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Synthesis and properties of an aluminum nitride/polyimide nanocomposite prepared by a nonaqueous suspension process

Published online by Cambridge University Press:  31 January 2011

Xiaohe Chen  and
Kenneth E. Gonsalves
Xiaohe Chen
Affiliation:
Polymer Science Program at the Institute of Materials Science and Department of Chemistry, University of Connecticut, Storrs, Connecticut 06269
Kenneth E. Gonsalves
Affiliation:
Polymer Science Program at the Institute of Materials Science and Department of Chemistry, University of Connecticut, Storrs, Connecticut 06269
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Abstract

A nanocomposite of a chemically synthesized nanostructured aluminum nitride (AlN) and a polyimide has been studied. Using a nonaqueous polar solvent, N-methylpyrrolidinone (NMP), as the suspension media, the degree of particle agglomeration of AlN was reduced dramatically from micron to nanoscale size. Upon the addition of poly(amic acid) to the AlN/NMP suspension, a further deagglomeration of the particles was observed. The surface physicochemical interactions have been investigated by characteristic model reactions using FTIR spectroscopy. A mechanistic interpretation for the deagglomeration and stabilization behavior is discussed. The formation of the AlN/PI nanocomposite was achieved by the rapid solidification of the precursor suspension followed by compression molding. Such an approach for nanocomposites exhibits better homogeneity with ultrafine fillers and allows a tailorable composition and property at the nanoscale level. Finally, AlN/PI nanocomposites with an increased ceramic loading, up to 65% by volume, were attained and their thermal and mechanical properties, along with the compositional effects, have been investigated.

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Articles
Information
Journal of Materials Research , Volume 12 , Issue 5 , May 1997 , pp. 1274 - 1286
Copyright
Copyright © Materials Research Society 1997

