Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-26T18:35:58.551Z Has data issue: false hasContentIssue false

Synthesis by plasma-enhanced chemical-vapor deposition and characterization of siliconlike films with hydrophobic functionalities for improved long-term geometric stability of fiber-reinforced polymers

Published online by Cambridge University Press:  31 January 2011

A. Cremona*
Affiliation:
Istituto di Fisica del Plasma Consiglio Nazionale delle Ricerche (CNR), 20162 Milano, Italy
E. Vassallo
Affiliation:
Istituto di Fisica del Plasma Consiglio Nazionale delle Ricerche (CNR), 20162 Milano, Italy
A. Merlo
Affiliation:
Ce.S.I. Centro Studi Industriali-R&D and Advanced Engineering Department, 20133 Milano, Italy
A. Srikantha Phani
Affiliation:
Cambridge University, Engineering Department, Cambridge CB2 1TN, United Kingdom
L. Laguardia
Affiliation:
Istituto di Fisica del Plasma Consiglio Nazionale delle Ricerche (CNR), 20162 Milano, Italy
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Amorphous siliconlike films with hydrophobic functionalities have been deposited by plasma-enhanced chemical-vapor deposition on carbon-fiber-reinforced polymer (CFRP) unidirectional laminates used for micromechanical applications where high strength-to-weight and high stiffness-to-weight ratios are required. To improve long-term geometrical stability in ultrahigh-precision machine structures, hydrophobic CFRP materials are desirable. Three layers have been grown with different plasma-process parameters from a mixture of hexamethyldisiloxane, O2, and Ar. Chemical composition, water contact angle, surface energy, morphology, and tribological properties have been evaluated to choose the one that best fulfills hydrophobicity, wear, and scratch resistance. Wear tests have also been carried out on CFRP laminates coated with a polyurethane layer to compare the wear performance of the above specimens with that of a conventional hydrophobic coating. Scanning electron microscope images show a very good adhesion of the films to the composite substrate because the failure of the film and of the substrate (such as fiber failure) take place simultaneously.

Type
Articles
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Lucovsky, G., Richard, P.D., Tsu, D.V., Lin, S.Y.Markunas, R.J.: Deposition of silicon dioxide and silicon nitride by remote plasma enhanced chemical vapor deposition. J. Vac. Sci. Technol., A 4, 681 1986CrossRefGoogle Scholar
2Pai, P.G., Chao, S.S., Takagi, Y.Lucovsky, G.: Infrared spectroscopic study of SiOx films produced by plasma enhanced chemical vapor deposition. J. Vac. Sci. Technol., A 4, 689 1986CrossRefGoogle Scholar
3Creatore, M., Palombo, F., d’Agostino, R.Fayet, P.: RF plasma deposition of SiO2-like films: Plasma phase diagnostics and gas barrier film properties optimization. Surf. Coat. Technol. 142–144, 163 2001CrossRefGoogle Scholar
4Lucovsky, G., Maritini, M.J., Srivastava, J.K.Irene, E.A.: Low-temperature growth of silicon dioxide films: A study of chemical bonding by ellipsometry and infrared spectroscopy. J. Vac. Sci. Technol., B 5, 530 1987CrossRefGoogle Scholar
5Kim, Y., Hwang, M.S., Kim, H.J., Kim, J.Y.Lee, Y.: Infrared spectroscopy study of low-dielectric constant fluorine-incorporated and carbon-incorporated silicon oxide films. J. Appl. Phys. 90, 3367 2001CrossRefGoogle Scholar
6Grill, A.Neumayer, D.A.: Structure of low-dielectric constant to extreme low-dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization. J. Appl. Phys. 94, 6697 2003CrossRefGoogle Scholar
7Grill, A.: Plasma enhanced chemical vapor deposited SiCOH dielectrics: From low-k to extreme low-k interconnect materials. J. Appl. Phys. 93, 6697 2003CrossRefGoogle Scholar
8Mor, Y.S., Chang, T.C., Liu, P.T., Tsai, T.M., Chen, C.W., Yan, S.T., Chu, C.J., Wu, W.F., Pan, F.M., Lur, W.Sze, S.M.: Effective repair to ultra-low-k dielectric material (k ∼ 2.0) by hehamethyldisilazane treatment. J. Vac. Sci. Technol., B 20, 1334 2002CrossRefGoogle Scholar
9Owens, D.K.Wendt, R.C.: Estimation of the surface free energy of polymers. J. Appl. Polym. Sci. 13, 1741 1969CrossRefGoogle Scholar
10Cremona, A., Guardia, L. La, Vassallo, E., Ambrosone, G., Coscia, U., Orsini, F.Poletti, G.: Optical and structural properties of siliconlike films prepared by plasma-enhanced chemical-vapor deposition. J. Appl. Phys. 97, 023533 2005CrossRefGoogle Scholar
11Le, H.R., Sutcliffe, M.P.F.Williams, J.A.: Friction and material transfer in micro-scale sliding contact between aluminium alloy and steel. Tribol. Lett. 18, 99 2005CrossRefGoogle Scholar