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Strong effect of Pd concentration on the soldering reaction between Ni and Sn–Pd alloys

Published online by Cambridge University Press:  31 January 2011

Cheng En Ho ,
Wojciech Gierlotka  and
Sheng Wei Lin
Cheng En Ho*
Affiliation:
Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli City, Taiwan, Republic of China
Wojciech Gierlotka
Affiliation:
Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli City, Taiwan, Republic of China
Sheng Wei Lin
Affiliation:
Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli City, Taiwan, Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The effect of Pd concentration on the soldering reaction between Ni and Sn–xPd alloys (x = 0–0.5 wt%) was investigated in this study. When the Pd concentration was low (x ≤ 0.05 wt%), the predominant reaction product was a layer of Ni3Sn4. In contrast, an additional (Pd,Ni)Sn4 layer deposited over the Ni3Sn4 in the case of above 0.2 wt%. This microstructure evolution significantly weakened the strength of the interface, deteriorating the reliability of solder joints. A Pd–Ni–Sn isotherm simulated by the CALPHAD method was used to rationalize the above transition in the reaction product(s).

Keywords

SolderingPhase TransformationPhase Equilibria
Type
Materials Communications
Information
Journal of Materials Research , Volume 25 , Issue 11 , November 2010 , pp. 2078 - 2081
Copyright
Copyright © Materials Research Society 2010

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References

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