in ceramics: Case study on alumina

Published online by Cambridge University Press:  31 January 2011

Lanhua Wei  and
Brian R. Lawn
Lanhua Wei
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899–0001
Brian R. Lawn
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899–0001
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Abstract

Thermal waves are used to image damage accumulation digitally beneath Hertzian contacts in ceramics. Alumina ceramics over a range of grain size 3–48 μm are used in a case study. The nature of the images changes with increasing alumina grain size, reflecting a transition in damage mode from well-defined cone fracture in the finer-grain materials to distributed subsurface microfracture in the coarser-grain materials. Quantitative determinations of microcrack densities are evaluated in the latter case by deconvoluting thermal diffusivities from the image data. These determinations confirm the grain-size dependence of degree of damage predicted by fracture mechanics models. Potential advantages and disadvantages of thermal waves as a route to damage characterization in ceramic systems are discussed.

Type
Articles
Information
Journal of Materials Research , Volume 11 , Issue 4 , April 1996 , pp. 939 - 947
Copyright
Copyright © Materials Research Society 1996

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