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Study of fluoride induced dissimilar metal corrosion in a microelectromechanical system

Published online by Cambridge University Press:  31 January 2011

Jagdish Prasad ,
Oliver M. R. Chyan ,
Jin-Jian Chen ,
Min Liu ,
Ligang Chen  and
Fei Xu
Jagdish Prasad
Affiliation:
Manufacturing Science and Technology Center, Texas Instruments/SEMATECH, Dallas, Texas 75265
Oliver M. R. Chyan*
Affiliation:
Department of Chemistry, University of North Texas, Denton, Texas 76203
Jin-Jian Chen
Affiliation:
Department of Chemistry, University of North Texas, Denton, Texas 76203
Min Liu
Affiliation:
Department of Chemistry, University of North Texas, Denton, Texas 76203
Ligang Chen
Affiliation:
Department of Chemistry, University of North Texas, Denton, Texas 76203
Fei Xu
Affiliation:
Department of Chemistry, University of North Texas, Denton, Texas 76203
*
a)Address all the correspondence to Dr. Oliver Chyan, Tel: (817)565-3463, Fax: (817)565-3463, E-mail: [email protected].
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Abstract

This paper reports a study of microscopic on-chip corrosion on a 17 μm × 17 μm microelectromechanical device. The active atmospheric corrosion occurred only on the Al−Si−Ti components which were connected directly to the TiW components. Adsorbed fluoride ionic species on the microelectromechanical device were found to activate the observed bimetallic corrosion on the Al−Si−Ti/TiW contacts. Water rinse or replacement of TiW by TiAlx completely eliminates the active corrosion. Electrochemical potential data confirm the dissimilar metal corrosion mechanism. Effective prevention of on-chip corrosion was achieved by the judicious design of the device components to avoid dissimilar metal contacts with large galvanic potential differences.

Type
Articles
Information
Journal of Materials Research , Volume 12 , Issue 12 , December 1997 , pp. 3241 - 3245
Copyright
Copyright © Materials Research Society 1997

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References

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