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References

1.Gleiter, H., Adv. Mater. 4, 474 (1992).CrossRefGoogle Scholar
2.Gleiter, H., Nanostruct. Mater. 1, 1 (1992).CrossRefGoogle Scholar
3.Dagani, R., Chem. Eng. News 72 (47), 18 (1992).Google Scholar
4.Siegel, R. W., Nanostruct. Mater. 3, 1 (1993).CrossRefGoogle Scholar
5.Gonsalves, K. E. and Chen, X., “Inorganic Nanostructured Materials,” chapter in The Polymeric Materials Encyclopedia: Synthesis, Properties and Applications, The Polymer Science and Technology Series, edited by Salamone, J. C. (CRC Press, Boca Raton, FL, 1996).Google Scholar
6.Lukehart, C. M., Carpenter, J. P., Milne, S. B., and Burnam, K. J., CHEMTECH 8, 29 (1993).Google Scholar
7. (a) Calvert, P., Mater. Sci. Eng. C1, 69 (1994); (b) J. Burdon, J. Szmania, and P. Calvert, in Molecularly Designed Ultrafine/ Nanostructured Materials, edited by K. E. Gonsalves, G-M. Chow, T. D. Xiao, and R. C. Cammarata (Mater. Res. Soc. Symp. Proc. 351, Pittsburgh, PA, 1994), p. 103; (c) S. Zhang and K. E. Gonsalves, Mater. Sci. Eng. C3, 117 (1995).CrossRefGoogle Scholar
8. (a) Gonsalves, K. E., Carlson, G., Kumar, J., Aranda, F., and José-Yacamán, M., Nanotechnology: Molecularly Designed Materials, edited by Chow, G. M. and Gonsalves, K. E., ACS Symp. Ser. 622, 151 (1996); (b) K. E. Gonsalves, G. Carlson, X. Chen, S. K. Gayen, R. Perez, and M. José-Yacamán, Nanostruc. Mater. 7 (3), 293 (1996).Google Scholar
9. (a) Bloemer, M. J., Haus, J. W., and Ashley, P. R., J. Opt. Soc. Am. 7B, 5, 790 (1990); (b) A. W. Olsen and Z. H. Kafafi, J. Am. Chem. Soc. 113, 20, 7758 (1991).CrossRefGoogle Scholar
10. (a) Messersmith, P. B. and Giannelis, E. P., Chem. Mater. 5, 1064 (1993); (b) ibid. 5, 1694 (1993); (c) T. J. Pinnaviaia, T. Lan, Z. Wang, H. Shi, and P. D. Kaviratna, Nanotechnology: Molecularly Designed Materials, ACS Symp. Ser., edited by G. M. Chow and K. E. Gonsalves, ACS Symp. Ser. 622, 250 (1996).CrossRefGoogle Scholar
11.Pugh, R. J. and Bergström, L., Surface and Colloid Chemistry in Advanced Ceramics Processing, Surfactant Science Series (Marcel Dekker, New York), Vol. 51.Google Scholar
12.Sheppard, L. M., Ceram. Bull. 69 (11), 1801 (1990).Google Scholar
13.Mroz, T. J., Jr., Ceram. Bull. 75 (5), 782 (1992).Google Scholar
14.Dobrynin, A. V., Inorg. Mater. 28 (7), 1063 (1992).Google Scholar
15.Hirano, M. and Yamauchi, N., J. Mater. Sci. 28, 5737 (1993).CrossRefGoogle Scholar
16.Feil, M., Hybrid Circuits 29 (18), 29 (1989).Google Scholar
17.Xiao, T. D., Gonsalves, K. E., and Strutt, P. R., J. Am. Ceram. Soc. 76 (4), 987 (1993).CrossRefGoogle Scholar
18.Xiao, T. D., Gonsalves, K. E., Strutt, P. R., Chow, G. M., and Chen, X., Ceram. Eng. Sci. Proc. 9–10, 1107 (1993).CrossRefGoogle Scholar
19.Chow, G. M., Xiao, T. D., Chen, X., and Gonsalves, K. E., J. Mater. Res. 9, 168 (1994).CrossRefGoogle Scholar
20.Wilson, D., Stezenberger, M. D., and Hergenrother, P., Polyimide (Blackie and Son, Glasgow, 1990).CrossRefGoogle Scholar
21.Mittal, K. L., Polyimides, Synthesis, Characterization, and Application (Plenum Press, New York, 1984).CrossRefGoogle Scholar
22.Chen, X., Gonsalves, K. E., and Chow, G. M., Adv. Mater. 6 (6), 481 (1994).CrossRefGoogle Scholar
23.Li, L. and Chung, D. D. L., J. Elect. Mater. 23 (6), 557 (1994).CrossRefGoogle Scholar
24.Gonsalves, K. E. and Chen, X., Proc. of ACS: PMSE Div. 73, 285 (1995).Google Scholar
25.Baraton, M. I., Chen, X., and Gonsalves, K. E., Nanotechnology: Molecularly Designed Materials, ACS Symp. Ser., edited by Chow, G. M. and Gonsalves, K. E., ACS Symp. Ser. 622, 312 (1996).Google Scholar
26. (a) Collins, A. T., Lightowlers, E. C., and Dean, P. J., Phys. Rev. 158, 833 (1967); (b) L. A. Zhilyakov and A. V. Kostanovskii, High Temp. 30 (2), 226 (1992).CrossRefGoogle Scholar
27.Liu, H., Bertolet, D. C., and Roges, J. W., Jr., Surf. Sci. 320, 145 (1994).CrossRefGoogle Scholar
28.Wang, P. S., Malghan, S. G., and Hsu, S. M., J. Mater. Res. 10, 302 (1995).CrossRefGoogle Scholar
29.Mutsuddy, B. C. and Ford, R. G., Ceramic Injection Molding (Chapman & Hall, London, 1995).Google Scholar
30.Evans, D. Fennell and Wennerstrom, H., The Colloidal Domain: Where Physics, Chemistry, Biology, and Technology Meet (VCH Publishers, New York, 1994), p. 330.Google Scholar
31.Ley, S. V. and Low, C. M. R., Ultrasound in Synthesis (Springer-Verlag, London, 1989).CrossRefGoogle Scholar
32.Hunter, R. J., Foundations of Colloid Science (Oxford Science Publications, 1987), Vol. 1, p. 135.Google Scholar
33.Tadros, T. F., Solid/Liquid Dispersions (Academic Press, New York, 1987), p. 91.Google Scholar
34.Shamlou, P. A. and Hooker, N. T., in Processing of Solid-Liquid Suspensions, edited by Shamlou, P. A. (Butterworth-Heinemann, Boston, MA, 1993), Chap. 1.Google Scholar
35.Ichinose, N., Ozaki, Y., and Kashu, S., Superfine Particle Technology (Springer-Verlag, London, 1992) (translated from Japanese).CrossRefGoogle Scholar
36. BASF intermediates product catalog, technical reference: Nmethylpyrrolidone.Google Scholar
37.Fowkes, F. M., Dwight, D. W., Manson, J. A., Lloyd, T. B., Tishler, D. O., and Shah, B. A., in Adhesion in Solids, edited by Mattox, D. M., Baglin, J. E. E., Gottschall, R. J., and Batich, C. D. (Mater. Res. Soc. Symp. Proc. 119, Pittsburgh, PA, 1988), p. 223.Google Scholar
38.Busca, G., Rossi, P. F., Lorenzelli, V., Benaissa, M., Travert, J., and Lavalley, J. C., J. Phys. Chem. 89, 5433 (1985).CrossRefGoogle Scholar
39.Hirano, M. and Yamauchi, N., J. Mater. Sci. 28, 5737 (1993).CrossRefGoogle Scholar
40.Lin, T., Stickney, K. W., Rogers, M., Riffle, J. S., McGrath, J. E., and Marand, H., Polymer 34 (4), 772 (1993).CrossRefGoogle Scholar
41.Bessonov, M. I. and Zubkov, V. A., Polyamic Acids and Polyimides: Synthesis, Transformations, and Structure (CRC Press, Inc., Boca Raton, FL, 1993), p. 38.Google Scholar
42.Touloukian, Y. S., Kirby, R. K., Taylor, R. E., and Lee, T. Y. R., Thermal Expansion: Nonmetallic Solid, Thermophysical Properties of Matter (Plenum Press, New York, 1973), Vol. 13.Google Scholar
43.Lambert, D. K., Thermal Conductivity, edited by Cremers, C. J. and Fine, H. A. (Plenum Press, New York, 1990), Vol. 21, p. 209.Google Scholar