Published online by Cambridge University Press: 31 January 2011
Dislocation accumulation in gallium-arsenide film, which is deposited on silicon substrate and cooled down from the deposition to room temperature, is examined by crystal plasticity simulation. A new approach to suppression of dislocation accumulation is proposed such that selective growth of the film and partial doping of impurities into it are combined. The results show the possibility to localize the plastic deformation near the film/substrate interface and to keep the surface region of the film almost dislocation-free. Geometry of the selectively grown film and a strategy for partial doping of impurities, which suppresses the dislocation accumulation in the surface region of the film, are considered.