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Thermal properties of kinetic spray Al–SiC metal-matrix composite

Published online by Cambridge University Press:  06 January 2012

Gary L. Eesley ,
Alaa Elmoursi  and
Nilesh Patel
Gary L. Eesley
Affiliation:
Delphi Research Labs, 51786 Shelby Parkway, Shelby Township, Michigan 48315
Alaa Elmoursi
Affiliation:
Delphi Research Labs, 51786 Shelby Parkway, Shelby Township, Michigan 48315
Nilesh Patel
Affiliation:
Delphi Research Labs, 51786 Shelby Parkway, Shelby Township, Michigan 48315
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Abstract

Kinetic spray deposition provides a new means for producing composite materials with tailored physical properties. We report on measurements of the thermal conductivity and thermal-expansion coefficient for several compositional variations of kinetically sprayed Al–SiC metal-matrix composites. As a result of the deposition process, inclusion of SiC particles saturates in the 30–40% volume fraction range.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 4 , April 2003 , pp. 855 - 860
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

Ibrahim, A., Mohamed, F.A., and Lavernia, E.J., J. Mater. Sci. 26, 1137 (1991).CrossRefGoogle Scholar
Geiger, A.L. and Walker, J.A., J. Metals 8 (August 1991).Google Scholar
Geiger, A.L. and Jackson, M., Adv. Mater. Proc. 7, 23 (1989).Google Scholar
Lee, H.S., Jeon, K.Y., Kim, H.Y., and Hong, S.H., J. Mater. Sci. 35, 6231 (2000).CrossRefGoogle Scholar
Steenkiste, T.H. Van, Smith, J.R., and Teets, R.E., Surf. Coat. Technol. 154, 237 (2002).CrossRefGoogle Scholar
Cezairliyar, A., Baba, T., and Taylor, R., J. Appl. Physics 46, 714 (1975).Google Scholar
Morelli, D. (private communication, 2001).Google Scholar
Anderson, A.C. and Rauch, R.B., J. Appl. Phys. 41, 3648 (1970).CrossRefGoogle Scholar
Hasselman, D.P.H. and Johnson, L.F., J. Comp. Mater. 21, 508 (1987).CrossRefGoogle Scholar
Hasselman, D.P.H., Donaldson, K.Y., and Geiger, A.L., J. Am. Ceram. Soc. 75, 3137 (1992)CrossRefGoogle Scholar
Davis, L.C. and Artz, B.D., J. Appl. Phys. 77, 4954 (1995).CrossRefGoogle Scholar
Turner, P.S., Res. NBS 37, 239 (1946).Google Scholar