Hostname: page-component-78c5997874-g7gxr Total loading time: 0 Render date: 2024-11-05T15:13:13.817Z Has data issue: false hasContentIssue false
  • English
  • Français

Strong effect of Pd concentration on the soldering reaction between Ni and Sn–Pd alloys

Published online by Cambridge University Press:  31 January 2011

Cheng En Ho ,
Wojciech Gierlotka  and
Sheng Wei Lin
Cheng En Ho*
Affiliation:
Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli City, Taiwan, Republic of China
Wojciech Gierlotka
Affiliation:
Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli City, Taiwan, Republic of China
Sheng Wei Lin
Affiliation:
Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli City, Taiwan, Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

The effect of Pd concentration on the soldering reaction between Ni and Sn–xPd alloys (x = 0–0.5 wt%) was investigated in this study. When the Pd concentration was low (x ≤ 0.05 wt%), the predominant reaction product was a layer of Ni3Sn4. In contrast, an additional (Pd,Ni)Sn4 layer deposited over the Ni3Sn4 in the case of above 0.2 wt%. This microstructure evolution significantly weakened the strength of the interface, deteriorating the reliability of solder joints. A Pd–Ni–Sn isotherm simulated by the CALPHAD method was used to rationalize the above transition in the reaction product(s).

Keywords

SolderingPhase TransformationPhase Equilibria
Type
Materials Communications
Information
Journal of Materials Research , Volume 25 , Issue 11 , November 2010 , pp. 2078 - 2081
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Roberts, H., Johal, K.: Lead-Free Soldering (Springer, New York 2007)221–269CrossRefGoogle Scholar
2.Kim, P.G., Tu, K.N., Abbott, D.C.: Time- and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with Pd/Ni and Au/Pd/Ni thin films. J. Appl. Phys. 84, 770 (1998)CrossRefGoogle Scholar
3.Peng, S.P., Wu, W.H., Ho, C.E., Huang, Y.M.: Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure. J. Alloys Compd. 493, 431 (2010)CrossRefGoogle Scholar
4.Zeng, K., Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R 38, 55 (2002)CrossRefGoogle Scholar
5.Laurila, T., Vuorinen, V., Kivilahti, J.K.: Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng., R 49, 1 (2005)CrossRefGoogle Scholar
6.Ho, C.E., Tsai, R.Y., Lin, Y.L., Kao, C.R.: Effect of Cu concentration on the reactions between Sn–Ag–Cu solders and Ni. J. Electron. Mater. 31, 548 (2002)CrossRefGoogle Scholar
7.Chou, C.Y., Chen, S.W., Chang, Y.S.: Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples. J. Mater. Res. 21, 1849 (2006)CrossRefGoogle Scholar
8.BGA Ball Shear JESD22-B117 (JEDEC Solid State Technology Association Arlington, VA 2006)Google Scholar
9.Ho, C.E., Zheng, R., Luo, G.L., Lin, A.H., Kao, C.R.: Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish. J. Electron. Mater. 29, 1175 (2000)CrossRefGoogle Scholar
10.Yang, S.C., Ho, C.E., Chang, C.W., Kao, C.R.: Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu. J. Mater. Res. 21, 2436 (2006)CrossRefGoogle Scholar
11.Vuorinen, V., Yu, H., Laurila, T., Kivilahti, J.K.: Formation of intermetallic compounds between liquid Sn and CuNix metallizations. J. Electron. Mater. 37, 792 (2008)CrossRefGoogle Scholar
12.ThermoCalc, v. R.: Foundation Computational Thermodynamic (Foundation of Computational Thermodynamics, Stockholm, Sweden 2006)Google Scholar
13.Ghosh, G., Kantner, C., Olson, G.B.: Thermodynamic modeling of the Pd–X (X = Ag, Co, Fe, Ni) systems. J. Phase Equilib. 20, 295 (1999)CrossRefGoogle Scholar
14.Liu, H.S., Wang, J., Jin, Z.P.: Thermodynamic optimization of the Ni–Sn system. Calphad 28, 363 (2004)CrossRefGoogle Scholar
15.Muggianu, Y.M., Gambino, M., Bross, J.P.: Enthalpies of formation of liquid Bi–Sn–Ga alloys at 723 K. J. Chim. Phys. 72, 83 (1975)CrossRefGoogle Scholar