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Strain Rate Sensitivity of a Nanocrystalline Cu–Ni–P Alloy

Published online by Cambridge University Press:  03 March 2011

J. Chen ,
Y.N. Shi  and
K. Lu
J. Chen
Affiliation:
Shenyang National Laboratory for Materials Science (SYNL), Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
Y.N. Shi
Affiliation:
Shenyang National Laboratory for Materials Science (SYNL), Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
K. Lu
Affiliation:
Shenyang National Laboratory for Materials Science (SYNL), Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
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Abstract

Nanoindentation technique was used to measure the strain rate sensitivity (m) of a nanocrystalline Cu-Ni-P alloy prepared by means of electrodeposition. The m value decreases from 0.034 to 0.018 when the nominal grain size increases from 7 nm to 33 nm. Both m values of the alloy are obviously lower than those of the pure Cu with similar grain size, implying that P segregation at grain boundaries might play a key role in retarding grain boundary activities as compared to pure Cu samples.

Keywords

DislocationsMechanical propertiesNanoindentation
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 11 , November 2005 , pp. 2955 - 2959
Copyright
Copyright © Materials Research Society 2005

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