Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Yu-Lin Shen
1998.
Effects of pre-existing interfacial defects on the stress profile in aluminum interconnection lines.
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A,
Vol. 21,
Issue. 1,
p.
127.
Gouldstone, A.
Shen, Y-L.
Suresh, S.
and
Thompson, C. V.
1998.
Evolution of stresses in passivated and unpassivated metal interconnects.
Journal of Materials Research,
Vol. 13,
Issue. 7,
p.
1956.
Shen, Y. -L.
1998.
Modelling of Heat Conduction and Thermal Stresses in Multilevel Interconnects.
MRS Proceedings,
Vol. 516,
Issue. ,
Shen, Y.-L.
1998.
Stresses, deformation, and void nucleation in locally debonded metal interconnects.
Journal of Applied Physics,
Vol. 84,
Issue. 10,
p.
5525.
Minor, C.A.
Guo, Y.L.
and
Shen, Y.-L.
1999.
On the propensity of electromigration void growth from preexisting stress-voids in metal interconnects.
Scripta Materialia,
Vol. 41,
Issue. 4,
p.
347.
Shen, Y.-L.
1999.
Thermal stresses in L and T shaped metal interconnects: a three dimensional analysis.
p.
283.
Shen, Y.-L.
and
Guo, Y. L.
1999.
Designing test interconnect structures for micro-scale stress measurement: An analytical guidance.
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena,
Vol. 17,
Issue. 2,
p.
448.
Shen, Y.-L.
Guo, Y.L.
and
Minor, C.A.
2000.
Voiding induced stress redistribution and its reliability implications in metal interconnects.
Acta Materialia,
Vol. 48,
Issue. 8,
p.
1667.
Smee, S.A.
Gaitan, M.
Novotny, D.B.
Joshi, Y.
and
Blackburn, D.L.
2000.
IC test structures for multilayer interconnect stress determination.
IEEE Electron Device Letters,
Vol. 21,
Issue. 1,
p.
12.
Yen, Jui-Yuan
and
Hwu, Jenn-Gwo
2001.
Stress effect on the kinetics of silicon thermal oxidation.
Journal of Applied Physics,
Vol. 89,
Issue. 5,
p.
3027.
Kilijanski, M.S.
and
Shen, Y.-L.
2002.
Analysis of thermal stresses in metal interconnects with multilevel structures.
Microelectronics Reliability,
Vol. 42,
Issue. 2,
p.
259.
Senez, Vincent
Hoffmann, Thomas
Le Duc, Philippe
and
Murray, Frank
2003.
Mechanical analysis of interconnected structures using process simulation.
Journal of Applied Physics,
Vol. 93,
Issue. 10,
p.
6039.
Ege, E. S.
and
Shen, Y. -L.
2003.
Thermomechanical response and stress analysis of copper interconnects.
Journal of Electronic Materials,
Vol. 32,
Issue. 10,
p.
1000.
Goldberg, C.K.
and
Wang, V.S.
2003.
Interlayer Dielectrics for Semiconductor Technologies.
p.
77.
Shen, Y.-L.
and
Ramamurty, U.
2003.
Temperature-dependent inelastic response of passivated copper films: Experiments, analyses, and implications.
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena,
Vol. 21,
Issue. 4,
p.
1258.
Rhee, Seung-Hyun
and
Ho, Paul S.
2003.
Thermal stress characteristics of two-level Al(Cu) interconnect structure.
Journal of Materials Research,
Vol. 18,
Issue. 4,
p.
848.
Nguyen, H.V.
Salm, C.
Krabbenborg, B.H.
Bisschop, J.
Mouthaan, A.J.
and
Kuper, F.G.
2004.
Fast Thermal Cycling-Enhanced Electromigration in Power Metallization.
IEEE Transactions on Device and Materials Reliability,
Vol. 4,
Issue. 2,
p.
246.
Shen, Y. -L.
2005.
Analysis of thermal stresses in copper interconnect/low-k dielectric structures.
Journal of Electronic Materials,
Vol. 34,
Issue. 5,
p.
497.
Rhee, Seung-Hyun
Murray, Conal E.
and
Besser, Paul R.
2006.
Effects of BEOL Stack on Thermal Mechanical Stress of Cu Lines.
MRS Proceedings,
Vol. 914,
Issue. ,
Shen, Y.-L.
2006.
Thermo-mechanical stresses in copper interconnects – A modeling analysis.
Microelectronic Engineering,
Vol. 83,
Issue. 3,
p.
446.