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Study of Stresses in Thin Silicon Wafers with Near-infraredphase Stepping Photoelasticity

Published online by Cambridge University Press:  31 January 2011

Tieyu Zheng  and
Steven Danyluk
Tieyu Zheng
Affiliation:
The George Woodruff Mechanical Engineering School, Georgia Institute of Technology,Atlanta, Georgia 30332
Steven Danyluk
Affiliation:
The George Woodruff Mechanical Engineering School, Georgia Institute of Technology,Atlanta, Georgia 30332
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Abstract

This paper reports on a study of stress in thin silicon plates sectioned from wafers by a near-infrared transmission technique. Phase stepping was incorporated to determine the magnitude and orientation of stress from fractional birefringence fringe images. The anisotropic relative optic-stress coefficient of (100) silicon was determined and the limitation of the stress orientation measurement is discussed.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 1 , January 2002 , pp. 36 - 42
Copyright
Copyright © Materials Research Society 2002

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